• The Transactions of The Korean Institute of Electrical Engineers
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• v.59 no.1
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• pp.108-112
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• 2010

Design of experiment (DOE) method is employed for a systematic and highly efficient optimization of Ga-doped ZnO thin films synthesized by pulsed laser deposition (PLD) process. We sequentially adopted fractional-factorial design (FD) and central composite design (CCD) of the DOE methods. In fractional-FD stage, significant factors to make conductive electrode are found to target-substrate (T-S) distance and oxygen partial pressure. Moreover, correlation among the process factors is elucidated using surface profile modeling. Electrical properties of the GZO films grown on a glass substrate had been optimized to find that the lowest electrical resistivity of about $1.8'10^{-4}Wcm$ which was acquired with the T-S distance and the oxygen pressure of 4 cm and 7 mTorr, respectively. During the DOE-fueled optimization process, the transparency of the GZO films is ensured higher than 85 %.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.32 no.4
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• pp.255-265
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• 2008

This paper presents the optimization process of evaporator for a vapor compression cooling system for high heat flux CPU. The CPU thermal capacity was given by 300W. Evaporating temperature and mass flow rate were $18^{\circ}C$ and 0.00182kg/s respectively. R134a was used as a working fluid. Channel width(CW) and height(CH) were selected as design factors. And thermal resistance, surface temperature of CPU, degree of superheat, and pressure drop were taken as objective responses. Fractional factorial DOE was used in screening phase and RSM(Response Surface Method) was used in optimization phase. As a result, CW of 2.5mm, CH of 2.5mm, and CL of 484mm were taken as an optimum geometry. Surface temperature of CPU and thermal resistance were $33^{\circ}C\;and\;0.0502^{\circ}C/W$ respectively. Thermal resistance of evaporator designed in this study was significantly lower than that of other cooling systems such as water cooling system and thermosyphon system. It was found that the evaporator considered in this work can be a excellent candidate for a high heat flux CPU cooling system.

• Journal of Soil and Groundwater Environment
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• v.12 no.5
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• pp.73-85
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• 2007

In this study, the experiment of solid-phase microextraction (SPME) technique using GC/FID was conducted as a possible alternative to liquid-liquid extraction for the analysis of EGBE, DGBE, DBM and TGME in water, and also, an optimization condition of trace analysis for disel oxygenates including EGBE by the design of experiment (DOE) was described. Experiments used a fractional factorial design method followed by central composite design allowing optimization of a number of factors as well as statistical analysis of the results. The response surface analysis showed that the extraction efficiency could be represented by a second-order polynomial equation in which the salts concentration, extraction temperature, extraction time and sonication time are the major influences. Using DOE method, a new datadependent method was developed to improve the quantity of confidently analyzed disel oxygenates in water samples.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.8
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• pp.720-725
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• 2007

This study investigated the pressing conditions in the molding of aspheric glass lenses for the mega pixel phone camera module using the DOE method. Tungsten carbide (WC; Japan, Everloy Co., 002K),which contained 0.5 w% cobalt (Co), was used to build the mold. The mold surface was ultra-precision ground and polished, and its form accuracy (PV) was 0.85um in aspheric surface. We selected four factors, pressing temperature, force and time of first step, and force of second step, respectively, as the parameters of the pressing process. in order to reduce the number of experiments, we applied fractional factorial design considering the main effects and two-way interactions. The analysis results indicate that the only two main effects, the pressing temperature and the time of pressing step 1, are available for the form accuracy (PV) of the molded lens. The analysis results indicated that the best combination of the factors for lowering the form accuracy(PV) value of molded lens was to have them at their low levels.

• Corrosion Science and Technology
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• v.12 no.3
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• pp.132-141
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• 2013

This work is concerning a methodology of Ni-base superalloy development for a very high temperature gas-cooled reactor(VHTR) using design of experiments(DOE) and thermodynamic calculations. Total 32 sets of the Ni-base superalloys with various chemical compositions were formulated based on a fractional factorial design of DOE, and the thermodynamic stability of topologically close-packed(TCP) phases of those alloys was calculated by using the THERMO-CALC software. From the statistical evaluation of the effect of the chemical composition on the formation of TCP phase up to a temperature of 950 oC, which should be suppressed for prolonged service life when it used as the structural components of VHTR, 16 sets were selected for further calculation of the mechanical properties. Considering the yield and ultimate tensile strengths of the selected alloys estimated by using the JMATPRO software, the optimized chemical composition of the alloys for VHTR application, especially intermediate heat exchanger, was proposed for a succeeding experimental study.

• Proceedings of the SAREK Conference
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• 2009.06a
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• pp.1226-1231
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• 2009

This paper presents operating characteristics of internal heat exchanger(IHX) for $CO_2$ geothermal heat pump in the heating mode. Mass flow rate of $CO_2$, inlet temperatures of $CO_2$ at high and low pressure side were selected as main effect factors by using fractional factorial DOE(Design of Experiments). And RSM(Response Surface Method) was used in optimization phase. The results show that heat transfer rate of IHX increases when either inlet temperature of low pressure side decreases or inlet temperature of high pressure side increases. Effectiveness of IHX increases with increasing of inlet temperature of either high pressure side or low pressure side. Finally, performance contour map was provided over the operation ranges of the main design factors.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.57-57
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• 2007

Aspheric glass lenses have many optical advantages, for glass have superior optical performance and an aspheric form can reduce optical aberrations. Recently, the use of it is rapidly expanding as the mass production becomes possible by glass molding press and so this method is considered as the best method for fabricating an aspheric glass lens, but it is difficult to control many parameters for pressing and cooling process. Design of experiments (DOE) is a very useful tool to design and analyze complicated industrial design problems. This study investigated the pressing conditions to mold aspheric glass lenses for mega pixel phone camera module using DOE method. We have applied fractional factorial design and the response variable was set form accuracy (PV) of aspheric surface of molded lens. The results of analysis indicates that all factors expect for pressing force of each step are available for the form accuracy (PV). It was the optimum condition of the designed pressing conditions for lowering the form accuracy(PV) value of molded lens that all factors were at the low level. The form accuracy (PV) of mold and molded lens under the optimum condition are $0.85\;{\mu}m$ and $0.922\;{\mu}m$ respectively.

• Analytical Science and Technology
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• v.20 no.5
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• pp.370-382
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• 2007

In this study, solid-phase microextraction (SPME) technique using GC/FID was studied as a possible alternative to liquid-liquid extraction for the analysis of EGBE, DGBE, DBM and TGME in water, and an optimization condition of trace analysis of EGBE, DGBE, DBM and TGME using the factorial design was described. Experiments used a fractional factorial design method followed by central composite design allowing optimization of a number of factors as well as statical analysis of results. The response surface analysis showed that the extraction efficiency can be described by a second-order polynomial equation in which the salts concentration, extraction temperature, extraction time and sonication time are the major influences. Using DOE, a new data-dependent method was developed that improved the quantity of confidently analyzed EGBE, DGBE, DBM and TGME in water samples.

• Transactions on Electrical and Electronic Materials
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• v.12 no.2
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• pp.56-59
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• 2011

The characterization of the chemical mechanical polishing (CMP) process for undensified phophosilicate glass (PSG) film is reported using design of experiments (DOE). DOE has been used by experimenters to understand the relationship between the input variables and responses of interest in a simple and efficient way, and it typically is beneficial for determining the appropriatesize of experiments with multiple process variables and making statistical inferences for the responses of interest. The equipment controllable parameters used to operate the machine consist of the down force of the wafer carrier, pressure on the back side wafer, table and spindle speeds (SS), slurry flow (SF) rate, pad condition, etc. None of these are independent ofeach other and, thus, the interaction between the parameters also needs to be understoodfor improved process characterization in CMP. In this study, we selected the five controllable equipment parameters the most recommendedby process engineers, viz. the down force (DF), back pressure (BP), table speed (TS), SS, and SF, for the characterization of the CMP process with respect to the material removal rate and film uniformity in percentage terms. The polished material is undensified PSG which is widely used for the plananization of multi-layered metal interconnects. By statistical modeling and the analysis of the metrology data acquired from a series of $2^{5-1}$ fractional factorial designs with two center points, we showed that the DF, BP and TS have the greatest effect on both the removal rate and film uniformity, as expected. It is revealed that the film uniformity of the polished PSG film contains two and three-way interactions. Therefore, one can easily infer that process control based on a better understanding of the process is the key to success in current semiconductor manufacturing, in which the size of the wafer is approaching 300 mm and is scheduled to continuously increase up to 450 mm in or slightly after 2012.

• Transactions on Electrical and Electronic Materials
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• v.12 no.3
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• pp.115-118
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• 2011

Process characterization of the chemical mechanical polishing (CMP) process for undensified phosphosilicate glass (PSG) film is reported using design of experiments (DOE). DOE has been addressed to experimenters to understand the relationship between input variables and responses of interest in a simple and efficient way. It is typically beneficial for determining the adequate size of experiments with multiple process variables and making statistical inferences for the responses of interests. Equipment controllable parameters to operate the machine include the down force (DF) of the wafer carrier, pressure on the backside of the wafer, table and spindle speed (SS), slurry flow rate, and pad condition. None of them is independent; thus, the interaction between parameters also needs to be indicated to improve process characterization in CMP. In this paper, we have selected the five controllable equipment parameters, such as DF, back pressure (BP), table speed (TS), SS, and slurry flow (SF), most process engineers recommend to characterize the CMP process with respect to material removal rate (RR) and film uniformity as a percentage. The polished material is undensified PSG. PSG is widely used for the plananization in multi-layered metal interconnects. We identify the main effect of DF, BP, and TS on both RR and film uniformity, as expected, by the statistical modeling and analysis on the metrology data acquired from a series of $2^{5-1}$ fractional factorial design with two center points. This revealed the film uniformity of the polished PSG film contains two and three-way interactions. Therefore, one can easily infer that the process control based on better understanding of the process is the key to success in semiconductor manufacturing, typically when the wafer size reaches 300 mm and is continuously scheduled to expand up to 450 mm in or little after 2012.