• Transactions of the Korean Society of Mechanical Engineers B
• /
• v.37 no.8
• /
• pp.759-765
• /
• 2013

This study proposes the characteristics of the pressure drop in a compressible fluid through porous media for application to a porous injector in a liquid rocket engine in order to improve the uniformity of the drop size distribution and the mixing performance of shear coaxial injectors. The fluid through the porous media is a Non-Darcy flow that shows a Nonlinear relation between the pressure drop and the velocity at high speed and high mass flow rate. The pressure drop of the Non-Darcy flow can be derived using the Forchheimer equation that includes the losses of viscous and inertia resistance. The permeability and Ergun coefficient represented as a function of the pressure drop and pore size can be applied to the porous injector, where the fluid through the porous media is compressible. A generalized correlation between the pressure drop in relation to the pore size was derived.

• Clean Technology
• /
• v.23 no.1
• /
• pp.42-53
• /
• 2017

Numerical analysis was done to evaluate the fluid distribution inside of the mixing quencher to increase the reaction efficiency of the aqueous hydrogen peroxide solution in the scrubbing column which is used for simultaneous desulfurization and denitrification. Effective injection of the aqueous hydrogen peroxide ($H_2O_2$) solution in the mixing quencher has major effects for improving the reaction efficiency in the scrubbing column by enhancing the mixing of the aqueous $H_2O_2$ solution with the exhaust gas. The current study is to optimize the array of nozzles and the spray angles of the aqueous $H_2O_2$ solution in the mixing quencher by using the computational method. Main concerns of the analysis are how to enhance the uniformity of the $H_2O_2$ concentration distribution in the internal flow. Numerical analysis was done to check the distribution of the internal flow in the mixing quencher in terms of RMS values of the $H_2O_2$ concentration at the end of quencher. The concentration distribution of $H_2O_2$ at the end of is evaluated with respect to the different array of the nozzle pipes and the nozzle tip angles, and we also analyzed the turbulence formation and fluid mixing in the zone. The effect of the spray angle was evaluated with respect to the mixing efficiency in different flow directions. The optimized mixing quencher had the nozzle array at location of 0.3 m from the inlet duct surface and the spray angle is $15^{\circ}$ with the co-current flow. The RMS value of the $H_2O_2$ concentration at the end of the mixing quencher was 12.4%.

• Korean Chemical Engineering Research
• /
• v.51 no.1
• /
• pp.127-135
• /
• 2013

In this study, both pressure drop and microbe-population-distribution were observed while running a novel biofilter system with improved design in which the biofilter system is composed of two, upper and lower biofilters with both equal feed-rates of up-flow and down-flow, respectively. Then they were compared with the pressure drop and microbe-population-distribution observed in a conventional biofilter of the same effective volume with unidirectional flow. The pressure drop-value of biofilter system with improved design turned out to be less at the incipient stage of run or steady-state long term operation by more than 40~80% of that of the conventional biofilter. The microbe-population-distribution was observed to be lower and higher at higher and lower column of biofilter, respectively, for both the conventional biofilter and the biofilter system with improved design. The microbe-media of waste-tire crumb showed much greater CFU counts than GAC. In the biofilter system with improved design, the $bottom{\rightarrow}up$ feeding of waste air showed greater microbe-population growth than the $top{\rightarrow}down$ feeding for both the microbe-media of waste-tire crumb and GAC. However, it was more prominent for the former than the latter. Comparing the microbe-population-distributions of both of the conventional biofilter and the biofilter system with improved design, the microbe-population of latter was distributed ca. 15 and 2.5 times more evenly for GAC and the media of waste-tire crumb, respectively, than that of former.

• Applied Chemistry for Engineering
• /
• v.29 no.5
• /
• pp.510-518
• /
• 2018

Recently, lots of interests have been concentrated on the scrubber system that abates waste gases produced from semiconductor manufacturing processes. An effective design of the thermal decomposition reactor inside a scrubber system is significantly important since it is directly related to the removal performance of pollutants and overall stabilities. In the present study, a computational fluid dynamics (CFD) analysis was conducted to figure out the thermal and flow characteristics inside the reactor of wet scrubber. In order to verify the numerical method, the temperature at several monitoring points was compared to that of experimental results. Average error rates of 1.27~2.27% between both the results were achieved, and numerical results of the temperature distribution were in good agreement with the experimental data. By using the validated numerical method, the effect of the reactor geometry on the heat transfer rate was also taken into consideration. From the result, it was observed that the flow and temperature uniformity were significantly improved. Overall, our current study could provide useful information to identify the fluid behavior and thermal performance for various scrubber systems.

• Transactions of the Korean Society of Mechanical Engineers B
• /
• v.40 no.3
• /
• pp.127-138
• /
• 2016

Diesel vehicles should be equipped with urea-selective catalytic reduction(SCR) system as a high-performance catalyst, in order to reduce harmful nitrogen oxide emissions. In this study, a three-dimensional Eulerian-Lagrangian CFD analysis was used to numerically predict the multiphase flow characteristics of the urea-SCR system, coupled with the chemical reactions of the system's transport phenomena. Then, the numerical spray structure was modified by comparing the results with the measured values from spray visualization, such as the injection velocity, penentration length, spray radius, and sauter mean diameter. In addition, the analysis results were verified by comparison with the removal efficiency of the nitrogen oxide emissions during engine and chassis tests, resulting in accuracy of the relative error of less than 5%. Finally, a verified CFD analysis was used to calculate the interanl flow of the urea-SCR system, thereby analyzing the characteristics of pressure drop and velocity increase, and predicting the uniformity index and overdistribution positions of ammonia.

• Journal of Biosystems Engineering
• /
• v.33 no.2
• /
• pp.106-114
• /
• 2008

This study was performed to analyze the distribution of air current speed, $CO_2$ concentration, and photosynthetic photon flux (PPF) in a closed transplants production system (CTPS) for producing quality transplants. And the effect of PPF on the growth of potato (Solanum tuberosum L. cv. Dejima) plug seedlings was analyzed. Uniformity of the air current speed in CTPS was improved by installing perforated floors in duct for air circulating and by adjusting of air flow rate of the fan connected to air conditioning unit used in this study, Measured $CO_2$ concentrations were measured $409{\pm}13$, $950{\pm}25$, and $1,550{\pm}35\;{\mu}mol{\cdot}mol^{-1}$ for setting values of 400, 950, and $1,550\;{\mu}mol{\cdot}mol^{-1}$, respectively. Uniformity of PPF by adding each one the single fluorescent lamp of 20 W at both ends of the single fluorescent lamps of 40 W was highly improved. While the average PPF measured under the twin fluorescent lamps of 55 W installed at regular intervals of 10 cm was decreased by increasing the vertical distance from the lighting sources, the ratio of average PPF measured at both ends to PPF measured in the center was 74-79%. Five levels ($100{\pm}9$, $150{\pm}14$, $200{\pm}17$, $250{\pm}24$ and $300{\pm}31{\mu}mol{\cdot}m^{-2}{\cdot}s^{-1}$) of PPF were provided to investigate the effect of PPF on plant height, fresh weight and dry weight of potato plug seedlings produced in CTPS. Plant height was decreased by increasing PPF. Maximum fresh weight and dry weight were shown under PPF of $250{\mu}mol{\cdot}m^{-2}{\cdot}s^{-1}$. Thus PPF of $250\;{\mu}mol{\cdot}m^{-2}{\cdot}s^{-1}$ was enough to produce quality potato transplants under air temperature, photoperiod, and relative humidity of $20^{\circ}C$, 16/8 h, and 70%, respectively. It was concluded that quality indices such as plant height, fresh weight and dry weight could be improved by illuminating of adequate PPF from artificial lighting sources.

• Transactions of the Korean Society of Automotive Engineers
• /
• v.22 no.3
• /
• pp.171-178
• /
• 2014

From now on, in order to meet more stringer diesel emission standard, diesel vehicle should be equipped with emission after-treatment devices as NOx reduction catalyst and particulate filters. Urea-SCR is being developed as the most efficient method of reducing NOx emissions in the after-treatment devices of diesel engines, and recent studies have begun to mount the urea-SCR device for diesel passenger cars and light duty vehicles. That is because their operational characteristics are quite different from heavy duty vehicles, urea solution injection should be changed with other conditions. Therefore, the number and diameter of the nozzle, injection directions, mounting positions in front of the catalytic converter are important design factors. In this study, major design parameters concerning urea solution injection in front of SCR are optimized by using a CFD analysis and Taguchi method. The computational prediction of internal flow and spray characteristics in front of SCR was carried out by using STAR-CCM+7.06 code that used to evaluate $NH_3$ uniformity index($NH_3$ UI). The design parameters are optimized by using the $L_{16}$ orthogonal array and small-the-better characteristics of the Taguchi method. As a result, the optimal values are confirmed to be valid in 95% confidence and 5% significance level through analysis of variance(ANOVA). The compared maximize $NH_3$ UI and activation time($NH_3$ UI 0.82) are numerically confirmed that the optimal model provides better conversion efficiency of $NH_3$. In addition, we propose a method to minimize wall-wetting around the urea injector in order to prevent injector blocks caused by solid urea loading. Consequently, the thickness reduction of fluid film in front of mixer is numerically confirmed through the mounting mixer and correcting injection direction by using the trial and error method.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2012.02a
• /
• pp.434-435
• /
• 2012

Plasma enhanced chemical vapor deposition (PECVD) silicon dioxide thin films have many applications in semiconductor manufacturing such as inter-level dielectric and gate dielectric metal oxide semiconductor field effect transistors (MOSFETs). Fundamental chemical reaction for the formation of SiO2 includes SiH4 and O2, but mixture of SiH4 and N2O is preferable because of lower hydrogen concentration in the deposited film [1]. It is also known that binding energy of N-N is higher than that of N-O, so the particle generation by molecular reaction can be reduced by reducing reactive nitrogen during the deposition process. However, nitrous oxide (N2O) gives rise to nitric oxide (NO) on reaction with oxygen atoms, which in turn reacts with ozone. NO became a greenhouse gas which is naturally occurred regulating of stratospheric ozone. In fact, it takes global warming effect about 300 times higher than carbon dioxide (CO2). Industries regard that N2O is inevitable for their device fabrication; however, it is worthwhile to develop a marginable nitrous oxide free process for university lab classes considering educational and environmental purpose. In this paper, we developed environmental friendly and material cost efficient SiO2 deposition process by substituting N2O with O2 targeting university hands-on laboratory course. Experiment was performed by two level statistical design of experiment (DOE) with three process parameters including RF power, susceptor temperature, and oxygen gas flow. Responses of interests to optimize the process were deposition rate, film uniformity, surface roughness, and electrical dielectric property. We observed some power like particle formation on wafer in some experiment, and we postulate that the thermal and electrical energy to dissociate gas molecule was relatively lower than other runs. However, we were able to find a marginable process region with less than 3% uniformity requirement in our process optimization goal. Surface roughness measured by atomic force microscopy (AFM) presented some evidence of the agglomeration of silane related particles, and the result was still satisfactory for the purpose of this research. This newly developed SiO2 deposition process is currently under verification with repeated experimental run on 4 inches wafer, and it will be adopted to Semiconductor Material and Process course offered in the Department of Electronic Engineering at Myongji University from spring semester in 2012.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2013.08a
• /
• pp.220-220
• /
• 2013

Surface-normal transmission electro-absorption modulator (EAM) are attractive for high-definition (HD) three-dimensional (3D) imaging application due to its features such as small system volume and simple epitaxial structure [1,2]. However, EAM in order to be used for HD 3D imaging system requires uniform modulation performance over large area. To achieve highly uniform modulation performance of EAM at the operating wavelength of 850 nm, it is extremely important to remove the GaAs substrate over large area since GaAs material has high absorption coefficient below 870 nm which corresponds to band-edge energy of GaAs (1.424 eV). In this study, we propose and experimentally demonstrate a transmission EAM in which highly selective backside etching methods which include lapping, dry etching and wet etching is carried out to remove the GaAs substrate for achieving highly uniform modulation performance. First, lapping process on GaAs substrate was carried out for different lapping speeds (5 rpm, 7 rpm, 10 rpm) and the thickness was measured over different areas of surface. For a lapping speed of 5 rpm, a highly uniform surface over a large area ($2{\times}1\;mm^2$) was obtained. Second, optimization of inductive coupled plasma-reactive ion etching (ICP-RIE) was carried out to achieve anisotropy and high etch rate. The dry etching carried out using a gas mixture of SiCl4 and Ar, each having a flow rate of 10 sccm and 40 sccm, respectively with an RF power of 50 W, ICP power of 400 W and chamber pressure of 2 mTorr was the optimum etching condition. Last, the rest of GaAs substrate was successfully removed by highly selective backside wet etching with pH adjusted solution of citric acid and hydrogen peroxide. Citric acid/hydrogen peroxide etching solution having a volume ratio of 5:1 was the best etching condition which provides not only high selectivity of 235:1 between GaAs and AlAs but also good etching profile [3]. The fabricated transmission EAM array have an amplitude modulation of more than 50% at the bias voltage of -9 V and maintains high uniformity of >90% over large area ($2{\times}1\;mm^2$). These results show that the fabricated transmission EAM with substrate removed is an excellent candidate to be used as an optical shutter for HD 3D imaging application.

• Journal of the Microelectronics and Packaging Society
• /
• v.29 no.1
• /
• pp.49-54
• /
• 2022

The copper plating process used to fabricate the submicron damascene pattern of Cu wiring for Si wafer was applied to the plating of a PCB pattern of several tens of microns in size using the same organic additives and current density conditions. In this case, the non-uniformity of the plating thickness inside the pattern was observed. In order to quantitatively analyze the cause, a numerical calculation considering the solution flow and electric field was carried out. The calculation confirmed that the depletion of Cu²⁺ ions in the solution occurred relatively earlier at the bottom corner than the upper part of the pattern due to the plating of the sidewall and the bottom at the corner of the pattern bottom. The diffusion coefficient of Cu²⁺ ions is 2.65 10^-10 m²/s, which means that Cu²⁺ ions move at 16.3 ㎛ per second on average. In the cases of small damascene patterns, the velocity of Cu²⁺ ions is high enough to supply sufficient ions to the inside of the patterns, while sufficient time is required to replenish the exhausted copper ions in the case of a PCB pattern having a size of several tens of microns. Therefore, it is found that the thickness uniformity can be improved by reducing the current density to supply sufficient copper ions to the target area.