• Applied Microscopy
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• 제45권4호
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• pp.195-198
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• 2015

Gas-assisted etching (GAE) with focused ion beam (FIB) was applied to prepare plan-view specimens of Cu thin-layer on a silicon substrate for transmission electron microscopy (TEM). GAE using $XeF_2$ gas selectively etched the silicon substrate without volume loss of the Cu thin-layer. The plan-view specimen of the Cu thin film prepared by FIB milling with GAE was observed by scanning electron microscopy and $C_S$-corrected high-resolution TEM to estimate the size and microstructure of the TEM specimen. The GAE with FIB technique overcame various artifacts of conventional FIB milling technique such as bending, shrinking and non-uniform thickness of the TEM specimens. The Cu thin film was uniform in thickness and relatively larger in size despite of the thickness of <200 nm.

• Applied Microscopy
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• 제41권3호
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• pp.147-154
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• 2011

후방산란전자(BSE)는 입사전자빔이 시료와 충돌하면서 발생한다. BSE 이미징은 시료의 화학적 특성을 구분할 수 있는 조성대비를 제공한다. 집속이온빔장치(FIB)는 전계방사형 주사전자현미경(FESEM)과 결합할 수 있으므로 이중빔 체계(FIB-FESEM)가 구현된다. 갈륨(Ga) 이온빔으로 10~100 nm 두께로 시료를 절삭할 수 있으므로 FIB-FESEM은 플라스틱으로 포매된 블록의 면을 z축 고해상도를 유지하며 연속적으로 이미징할 수 있다. BSE이미지의 대비를 반전시키면 투과전자현미경의 이미지와 유사하다. 연속블록면 이미징의 또 다른 방안으로써 특수한 초박절편기가 FESEM 내부에 장착된 것이 $3View^{(R)}$로 상용화되어 있다. 이로써 플라스틱으로 포매된 시료의 내부 구조를 넓은 면적을 연속적으로 이미징 할 수 있으므로 3차원 재구성도 용이하게 된다. 이러한 FESEM에 기반한 두 가지 방식은 복잡한 생물계의 총체적인 이해를 위하여 세포 및 세포 수준 이하의 구조물 간의 공간적 연관성을 규명하는 데 활용될 수 있다.

• Applied Microscopy
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• 제39권4호
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• pp.349-354
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• 2009

TFT-LCD의 구조불량이 발생한 박막 트랜지스터에 대해서 집속이온빔 가공장치(Dual-beam FIB/SEM)를 이용하여 연속절편법(Serial sectioning)과 일련의 연속적인 2차원 주사전자현미경 이미지를 얻었고, IMOD 소프트웨어를 통해서 3차원 구조구현(3D reconstruction) 연구를 하였다. 3차원 구조구현 결과, Gate막과 Data막이 접합되어 있는 불량이 관찰되었다. 두 막이 접합되어서 ON/OFF 역할을 하는 Gate의 기능이 상실되었고, Data신호는 Drain을 통해서 투명전극에 전류를 공급하여 계속 빛나는 선 불량(line defect)이 발생한 것으로 판단된다. 이 논문의 결과인 집속이온빔 가공장치(Dual-Beam FIB/SEM)를 이용한 3차원 구조구현 연구와 연속절편법, 주사전자현미경 이미지작업, 이미지 프로세싱에 대한 결과는 향후 연구의 기초자료로 활용될 수 있을 것으로 판단된다.

• 한국전기전자재료학회논문지
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• 제27권11호
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• pp.679-685
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• 2014

For the measurements of surface shape milled using FIB (focused ion beam), the silicon bulk, $Si_3N_4/Si$, and Al/Si samples are used and observed the shapes milled from different sputtering rates, incident angles of $Ga^+$ ions bombardment, beam current, and target material. These conditions also can be influenced the sputtering rate, raster image, and milled shape. The fundamental ion-solid interactions of FIB milling are discussed and explained using TRIM programs (SRIM, TC, and T-dyn). The damaged layers caused by bombarding of $Ga^+$ ions were observed on the surface of target materials. The simulated results were shown a little bit deviation with the experimental data due to relatively small sputtering rate on the sample surface. The simulation results showed about 10.6% tolerance from the measured data at 200 pA. On the other hand, the improved analytical model of damaged layer was matched well with experimental XTEM (cross-sectional transmission electron microscopy) data.

• International Journal of Korean Welding Society
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• 제3권2호
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• pp.29-39
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• 2003

The durability and reliability of thermal barrier coatings (TBCs) play an important role in the service reliability, availability and maintainability (RAM) of hot­section components in advanced turbine engines for aero and utility applications. Photostimulated luminescence spectroscopy (PSLS) and electrochemical impedance spectroscopy (EIS) are being concurrently developed as complimentary non­destructive evaluation (NDE) techniques for quality control and life­remain assessment of TBCs. This paper overviews the governing principles and applications of the luminescence and the impedance examined in the light of residual stress, phase constituents and resistance (or capacitance) in TBC constituents including the thermally grown oxide (TGO) scale. Results from NDE by PSLS and EIS are discussed and related to the microstructural development during high temperature thermal cycling, examined by using a variety of microscopic techniques including focused ion beam (FIB) in­situ lift­out (INLO), transmission and scanning transmission electron microscopy (TEM and STEM).

• Applied Microscopy
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• 제46권4호
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• pp.171-175
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• 2016

A distinctive neuronal network in the brain is believed to make us unique individuals. Electron microscopy is a valuable tool for examining ultrastructural characteristics of neurons, synapses, and subcellular organelles. A recent technological breakthrough in volume electron microscopy allows large-scale circuit reconstruction of the nervous system with unprecedented detail. Serial-section electron microscopy-previously the domain of specialists-became automated with the advent of innovative systems such as the focused ion beam and serial block-face scanning electron microscopes and the automated tape-collecting ultramicrotome. Further advances in microscopic design and instrumentation are also available, which allow the reconstruction of unprecedentedly large volumes of brain tissue at high speed. The recent introduction of correlative light and electron microscopy will help to identify specific neural circuits associated with behavioral characteristics and revolutionize our understanding of how the brain works.

• Applied Microscopy
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• 제50권
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• pp.24.1-24.11
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• 2020

The development of the femtosecond laser (fs laser) with its ability to provide extremely rapid athermal ablation of materials has initiated a renaissance in materials science. Sample milling rates for the fs laser are orders of magnitude greater than that of traditional focused ion beam (FIB) sources currently used. In combination with minimal surface post-processing requirements, this technology is proving to be a game changer for materials research. The development of a femtosecond laser attached to a focused ion beam scanning electron microscope (LaserFIB) enables numerous new capabilities, including access to deeply buried structures as well as the production of extremely large trenches, cross sections, pillars and TEM H-bars, all while preserving microstructure and avoiding or reducing FIB polishing. Several high impact applications are now possible due to this technology in the fields of crystallography, electronics, mechanical engineering, battery research and materials sample preparation. This review article summarizes the current opportunities for this new technology focusing on the materials science megatrends of engineering materials, energy materials and electronics.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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• pp.564-564
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• 2012

Graphene has been emerged as a fascinating material for future nanoelectronic applications due to its extraordinally electronic properties. However, their zero-bandgap semimetallic nature is a major problem for applications in high performance field-effect transistors (FETs). Graphene nanoribbons (GNRs) with narrow widths (${\geq}10nm$) exhibit semiconducting behavior, which can be used to overcome this problem. In previous reports, GNRs were produced by several approaches, such as electron beam lithography patterning, chemically derived GNRs, longitudinal unzipping of carbon nanotubes, and inorganic nanowire template. Using these methods, however, the width distribution of GNRs was a quiet broad and substantial defects were inevitably occurred. Here, we report a novel approach for fabricating width-tailored GNRs by focused ion beam-assisted chemical vapor deposition (FIB-CVD). Width-tailored phenanthrene ($C_{14}H_{10}$) templates for direct growth of GNRs were prepared on $SiO_2$/Si substrate by FIB-CVD. The GNRs on the templates were synthesized at $900-1,050^{\circ}C$ with introducing $CH_4$ $(20sccm)/H_2$ (10 sccm) mixture gas for 10-300 min. Structural characterizations of the GNRs were carried out using Raman spectroscopy, scanning electron microscopy, and atomic force microscopy.

• 한국전자현미경학회:학술대회논문집
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• 한국현미경학회 2001년도 제32차 추계학술대회
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• pp.18-22
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• 2001

A technique to characterize specific site of materials using a combination of a dedicated focused ion beam system(FIB), and Intermediate-voltage scanning transmission electron microscope(STEM) or transmission electron microscope(TEM) equipped with a scanning electron microscope(SEM) unit has been developed. The FIB system is used for preparation of electron transparent thin samples, while STEM or TEM is used for localization of a specific site to be milled in the FIB system. An FIB-STEM(TEM) compatible sample holder has been developed to facilitate thin sample preparation with high positional accuracy Positional accuracy of $0.1{\mu}m$ or better can be achieved by the technique. In addition, an FIB micro-sampling technique has been developed to extract a small sample directly from a bulk sample in a FIB system These newly developed techniques were applied for the analysis of specific failure in Si devices and also for characterization of a specific precipitate In a metal sample.

• Corrosion Science and Technology
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• 제17권3호
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• pp.123-128
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• 2018

The fabrication of a controlled surface is of great interest because it can be applied to various engineering facilities due to the various properties of the surface, such as self-cleaning, anti-bio-fouling, anti-icing, anti-corrosion, and anti-sticking. Controlled surfaces with micro/nano structures were fabricated using an ion beam focused onto a polypropylene (PP) surface with a fluoridation process. We developed a facile method of fabricating hydrophobic surfaces through ion beam treatment with argon and oxygen ions. The fabrication of low surface energy materials can replace the current expensive and complex manufacturing process. The contact angles (CAs) of the sample surface were $106^{\circ}$ and $108^{\circ}$ degrees using argon and oxygen ions, respectively. X-ray photoelectron spectroscopy (XPS) and Fourier transform infrared (FT-IR) spectroscopy were used to determine the chemical composition of the surface. The morphology change of the surfaces was observed by scanning electron microscopy (SEM). The change of the surface morphology using the ion beam was shown to be very effective and provide enhanced optical properties. It is therefore expected that the prepared surface with wear and corrosion resistance might have a considerable potential in large scale industrial applications.