• Transactions of the Korean Society of Automotive Engineers
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• v.16 no.5
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• pp.113-118
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• 2008

We have developed an integrated giant magneto resistance using not only circuit but also integrating technique with semiconductor for automobile application. It has four elements used for giant magneto resistance sensor. Ni-Fe/Cu multi layers were prepared on a glass substrate by magnetron sputtering. The dependence of magneto resistance on the thickness of the Ni-Fe and Cu layers was investigated. The MR ratio showed a saturated a peak at Cu layer $10{\AA}$, Ni-Fe layer $50{\AA}$, where the MR ratio is about 8.7% at room temperature. By means of Ni-Fe multi film and specific integrating technique, these new giant magneto resistance sensor showed excellent resistance characteristics.

• Journal of the Korean Society for Nondestructive Testing
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• v.36 no.6
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• pp.483-489
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• 2016

The typical methods used for inspecting ferromagnetic pipes include the ultrasonic testing (UT) contact method and the following non-contact methods: magnetic flux leakage (MFL), electromagnetic acoustic transducers (EMAT), and remote field eddy current testing (RFECT). Among these methods, the RFECT method has the advantage of being able to establish a system smaller than the diameter of a pipe. However, the method has several disadvantages as well, including different sensitivities and difficult-to-repair coil sensors which comprise its array system. Therefore, a giant magneto-resistance (GMR) sensor was applied to address these issues. The GMR sensor is small, easy to replace, and has uniform sensitivity. In this experiment, the GMR sensor was used to measure remote field and defect signal characteristics (in the axial and radial directions) in a ferromagnetic pipe. These characteristics were measured in an effort to investigate standard defects at changing depths within a pipe. The results show that the experiment successfully demonstrated the applicability of the GMR sensor to RFECT signal detection in ferromagnetic pipe.

• JSTS:Journal of Semiconductor Technology and Science
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• v.2 no.3
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• pp.197-204
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• 2002

DRAM, SRAM, and FLASH memory are three major memory devices currently used in most electronic applications. But, they have very distinct attributes, therefore, each memory could be used only for limited applications. MRAM (Magneto-resistive Random Access Memory) is a promising candidate for a universal memory that meets all application needs with non-volatile, fast operational speed, and low power consumption. The simplest architecture of MRAM cell is a series of MTJ (Magnetic Tunnel Junction) as a data storage part and MOS transistor as a data selection part. To be a commercially competitive memory device, scalability is an important factor as well. This paper is testing the actual electrical parameters and the scaling factors to limit MRAM technology in the semiconductor based memory device by an actual integration of MRAM core cell. Electrical tuning of MOS/MTJ, and control of resistance are important factors for data sensing, and control of magnetic switching for data writing.

• Journal of the Korean Magnetics Society
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• v.18 no.4
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• pp.154-158
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• 2008

Magnetite($Fe_3O_4$) is currently one of key materials for applications in magnetic storage and many bioinspired applications because bulk $Fe_3O_4$ has a high Curie temperature($Tc={\sim}850K$) and nearly full spin polarization at room temperature(RT). In this work, $Fe_3O_4$ nanoparticles with different sizes of 12 to 15 nm were prepared in a well-controlled manner by a nonhydrolytic synthetic method. Here, we report the significant intergrain magneto-resistance(MR) of ${\sim}2%$ at RT in $Fe_3O_4$ nanoparticle pellets. The tunneling conductance was also investigated based on the Brinkman model, as well. Our results show clearly that the surface or interfacial property of the particles plays a crucial role in the MR effect.

• Journal of Magnetics
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• v.7 no.3
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• pp.101-105
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• 2002

MRAM (Magnetoresistive Random Access Memory) is a promising candidate for a universal memory that meets all application needs with non-volatile, fast operational speed, and low power consumption. The simplest architecture of MRAM cell is a series of MTJ (Magnetic Tunnel Junction) as a data storage part and MOS transistor as a data selection part. This paper is for testing the actual electrical parameters to adopt MRAM technology in the semiconductor based memory device. The discussed topics are an actual integration of MRAM core cell and its properties such as electrical tuning of MOS/MTJ for data sensing and control of magnetic switching for data writing. It will be also tested that limits of the MRAM technology for a high density memory.

• Journal of the Korean Magnetics Society
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• v.20 no.3
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• pp.89-93
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• 2010

We study the giant magneto-resistance (GMR), coercivity and their dependence on the ferromagnetic layers adjacent to the nonmagnetic layer in a spin-valve structure, [Pd/ferromagnetic] multilayers with perpendicular anisotropy. We fabricated a basic spinvalve structure of $[Pd/Co]_2$/ferro-magnetic layer/nonmagnet/ferro-magnetic layer/$[Pd/Co]_2$/FeMn and investigated the dependence of its GMR and magnetic properties such ad coercivity on the ferromagnetic material to reduce the coercivity of the free layer. We try to reduce the freelayer coercivity by controlled the anisotropy, we insert the material NiFe, $Co_8Fe_2$, $Co_9Fe_1$ to ferromagnetic layers adjacent to the Cu layer. Then, we have been able to reduce the coercivity as low as 100 Oe, and also achieved 6.7% of magneto-resistance ratio when the ferromagnetic layer thickness was 0,7 nm.