• Proceedings of the IEEK Conference
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• 2000.06b
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• pp.310-313
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• 2000

In this study, the Au/Ni and Au/Ni/Si/Ni layers prepared by electron beam evaporation were used to form ohmic contacts on p-type GaN. Before rapid thermal annealing, the current-voltage(I-V) characteristic of Au/Ni and Au/Ni/Si/Ni contact on p-type GaN film shows non-ohmic behavior. A Specific contact resistance as 3.4$\times$10$^{-4}$ Ω-$\textrm{cm}^2$ was obtained after 45$0^{\circ}C$-RTA. The Schottky barrier height reduction may be attributed to the presence of Ga-Ni and Ga-Au compounds, such as Ga$_4$Ni$_3$, Ga$_4$Ni$_3$, and GaAu$_2$ at the metal - semiconductor interface. The mixing behaviors of both Ni and Au have been studied by using X-ray photoelectron spectroscopy. In addition, X-ray diffraction measurements indicate that the Ni$_3$N, NiGa$_4$, Ni$_2$Si, and Ni$_3$Si$_2$ Compounds were formed at the metal-semiconductor interface.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.34D no.3
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• pp.52-59
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• 1997

Design and performance of principal four ICs for the 10-Gb/s optical communication system are presented. AlGaAs/GaAs HBTs are basic devices to implement a laser diode driver, apre-amplifier, and a limiting amplifier, and GaInP/GaAs HBTs are used for an AGC amplifier. We fbricated 11.5-GHz LD driver, a pre-amplifier, and a limiting amplifier, an dGaInP/GaAs HBTs are used for an AGC amplifier. We fabricated LD deriver, 10.5 GHz pre amplifier, 7.2 GHz AGC amplifier, and 10.3 GHz limiting amplifier, optimized circuit design and the stabilized MMIC fabrication process.

• Proceedings of the Materials Research Society of Korea Conference
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• 2005.05a
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• pp.73-73
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• 2005

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.20 no.1
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• pp.135-140
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• 2020

Recently, due to the rapid diffusion of intelligent systems and IoT technologies, power saving techniques in real-time embedded systems has become important. In this paper, we propose P-GA (Parallel Genetic Algorithm), a scheduling algorithm aims at reducing the power consumption of real-time systems in multi-core hybrid memory environments. P-GA improves the Proportional-Fairness (PF) algorithm devised for multi-core environments by combining the dynamic voltage/frequency scaling of the processor with the nonvolatile memory technologies. Specifically, P-GA applies genetic algorithms for optimizing the voltage and frequency modes of processors and the memory types, thereby minimizing the power consumptions of the task set. Simulation experiments show that the power consumption of P-GA is reduced by 2.85 times compared to the conventional schemes.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07a
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• pp.361-365
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• 2003

Planar Inductively Coupled Plasma (PICP) etching of InGaP was performed in $BCl_3,\;BCl_3/Ar\;and\;BCl_3/Ne$ plasmas as a function of ICP source power ($0\;{\sim}\;500\;W$), RIE chuck power ($0\;{\sim}\;150\;W$), chamber pressure ($5\;{\sim}\;15\;mTorr$) and gas composition of $BCl_3/Ar\;and\;BCl_3/Ne$. Total gas flow was fixed at 20 sccm (standard cubic centimeter per minute). Increase of ICP source power and RIE chuck power raised etch rate of InGaP, while that of chamber pressure reduced etch rate. We also found that some addition of Ar and Ne in $BCl_3$ plasma improved etch rate of InGaP. InGaP etch rate was varied from $1580\;{\AA}/min$ with pure $BC_3\;to\;2800\;{\AA}/min$ and $4700\;{\AA}/min$ with 25 % Ar and Ne addition, respectively. Other process conditions were fixed at 300 W ICP source power, 100 W RIE chuck power and 7.5 mTorr chamber pressure. SEM (scanning electron microscopy) and AFM (atomic force microscopy) data showed vertical side wall and smooth surface of InGaP at the same condition. Proper addition of noble gases Ar and Ne (less than about 50 %) in $BCl_3$ inductively coupled plasma have resulted in not only increase of etch rate but also minimum preferential loss and smooth surface morphology by ion-assisted effect.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.426-426
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• 2012

본 연구에서는 GaAs p-i-n 접합 구조에 InAs 양자점을 삽입한 양자점 태양전지(Quantum Dot Solar Cell; QDSC)의 내부 전기장(internal electric field)을 조사하기 위하여 Photoreflectance (PR) 방법을 이용하였다. QDSC 구조는 GaAs p-i-n 구조의 공핍층 내에 8주기의 InAs 양자점 층을 삽입하였으며 각 양자점 층은 40 nm 두께의 i-GaAs로 분리하였다. InAs/GaAs QDSC는 분자선박막 성장장치(molecular beam epitaxy; MBE)를 이용하여 성장하였다. 이 때 양자점의 형성은 InAs 2.0 ML(monolayer)를 기판온도 $470^{\circ}C$에서 증착하였다. QDSC 구조에서 여기광원의 세기에 따른 전기장의 변화를 조사하였다. 아울러 양자점 층 사이의 i-GaAs 층 내에 6.0 nm의 AlGaAs 퍼텐셜 장벽(potential barrier)을 삽입하여 퍼텐셜 장벽 유무에 따른 전기장 변화를 조사하였다. PR 측정에서 여기광원으로는 633 nm의 He-Ne 레이저를 이용하였으며 여기광의 세기는 $2mW/cm^2$에서 $90mW/cm^2$까지 변화를 주어 여기광세기 의존성실험을 수행하였다. 여기광의 세기가 증가할수록 photovoltaic effect에 의한 내부 전기장의 변화를 관측할 수 있었다. PR 결과로부터 p-i-n 구조의 p-i 영역과 i-n 접합 계면의 junction field를 검출하였다. p-i-n의 i-영역에 양자점을 삽입한 경우 PR 신호에서 Franz-Keldysh oscillation (FKO)의 주파수가 p-i-n 구조와 비교하여 변조됨을 관측하였다. 이러한 FKO 주파수성분은 fast Fourier transform (FFT)을 이용하여 검출하였다. FKO의 주파수 성분들은 고전기장하에서 electron-heavyhole (e-hh)과 electron-lighthole (e-lh) 전이에 의해 나타나는 성분으로 확인되었다.

• Korean Journal of Materials Research
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• v.5 no.8
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• pp.936-944
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• 1995

The effects of Spinodal decomposition induced phase separated microstructure of InGaAsP/InP heterostructure on photoluminescence(PL) intensity and FWHM(full-width at half maximum) were investigated in this study. Lattice mismatches were measured by double crystal x-ray diffractometer, and the microstructures of phase separated InGaAsP were observed by transmission electron microscopy. It was found that the misfit stress calculated from lattice mismatch was related to the periodicity of Spinodal modulation. Strong dependence of PL intensity and FWHM on the modulation periodicity was also found. For systematic understanding of these observations, the interaction elastic strain energy function induced by misfit stress was proposed. The calculation illustrated that the microstructure of the epilayer such as Spinodal decomposition played an important role in determining the optoelectronic properties such as PL intensity and PL FWHM.

• Journal of the Korean Vacuum Society
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• v.7 no.3
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• pp.187-194
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• 1998

InGaAsP epitaxial layers lattice matched to InP were grown at 600 and $620^{\circ}C$ by low pressure metalorganic chemical vapor deposition. Solid phase composition of group III was controlled by the diffusion flux gas phase to the reachion surface. For the case of group V, the difference of As and P vapor pressure and pyrolysis efficiency of $PH_3$and $AsH_3$ mainly determined their in corporation into solid. An abnormal behavior of peak energy shift was observed below 75K in temperature variant photoluminescence study. This abnormal behavior was explained by the difference in order of ordering which makes spatial variation of energy gap in InGaAsP layer and this explanation was supported by the analyses of transmission electron microscopy and transmission spectroscopy.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1995.11a
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• pp.77-80
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• 1995

GaSb crystals were grown by the vertical Bridgman method. P-type GaSb crystals were grown with Ga:Sb=1:1 at % ratio without dopants and with Te, respectively. Also, GaSb:Te crystals were investigated. Lattice constants were 6.117${\AA}$ for p-type. The carrier concentration, the resistivity, and the carrier mobility measured by the van der Pauw method were p≡8 x $10^{16}$$cm^{-3}$, p≡0.20$\Omega$-cm, ${\mu}$$_{n}$≡$400\textrm{cm}^2$$V^{-1}$$sec^{-1}$ for p-type, n≡1 x $10^{17}$$cm^{-3}$, p≡0.15 $\Omega$-cm, ${\mu}$$_{n}$≡$500\textrm{cm}^2$$V^{-1}$$sec^{-1}$ for n-type at 300K. In case of treating with metal ion of $Ru^{+3}$, $Pt^{+1}$, p≡2 x $10^{17}$$cm^{-3}$, p≡0.08$\Omega$-cm, ${\mu}$$_{n}$≡420$\textrm{cm}^2$$V^{-1}$$sec^{-1}$ for p-type, n≡2.5 x $10^{17}$$cm^{-13}$, p≡0.07 $\Omega$-cm, ${\mu}$$_{n}$≡520$\textrm{cm}^2$$V^{-1}$$sec^{-1}$ for n-type were obtained.

• Proceedings of the Korean Vacuum Society Conference
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• 1999.07a
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• pp.249-249
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• 1999

GaN과 같은 III-nitride 반도체 관한 식각 기술의 연구는 blue-emitting laser diode(LD)를 위한 경면(mirror facet)의 형성뿐만아니라 새로운 display 용도의 light emitting diodes (LED), 고온에서 작동되는 광전소자 제조 등에도 그 중요성이 증대되고 있다. 최근에는 III-nitride 물질의 높은 식각속도와 미려하고 수직한 식각형상을 이루기 위하여 ECR(Electron Cyclotron Resonance)이나 ICP(Inductively Coupled Plasma)와 같은 고밀도 플라즈마 식각과 CAIBE(Chemically assisted ion beam etching)를 이용한 연구가 진행되고 있다. 현재 제조되어 지고 있는 LED 및 LD와 같은 광소자의 구조의 대부분은 p-GaN/AlGaN/InGaN(Q.W)/AlGaN/n-GaN 와 같은 여러 층의 형태로 이루어져 있다. 이중 InGaN는 광소자나 전자소자의 특성에 영향을 주는 가장 중요한 부분으로써 현재까지 보고된 식각연구는 undoped GaN에 대부분 집중되고 있고 이에 비해 소자 특성에 핵심을 이루는 InGaN의 식각특성에 관한 연구는 미흡한 상황이다. 본 연구에서는 고밀도 플라즈마원인 ICP 장비를 이용하여 InGaN를 식각하였고, 식각에는 Cl2/CH4, Cl2/Ar 플라즈마를 사용하였다. InGaN의 식각특성에 영향을 미치는 플라즈마의 특성을 관찰하기 위하여 quadrupole mass spectrometry(QMS)와 optical emission spectroscopy(PES)를 사용하였다. 기판 온도는 5$0^{\circ}C$, 공정 압력은 5,Torr에서 30mTorr로 변화시켰고 inductive power는 200~800watt, bias voltage는 0~-200voltage로 변화시켰으며 식각마스크로는 SiO2를 patterning 하여 사용하였다. n-GaN, p-GaN 층 이외에 광소자 제조시 필수적인 InGaN 층을 100% Cl2로 식각한 경우에 InGaN의 식각속도가 GaN에 비해 매우 낮은 식각속도를 보였다. Cl2 gas에 소량의 CH4나 Ar gas를 첨가하는 경우와 공정압력을 감소시키는 경우 식각속도는 증가하였고, Cl2/10%Ar 플라즈마에서 공정 압력을 감소시키는 경우 식각속도는 증가하였고, Cl2/10%CHF3 와 Cl2/10%Ar 플라즈마에서 공정압력을 15mTorr로 감소시키는 경우 InGaN과 GaNrks의 선택적인 식각이 가능하였다. InGaN의 식각속도는 Cl2/Ar 플라즈마의 이온에 의한 Cl2/CHF3(CH4) 플라즈마에서의 CHx radical 형성에 의하여 증가하는 것으로 사료되어 진다.