• Title/Summary/Keyword: Focal Plane Array(FPA)

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Analyses of temperature change of a u-bolometer in Focal Plane Array with CTIA bias cancellation circuit (CTIA 바이어스 상쇄회로를 갖는 초점면 배열에서 마이크로 볼로미터의 온도변화 해석)

  • Park, Seung-Man
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.60 no.12
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    • pp.2311-2317
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    • 2011
  • In this paper, we study the temperature change of a ${\mu}$-bolometer focal plane array with a capacitive transimpedance amplifier bias cancellation circuit. Thermal analysis is essential to understand the performance of a ${\mu}$-bolometer focal plane array, and to improve the temperature stability of a focal plane array characteristics. In this study, the thermal analyses of a ${\mu}$-bolometer and its two reference detectors are carried out as a function of time. The analyses are done with the $30{\mu}m$ pitch $320{\times}240$ focal plane array operating of 60 Hz frame rate and having a columnwise readout. From the results, the temperature increase of a ${\mu}$-bolometer in FPA by an incident IR is estimated as $0.689^{\circ}C$, while the temperature increase by a pulsed bias as $7.1^{\circ}C$, which is about 10 times larger than by IR. The temperature increase of a reference detector by a train of bias pulses may be increased much higher than that of an active ${\mu}$-bolometer. The suppression of temperature increase in a reference bolometer can be done by increasing the thermal conductivity of the reference bolometer, in which the selection of thermal conductivity also determines the range of CTIA output voltage.

Electro-thermal Feedback Effects on the Signal in a Pulse Voltage Biased μ-bolometer Focal Plane Array (마이크로 볼로미터 초점면 배열에서 전기-열적 피드백 현상이 신호에 미치는 영향)

  • Park, Seung-Man;Han, Seungoh
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.61 no.12
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    • pp.1886-1891
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    • 2012
  • In this paper, the analytical models for the electrothermal feedback of a ${\mu}$-bolometer focal plane array(FPA) are proposed and applied to the conceptually designed FPA to investigate the electrothermal feedback effect on bolometer FPA signal. The temperature and resistance change of the ${\mu}$-bolometer by the electrothermal feedback(ETF) model are increased upto 20 and 35.7 % of those of no feedback case, respectively, while those by the effective thermal conductance(ETC) model increased 8.5 and 15.1 %. The integration current and output voltage of a CTIA used as an column amplifier of FPA are also increased upto 41.6 and 32.4 % by the ETF model, while increased upto 17.2 and 13.5 % by the ETC model. The proposed models give more accurate temperature change, accordingly larger signal than no feedback considering case. Electrothermal feedback effect should be considered to design a high performance and high density ${\mu}$-bolometer FPA. The proposed models are very useful to investigate the transient thermal analysis, also considered to be useful to predict the responsivity and dynamic range of ${\mu}$-bolometer FPAs.

An Improved Reticle Seeker Using the Segmented Forcal Plane Array (segmented Focal Plane Array를 이용한 개선된 레티클 탐색기)

  • 홍현기;한성현;최종수
    • The Journal of Korean Institute of Communications and Information Sciences
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    • v.21 no.10
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    • pp.2670-2678
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    • 1996
  • Reticle seekers temporally modulate target location onto the incoming spatial signal. When large or multiple targets are present in the FOV, however, it is hard to precisely modulate the incoming target signal by the relicle. To solve this loss of modulatoin depth problem, we present an improved retical seeker using the segmented focal plane array(FPA). The new reticle system uses the normalized difference as well as the modulated signal of each detector output in the segmented FPA. In simulation, we have ascertained the proposed system can make an effective analysis and tracking for multiple or large targets.

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Korean ALMA Near-term Technical Activities: Development Plan of Focal Plane Array for ASTE

  • Lee, Jung-Won;Kim, Jongsoo;Lee, Chang-Won;Je, Do-Heung;Kang, Yong-Woo;Lee, Bangwon
    • The Bulletin of The Korean Astronomical Society
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    • v.39 no.2
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    • pp.116.2-116.2
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    • 2014
  • As Korean engineering contribution to ALMA enhancement, development of focal plane arrays(FPAs) for the total power array in ALMA compact array has been projected mainly to increase mapping speed in interferometric multi-pointing observation(mosaicking). To tackle engineering issues expected in order to be compatible with the existing ALMA receivers, we plan to develop a prototype 300-500 GHz heterodyne FPA system including a software spectrometer using GPU clusters for ASTE(Atacama Submillimeter Telescope Experiment) telescope by 2017.

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Wide band prototype feedhorn design for ASTE focal plane array

  • Lee, Bangwon;Gonzales, Alvaro;Lee, Jung-won
    • The Bulletin of The Korean Astronomical Society
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    • v.41 no.2
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    • pp.66.2-66.2
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    • 2016
  • KASI and NAOJ are making collaborating efforts to implement faster mapping capability into the new 275-500 GHz Atacama Submillimeter Telescope Experiment focal plane array (FPA). Feed horn antenna is one of critical parts of the FPA. Required fractional bandwidth is almost 60 % while that of traditional conical horn is less than 50 %. Therefore, to achieve this wideband performance, we adopted a horn of which the corrugation depths have a longitudinal profile. A profiled horn has features not only of wide bandwidth but also of shorter length compared to a linear-tapered corrugated horn, and lower cost fabrication with less error can be feasible. In our design process the flare region is represented by a cubic splined curve with several parameters. Parameters of the flare region and each dimension of the throat region are optimized by a differential evolution algorithm to keep >20 dB return loss and >30 dB maximum cross-polarization level over the operation bandwidth. To evaluate RF performance of the horn generated by the optimizer, we used a commercial mode matching software, WASP-NET. Also, Gaussian beam (GB) masks to far fields were applied to give better GB behavior over frequencies. The optimized design shows >23 dB return loss and >33 dB maximum cross-polarization level over the whole band. Gaussicity of the horn is over 96.6 %. The length of the horn is 12.5 mm which is just 57 % of the ALMA band 8 feed horn (21.96 mm).

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Fabrication of [320×256]-FPA Infrared Thermographic Module Based on [InAs/GaSb] Strained-Layer Superlattice ([InAs/GaSb] 응력 초격자에 기초한 [320×256]-FPA 적외선 열영상 모듈 제작)

  • Lee, S.J.;Noh, S.K.;Bae, S.H.;Jung, H.
    • Journal of the Korean Vacuum Society
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    • v.20 no.1
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    • pp.22-29
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    • 2011
  • An infrared thermographic imaging module of [$320{\times}256$] focal-plane array (FPA) based on [InAs/GaSb] strained-layer superlattice (SLS) was fabricated, and its images were demonstrated. The p-i-n device consisted of an active layer (i) of 300-period [13/7]-ML [InAs/GaSb]-SLS and a pair of p/n-electrodes of (60/115)-period [InAs:(Be/Si)/GaSb]-SLS. FTIR photoresponse spectra taken from a test device revealed that the peak wavelength (${\lambda}_p$) and the cutoff wavelength (${\lambda}_{co}$) were approximately $3.1/2.7{\mu}m$ and $3.8{\mu}m$, respectively, and it was confirmed that the device was operated up to a temperature of 180 K. The $30/24-{\mu}m$ design rule was applied to single pixel pitch/mesa, and a standard photolithography was introduced for [$320{\times}256$]-FPA fabrication. An FPA-ROIC thermographic module was accomplished by using a $18/10-{\mu}m$ In-bump/UBM process and a flip-chip bonding technique, and the thermographic image was demonstrated by utilizing a mid-infrared camera and an image processor.

Characteristics of Surface Micromachined Pyroelectric Infrared Ray Focal Plane Array

  • Ryu, Sang-Ouk;Cho, Seong-Mok;Choi, Kyu-Jeong;Yoon, Sung-Min;Lee, Nam-Yeal;Yu, Byoung-Gon
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.5 no.1
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    • pp.45-51
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    • 2005
  • We have developed surface micromachined Infrared ray (IR) focal plane array (FPA), in which single $SiO_{2}$ layer works as an IR absorbing plate and $Pb(Zr_{0.3}Ti_{0.7})O_{2}$ thin film served as a thermally sensitive material. There are some advantages of applying $SiO_{2}$ layer as an IR absorbing layer. First of all, the $SiO_{2}$ has good IR absorbance within $8{\sim}12{\mu}m$ spectrum range. Measured value showed about 60% absorbance of incident IR spectrum in the range. $SiO_{2}$ layer has another important merit when applied to the top of Pt/PZT/Pt stack because it works also as a supporting membrane. Consequently, the IR absorbing layer forms one body with membrane structure, which simplifies the whole MEMS process and gives robustness Ito the structure.

Mechanical design of mounts for IGRINS focal plane array

  • Oh, Jae Sok;Park, Chan;Cha, Sang-Mok;Yuk, In-Soo;Park, Kwijong;Kim, Kang-Min;Chun, Moo-Young;Ko, Kyeongyeon;Oh, Heeyoung;Jeong, Ueejeong;Nah, Jakyuong;Lee, Hanshin;Pavel, Michael;Jaffe, Daniel T.
    • The Bulletin of The Korean Astronomical Society
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    • v.39 no.1
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    • pp.53.2-53.2
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    • 2014
  • IGRINS, the Immersion GRating INfrared Spectrometer, is a near-infrared wide-band high-resolution spectrograph jointly developed by the Korea Astronomy and Space Science Institute and the University of Texas at Austin. IGRINS employs three HAWAII-2RG focal plane array (FPA) detectors. The mechanical mounts for these detectors serves a critical function in the overall instrument design: Optically, they permit the only positional compensation in the otherwise "build to print" design. Thermally, they permit setting and control of the detector operating temperature independently of the cryostat bench. We present the design and fabrication of the mechanical mount as a single module. The detector mount includes the array housing, a housing for the SIDECAR ASIC, a field flattener lens holder, and a support base. The detector and ASIC housing will be kept at 65 K and the support base at 130 K. G10 supports thermally isolate the detector and ASIC housing from the support base. The field flattening lens holder attaches directly to the FPA array housing and holds the lens with a six-point kinematic mount. Fine adjustment features permit changes in axial position and in yaw and pitch angles. We optimized the structural stability and thermal characteristics of the mount design using computer-aided 3D modeling and finite element analysis. Based on the computer simulation, the designed detector mount meets the optical and thermal requirements very well.

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Investigation on the $8{\times}8$ ReadOut IC for Ultra Violet Detector (UV 검출기 제작을 위한 $8{\times}8$ ReadOut IC에 관한 연구)

  • Kim, Joo-Yeon;Kim, Tae-Geun
    • Journal of the Institute of Electronics Engineers of Korea TE
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    • v.42 no.3
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    • pp.45-50
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    • 2005
  • A UV camera is being used in various application regions such as industry, medical science, military, and environment monitoring. A ROIC(ReadOut IC) is developed and can read the responses from UV photodiode sensors which are made with III-V nitride semiconductors of GaN series haying high resolution and high efficiency. To design FPA(Focal Plane Array) UV $8{\times}8$ ROIC, the photodiode type sensor devices are modeled as the capacitor type ones. The ROIC reads out signals from the detector at)d outputs sequentially pixel signals after amplifying and noise filtering of them. The ROIC is fabricated using the $0.5{\mu}m$ 2Poly 3Metal N-well CMOS process. And then, it and photodiode array are hybrid bonded by gold stud bumping process using ACP(Anisotropic Conductive Paste). After the packaging, UV images appearing on PC verified the operations of the ROIC.