• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.06a
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• pp.917-918
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• 2009

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2013.05a
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• pp.199-199
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• 2013

• ETRI Journal
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• v.35 no.6
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• pp.1152-1155
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• 2013

A cost-effective and simple solder on pad (SoP) process is proposed for a fine-pitch microbump interconnection. A novel solder bump maker (SBM) material is applied to form a 60-${\mu}m$ pitch SoP. SBM, which is composed of ternary Sn3.0Ag0.5Cu (SAC305) solder powder and a polymer resin, is a paste material used to perform a fine-pitch SoP through a screen printing method. By optimizing the volumetric ratio of the resin, deoxidizing agent, and SAC305 solder powder, the oxide layers on the solder powder and Cu pads are successfully removed during the bumping process without additional treatment or equipment. Test vehicles with a daisy chain pattern are fabricated to develop the fine-pitch SoP process and evaluate the fine-pitch interconnection. The fabricated Si chip has 6,724 bumps with a 45-${\mu}m$ diameter and 60-${\mu}m$ pitch. The chip is flip chip bonded with a Si substrate using an underfill material with fluxing features. Using the fluxing underfill material is advantageous since it eliminates the flux cleaning process and capillary flow process of the underfill. The optimized bonding process is validated through an electrical characterization of the daisy chain pattern. This work is the first report on a successful operation of a fine-pitch SoP and microbump interconnection using a screen printing process.

• ETRI Journal
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• v.38 no.6
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• pp.1163-1171
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• 2016

Integration technologies involving flexible substrates are receiving significant attention owing the appearance of new products regarding wearable and Internet of Things technologies. There has been a continuous demand from the industry for a reliable bonding method applicable to a low-temperature process and flexible substrates. Up to now, however, an anisotropic conductive film (ACF) has been predominantly used in applications involving flexible substrates; we therefore suggest low-temperature lead-free soldering and bonding processes as a possible alternative for flex-on-flex applications. Test vehicles were designed on polyimide flexible substrates (FPCBs) to measure the contact resistances. Solder bumping was carried out using a solder-on-pad process with Solder Bump Maker based on Sn58Bi for low-temperature applications. In addition, thermocompression bonding of FPCBs was successfully demonstrated within the temperature of $150^{\circ}C$ using a newly developed fluxing underfill material with fluxing and curing capabilities at low temperature. The same FPCBs were bonded using commercially available ACFs in order to compare the joint properties with those of a joint formed using solder and an underfill. Both of the interconnections formed with Sn58Bi and ACF were examined through a contact resistance measurement, an $85^{\circ}C$ and 85% reliability test, and an SEM cross-sectional analysis.

• ETRI Journal
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• v.33 no.6
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• pp.864-870
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• 2011

As an isotropic conductive adhesive, that is, a hybrid Cu paste composed of Cu powder, solder powder, and a fluxing resin system, has been quantitatively characterized. The mechanism of an electrical connection based on a novel concept of electrical conduction is experimentally characterized using an analysis of a differential scanning calorimeter and scanning electron microscope energy-dispersive X-ray spectroscopy. The oxide on the metal surface is sufficiently removed with an increase in temperature, and intermetallic compounds between the Cu and melted solder are simultaneously generated, leading to an electrical connection. The reliability of the hybrid Cu paste is experimentally identified and compared with existing Ag paste. As an example of a practical application, the hybrid Cu paste is used for LED packaging, and its electrical and thermal performances are compared with the commercialized Ag paste. In the present research, it is proved that, except the optical function, the electrical and thermal performances are similar to pre-existing Ag paste. The hybrid Cu paste could be used as an isotropic conductive adhesive due to its low production cost.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.38 no.6
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• pp.629-636
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• 2014

For surface modification, bulk metallic glass coatings were fabricated using metallic glass powder and a mixture of a self-fluxing alloy or/and hard metal alloys with a heat-resisting property using a high velocity oxy-fuel coating thermal spraying process. Microstructural analyses and mechanical tests were carried out using X-ray diffraction, a scanning electron microscope, an atomic force microscope, a three-dimensional optical profiler, and nanoindenation. As a result, the monolithic metallic glass coating was found to consist of solid particle and lamellae regions that included many pores. Second phase-reinforced composite coatings with a self-fluxing alloy or/and hard metal alloy additives were employed with in-situ $Cr_2Ni_3$ precipitate or/and ex-situ WC particles in an amorphous matrix. The mechanical behaviors of the solid particles and lamella regions showed large hardness and elastic modulus differences. The mechanical properties of the particle regions in the metallic glass composite coatings were superior to those of the lamellae regions in the monolithic metallic glass coatings, but indicated similar trends in matrix region of all the coating layers.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.2
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• pp.55-59
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• 2015

Novel low-volume solder-on-pad (SoP) process is proposed for a fine pitch Cu pillar bump interconnection. A novel solder bumping material (SBM) has been developed for the $60{\mu}m$ pitch SoP using screen printing process. SBM, which is composed of ternary Sn-3.0Ag-0.5Cu (SAC305) solder powder and a polymer resin, is a paste material to perform a fine-pitch SoP in place of the electroplating process. By optimizing the volumetric ratio of the resin, deoxidizing agent, and SAC305 solder powder; the oxide layers on the solder powder and Cu pads are successfully removed during the bumping process without additional treatment or equipment. The Si chip and substrate with daisy-chain pattern are fabricated to develop the fine pitch SoP process and evaluate the fine-pitch interconnection. The fabricated Si substrate has 6724 under bump metallization (UBM) with a $45{\mu}m$ diameter and $60{\mu}m$ pitch. The Si chip with Cu pillar bump is flip chip bonded with the SoP formed substrate using an underfill material with fluxing features. Using the fluxing underfill material is advantageous since it eliminates the flux cleaning process and capillary flow process of underfill. The optimized interconnection process has been validated by the electrical characterization of the daisy-chain pattern. This work is the first report on a successful operation of a fine-pitch SoP and micro bump interconnection using a screen printing process.

• Journal of the Korean Society of Combustion
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• v.8 no.2
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• pp.34-40
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• 2003

Analyses for concentration, surface phenomena, and crystal structure were performed to identify the causes of clinker formation in three type of pulverized coal fired boilers. Some clinkers had partially molten surface and more CaO and $Fe_2O_3$ as compared with fly ash, and the major crystalline phases identified in the clinker were mullite and quartz. Clinkers were formed in high temperature zone of the boiler according to the identification of mullite by XRD. Free $SiO_2$ in sand combined with K, Na and Ca in limestone served as a fluxing agent to form clinkers in a circulating bed boiler.

• Journal of Korea Foundry Society
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• v.29 no.5
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• pp.192-197
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• 2009

The manufacturing and application characteristics of binderless briquette for in-mold melt treatment of ductile cast iron were investigated. The porosity of briquette was decreased with increased magnesium content. The dissolution rate was increased with the latter in the range of 5~10%. The fluxing effect was the best when 5%$CaF_2$ was added. The optimum composition of the binderless briquette was obtained.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.19 no.1
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• pp.48-53
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• 2009

The effect of bloating and fluxing agent on the microstructure and physical properties were studied in manufacturing the artificial lightweight aggregates of bulk density below] using clay and stone sludge. In case of the aggregates added only with bloating agent, the bulk density and water absorption were $0.5{\sim}1.0$ and $41{\sim}110%$ respectively but the microstucture was not uniform with a rough appearance. For the aggregates added with a fluxing agent and one bloating agent, a part of shell was lost due to explosion of specimen caused by over-bloating during a sintering. The mixed addition of bloating agents with vacuum oil, carbon and ${Fe_2}{O_3}$ made the microstructure homogeneous by generating an uniform black core and shell structure. The aggregates added with mixed agents and sintered at $1200^{\circ}C$ showed the bulk density 67 % lower and water absorption 48 times higher than those of the specimen with no additives. ]n this study, the artificial lightweight aggregates showing the bulk density of $0.5{\sim}1.0$ and water absorption of $50{\sim}125%$ could be fabricated to apply to various fields.