• 제목/요약/키워드: Focal Plane Array(FPA)

검색결과 33건 처리시간 0.036초

CTIA 바이어스 상쇄회로를 갖는 초점면 배열에서 마이크로 볼로미터의 온도변화 해석 (Analyses of temperature change of a u-bolometer in Focal Plane Array with CTIA bias cancellation circuit)

  • 박승만
    • 전기학회논문지
    • /
    • 제60권12호
    • /
    • pp.2311-2317
    • /
    • 2011
  • In this paper, we study the temperature change of a ${\mu}$-bolometer focal plane array with a capacitive transimpedance amplifier bias cancellation circuit. Thermal analysis is essential to understand the performance of a ${\mu}$-bolometer focal plane array, and to improve the temperature stability of a focal plane array characteristics. In this study, the thermal analyses of a ${\mu}$-bolometer and its two reference detectors are carried out as a function of time. The analyses are done with the $30{\mu}m$ pitch $320{\times}240$ focal plane array operating of 60 Hz frame rate and having a columnwise readout. From the results, the temperature increase of a ${\mu}$-bolometer in FPA by an incident IR is estimated as $0.689^{\circ}C$, while the temperature increase by a pulsed bias as $7.1^{\circ}C$, which is about 10 times larger than by IR. The temperature increase of a reference detector by a train of bias pulses may be increased much higher than that of an active ${\mu}$-bolometer. The suppression of temperature increase in a reference bolometer can be done by increasing the thermal conductivity of the reference bolometer, in which the selection of thermal conductivity also determines the range of CTIA output voltage.

마이크로 볼로미터 초점면 배열에서 전기-열적 피드백 현상이 신호에 미치는 영향 (Electro-thermal Feedback Effects on the Signal in a Pulse Voltage Biased μ-bolometer Focal Plane Array)

  • 박승만;한승오
    • 전기학회논문지
    • /
    • 제61권12호
    • /
    • pp.1886-1891
    • /
    • 2012
  • In this paper, the analytical models for the electrothermal feedback of a ${\mu}$-bolometer focal plane array(FPA) are proposed and applied to the conceptually designed FPA to investigate the electrothermal feedback effect on bolometer FPA signal. The temperature and resistance change of the ${\mu}$-bolometer by the electrothermal feedback(ETF) model are increased upto 20 and 35.7 % of those of no feedback case, respectively, while those by the effective thermal conductance(ETC) model increased 8.5 and 15.1 %. The integration current and output voltage of a CTIA used as an column amplifier of FPA are also increased upto 41.6 and 32.4 % by the ETF model, while increased upto 17.2 and 13.5 % by the ETC model. The proposed models give more accurate temperature change, accordingly larger signal than no feedback considering case. Electrothermal feedback effect should be considered to design a high performance and high density ${\mu}$-bolometer FPA. The proposed models are very useful to investigate the transient thermal analysis, also considered to be useful to predict the responsivity and dynamic range of ${\mu}$-bolometer FPAs.

segmented Focal Plane Array를 이용한 개선된 레티클 탐색기 (An Improved Reticle Seeker Using the Segmented Forcal Plane Array)

  • 홍현기;한성현;최종수
    • 한국통신학회논문지
    • /
    • 제21권10호
    • /
    • pp.2670-2678
    • /
    • 1996
  • Reticle seekers temporally modulate target location onto the incoming spatial signal. When large or multiple targets are present in the FOV, however, it is hard to precisely modulate the incoming target signal by the relicle. To solve this loss of modulatoin depth problem, we present an improved retical seeker using the segmented focal plane array(FPA). The new reticle system uses the normalized difference as well as the modulated signal of each detector output in the segmented FPA. In simulation, we have ascertained the proposed system can make an effective analysis and tracking for multiple or large targets.

  • PDF

Korean ALMA Near-term Technical Activities: Development Plan of Focal Plane Array for ASTE

  • Lee, Jung-Won;Kim, Jongsoo;Lee, Chang-Won;Je, Do-Heung;Kang, Yong-Woo;Lee, Bangwon
    • 천문학회보
    • /
    • 제39권2호
    • /
    • pp.116.2-116.2
    • /
    • 2014
  • As Korean engineering contribution to ALMA enhancement, development of focal plane arrays(FPAs) for the total power array in ALMA compact array has been projected mainly to increase mapping speed in interferometric multi-pointing observation(mosaicking). To tackle engineering issues expected in order to be compatible with the existing ALMA receivers, we plan to develop a prototype 300-500 GHz heterodyne FPA system including a software spectrometer using GPU clusters for ASTE(Atacama Submillimeter Telescope Experiment) telescope by 2017.

  • PDF

Wide band prototype feedhorn design for ASTE focal plane array

  • Lee, Bangwon;Gonzales, Alvaro;Lee, Jung-won
    • 천문학회보
    • /
    • 제41권2호
    • /
    • pp.66.2-66.2
    • /
    • 2016
  • KASI and NAOJ are making collaborating efforts to implement faster mapping capability into the new 275-500 GHz Atacama Submillimeter Telescope Experiment focal plane array (FPA). Feed horn antenna is one of critical parts of the FPA. Required fractional bandwidth is almost 60 % while that of traditional conical horn is less than 50 %. Therefore, to achieve this wideband performance, we adopted a horn of which the corrugation depths have a longitudinal profile. A profiled horn has features not only of wide bandwidth but also of shorter length compared to a linear-tapered corrugated horn, and lower cost fabrication with less error can be feasible. In our design process the flare region is represented by a cubic splined curve with several parameters. Parameters of the flare region and each dimension of the throat region are optimized by a differential evolution algorithm to keep >20 dB return loss and >30 dB maximum cross-polarization level over the operation bandwidth. To evaluate RF performance of the horn generated by the optimizer, we used a commercial mode matching software, WASP-NET. Also, Gaussian beam (GB) masks to far fields were applied to give better GB behavior over frequencies. The optimized design shows >23 dB return loss and >33 dB maximum cross-polarization level over the whole band. Gaussicity of the horn is over 96.6 %. The length of the horn is 12.5 mm which is just 57 % of the ALMA band 8 feed horn (21.96 mm).

  • PDF

[InAs/GaSb] 응력 초격자에 기초한 [320×256]-FPA 적외선 열영상 모듈 제작 (Fabrication of [320×256]-FPA Infrared Thermographic Module Based on [InAs/GaSb] Strained-Layer Superlattice)

  • 이상준;노삼규;배수호;정한
    • 한국진공학회지
    • /
    • 제20권1호
    • /
    • pp.22-29
    • /
    • 2011
  • InAs/GaSb 제2형 응력초격자(SLS)를 활성층에 탑재한 [$320{\times}256$] 초점면 배열(FPA) 적외선 열영상 모듈을 제작하고 열영상을 구현하였다. p-i-n형으로 설계된 소자의 활성층(i) 구조는 300 주기의 [13/7]-ML [InAs/GaSb]-SLS로 구성되어 있고, p와 n 전극층에는 각각 60주기의 [InAs:Be/GaSb]-SLS와 115 주기의 [InAs:Si/GaSb]-SLS 구조를 채용하였다. 시험소자의 광반응(PR) 스펙트럼으로부터 피크 파장(${\lambda}_p$)과 차단 파장(${\lambda}_{co}$)은 각각 ${\sim}3.1/2.7{\mu}m$${\sim}3.8{\mu}m$이고 180 K 온도까지 동작을 확인하였다. 단위 화소의 간격/메사는 $30/24{\mu}m$ 규격으로 설계되었으며, [$320{\times}256$]-FPA는 표준 광묘화법으로 제작하였다. $18/10{\mu}m$의 In-bump/UBM 공정과 flip-chip 결합 기술을 적용하여 FPA-ROIC 열영상 모듈을 완성하였으며, 중적외선용 영상구동 회로 및 S/W를 활용하여 열영상을 시연하였다.

Characteristics of Surface Micromachined Pyroelectric Infrared Ray Focal Plane Array

  • Ryu, Sang-Ouk;Cho, Seong-Mok;Choi, Kyu-Jeong;Yoon, Sung-Min;Lee, Nam-Yeal;Yu, Byoung-Gon
    • JSTS:Journal of Semiconductor Technology and Science
    • /
    • 제5권1호
    • /
    • pp.45-51
    • /
    • 2005
  • We have developed surface micromachined Infrared ray (IR) focal plane array (FPA), in which single $SiO_{2}$ layer works as an IR absorbing plate and $Pb(Zr_{0.3}Ti_{0.7})O_{2}$ thin film served as a thermally sensitive material. There are some advantages of applying $SiO_{2}$ layer as an IR absorbing layer. First of all, the $SiO_{2}$ has good IR absorbance within $8{\sim}12{\mu}m$ spectrum range. Measured value showed about 60% absorbance of incident IR spectrum in the range. $SiO_{2}$ layer has another important merit when applied to the top of Pt/PZT/Pt stack because it works also as a supporting membrane. Consequently, the IR absorbing layer forms one body with membrane structure, which simplifies the whole MEMS process and gives robustness Ito the structure.

Mechanical design of mounts for IGRINS focal plane array

  • Oh, Jae Sok;Park, Chan;Cha, Sang-Mok;Yuk, In-Soo;Park, Kwijong;Kim, Kang-Min;Chun, Moo-Young;Ko, Kyeongyeon;Oh, Heeyoung;Jeong, Ueejeong;Nah, Jakyuong;Lee, Hanshin;Pavel, Michael;Jaffe, Daniel T.
    • 천문학회보
    • /
    • 제39권1호
    • /
    • pp.53.2-53.2
    • /
    • 2014
  • IGRINS, the Immersion GRating INfrared Spectrometer, is a near-infrared wide-band high-resolution spectrograph jointly developed by the Korea Astronomy and Space Science Institute and the University of Texas at Austin. IGRINS employs three HAWAII-2RG focal plane array (FPA) detectors. The mechanical mounts for these detectors serves a critical function in the overall instrument design: Optically, they permit the only positional compensation in the otherwise "build to print" design. Thermally, they permit setting and control of the detector operating temperature independently of the cryostat bench. We present the design and fabrication of the mechanical mount as a single module. The detector mount includes the array housing, a housing for the SIDECAR ASIC, a field flattener lens holder, and a support base. The detector and ASIC housing will be kept at 65 K and the support base at 130 K. G10 supports thermally isolate the detector and ASIC housing from the support base. The field flattening lens holder attaches directly to the FPA array housing and holds the lens with a six-point kinematic mount. Fine adjustment features permit changes in axial position and in yaw and pitch angles. We optimized the structural stability and thermal characteristics of the mount design using computer-aided 3D modeling and finite element analysis. Based on the computer simulation, the designed detector mount meets the optical and thermal requirements very well.

  • PDF

UV 검출기 제작을 위한 $8{\times}8$ ReadOut IC에 관한 연구 (Investigation on the $8{\times}8$ ReadOut IC for Ultra Violet Detector)

  • 김주연;김태근
    • 대한전자공학회논문지TE
    • /
    • 제42권3호
    • /
    • pp.45-50
    • /
    • 2005
  • 산업용, 의학용 및 군사용, 환경감시용 등 다양한 분야에서 UV 카메라가 이용되고 있다. 높은 분해능과 고효율을 가진 GaN 계열의 III-V족 질화물 반도체를 이용하여 제작한 UV 센서인 포토다이오드로 부터 최적의 자외선 응답을 읽어낼 수 있는 ROIC(ReadOut IC)를 개발 했다. FPA(Focal Plane Array)용 UV $8{\times}8$ ReadOut IC(ROIC)를 설계를 위하여 포토다이오드 타입 센서 소자를 커패시터로 모델링하였다. ROIC는 검출되는 신호를 받아 이를 증폭하고 잡음제거 필터링을 거쳐 픽셀 단위로 순차적으로 출력하는 기능을 수행하도록 하였다. ROIC는 $0.5{\mu}m$ 2Poly, 3Metal N-well CMOS process를 이용하여 제작되었으며, 이방성 전도성 페이스트 (Anisotropic Conductive Paste:ACP)를 사용하는 gold stud bumping 공정으로 ROIC와 포토다이오드 어레이를 하이브리드 패키지 (package)한 후 PC에서 자외선 영상으로 확인함으로써 ROIC의 동작을 검증하였다.