• Proceedings of the Materials Research Society of Korea Conference
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• 2011.05a
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• pp.39.2-39.2
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• 2011

With the steady increase in the demand for flexible devices, mainly in display panels, researchers have focused on finding a novel material that have excellent electrical properties even when it is bended or stretched, along with superior mechanical and thermal properties. Graphene, a single-layered two-dimensional carbon lattice, has recently attracted tremendous research interest in this respect. However, the limitations in the growing method of graphene, mainly chemical vapor deposition on transition metal catalysts, has posed severe problems in terms of device integration, due to the laborious transfer process that may damage and contaminate the graphene layer. In addition, to lower the overall cost, a fabrication technique that supports low temperature and low vacuum is required, which is the main reason why solution-based process for graphene layer deposition has become the hot issue. Nonetheless, a direct deposition method of large area, few-layered, and uniform graphene layers has not been reported yet, along with a convenient method of patterning them. Here, we report an evaporation-induced technique for directly depositing few layers of graphene nanosheets with excellent uniformity and thickness controllability on any substrate. The printed graphene nanosheets can be patterned into desired shapes and structures, which can be directly applicable as flexible and transparent electrode. To illustrate such potential, the transport properties and resistivity of the deposited graphene layers have been investigated according to their thickness. The induced internal flow of the graphene solution during tis evaporation allows uniform deposition with which its thickness, and thus resistivity can be tuned by controlling the composition ratio of the solute and solvent.

• Journal of the Korean Ceramic Society
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• v.39 no.6
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• pp.570-575
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• 2002

The present tendency of electrical and electronics is concentrated on MEMS devices for advantage of miniaturization, intergration, low electric power and low cost. Therefore it is essential that high aspect ratio and high etch rate by HDP technology development, so that silicon deep trench etching reactions was studied by ICP equipment. Deep trench etching of silicon was investigated as function of platen power, etch step time of etch/passivation cycle time and SF$\_$6/:C$_4$F$\_$8/ flow rate. Their effects on etch profile, scallops, etch rate, uniformity and selectivity were also studied.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.21 no.3
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• pp.203-207
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• 2008

Chemical mechanical polishing (CMP) allows the planarization of wafers with two or more materials. There are many elements such as slurry, polishing pad, process parameters and conditioning in CMP process. Especially, polishing pad is considered as one of the most important consumables because this affects its performances such as WIWNU(within wafer non-uniformity) and MRR(material removal rate). In polishing pad, grooves and pores on its surface affect distribution of slurry, flow and profile of MRR on wafer. A subject of this investigation is to apply CMP for planarization of shallow trench isolation structure using microstructure(MS) pad. MS pad is designed to have uniform structure on its surface and manufactured by micro-molding technology. And then STI CMP performances such as pattern selectivity, erosion and comer rounding are evaluated.

• Smart Structures and Systems
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• v.18 no.5
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• pp.865-884
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• 2016

We have previously demonstrated a microfluidic elastomer, which changes apparent color and could have potential applications in smart windows. The practical use of such functional microfluidic systems requires rapid and uniform fluid displacement throughout the channel network with minimal amount of liquid supply. The goal of this simulation study is to design various microfluidic networks for similar applications including, but not limited to, the color-switching windows and compare the liquid displacement speed and efficiency of the designs. We numerically simulate and analyze the liquid displacement in the microfluidic networks with serpentine, parallel and lattice channel configurations, as well as their modified versions with wide or tapered distributor and collector channels. The data are analyzed on the basis of numerical criteria defined to evaluate the performance of the corresponding functional systems. We found that the lattice channel network geometry with the tapered distributors and collectors provides most rapid and uniform fluid displacement with minimum liquid waste. The simulation results could give an important guideline for efficient liquid supply/displacement in emerging functional systems with embedded microfluidic networks.

• Proceedings of the Materials Research Society of Korea Conference
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• 2010.05a
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• pp.20.2-20.2
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• 2010

Recently inkjet printing technology has been developed in the areas of low cost fabrication in environmentally friendly manufacturing processes. Although inkjet printing requires the interdisciplinary researches including development of materials, manufacturing processes and printing equipment and peripherals, manufacturing a printhead is still core of inkjet technology. In this study, a piezoelectric driven DOD (drop on demand) inkjet printhead has been fabricated on three layers of the silicon wafer in MEMS Technology because of its chemical resistance to industrial inks, strong mechanical properties and dimensional accuracy to meet the drop volume uniformity in printed electronics and display industries. The flow passage, filter and nozzles are precisely etched on the layers of the silicon wafers and assembled through silicon fusion bonding without additional adhesives. The piezoelectric is screen-printed on the top the pressure chamber and the nozzle plate surface is treated with non-wetting coating for jetting fluids. Printheads with nozzle number of 16 to 256 have been developed to get the drop volume range from 5 pL to 80 pL in various industrial applications. Currently our printheads are successfully utilized to fabricating color-filters and PI alignment layers in LCD Flat Panel Display and legend marking for PCB in Samsung Electronics.

• Transactions of the Korean Society of Automotive Engineers
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• v.22 no.3
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• pp.60-67
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• 2014

The battery cells in lithium-ion battery pack assembled with high-capacity and high-power pouch cells, are commonly cooled with thin aluminum cooling plates in contact with the cells. For HEV/EV lithium-ion battery systems assembled with high-capacity, high-power pouch cells, the cells are commonly cooled with thin aluminum cooling plates in contact with the cells. Thin aluminum cooling plates are cooled by cold plate with coolant flow paths. In this study, the effect of the battery cooling system design including aluminum cooling plate thickness and various position of cold plate on the cooling performance are investigated by using finite element methods (FEM). Optimal cooling plate and cold plate design are proposed for improving the uniformity in temperature distributions as well as lowering average temperature for the cells with large capacities based on the simulation results.

• Journal of Korean Society for Atmospheric Environment
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• v.22 no.E1
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• pp.9-18
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• 2006

Aerosol hygroscopic properties were measured by a tandem differential mobility analyzer (TDMA) system during the Aerosol Characterization Experiment (ACE)-Asia campaign from 31 March to 1 May 2001. Two high flow differential mobility analyzers (DMAs) were used to maximize the count rate on board the Center for Interdisciplinary Remotely Piloted Aircraft (CIRPAS) Twin Otter aircraft. Hygroscopic growth factor distributions of particles having initial dry nanoparticle diameters of 0.040, 0.059, 0.086, 0.126, 0.186, 0.273, 0.400, and $0.586{\mu}m$ were measured during 19 research flights. Data collected during 12 of those flights were used to investigate aerosol mixing state and the influence of aerosol source region on size-resolved hygroscopicity. The uniformity in size-resolved hygroscopicity was quantified to facilitate comparison between measurements made in different air masses. Hygroscopic growth factors are strongly dependent on source region and sizes. Mean hygroscopic growth factors were observed to be greatest when the air mass origin was from the south. The mean growth factors for continental sources decreased with initial size from 1.47 to 1.27 for $0.040{\mu}m\;and\;0.586{\mu}m$, but increased with initial size from 1.44 to 1.8 for $0.040{\mu}m\;and\;0.400{\mu}m$ dry diameters for marine sources.

• Journal of the Korean Vacuum Society
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• v.19 no.3
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• pp.230-235
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• 2010

In this paper, we controlled the deposition rate and reflective index with process conditions that are TCP power, gas flow ratio and bias for optical properties of $SiO_2$ thin film using TCP-CVD equipment. We obtained a excellent $SiO_2$ thin film which has a excellent uniformity (<1 [%]), deposition rate (0.28 [${\mu}m$/ min]) and reflective index (1.4610-1.4621) within 4" wafer with process conditions ($SiH_4:O_2$=50 : 100 [sccm], TCP power 1 [kW], bias 200 [W]) at [$300^{\circ}C$].

• Journal of the Korean Society for Precision Engineering
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• v.33 no.8
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• pp.611-616
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• 2016

Computational fluid dynamic simulation based on the ABAQUS software was conducted to observe the inside flow of slot-die nozzle. The slot-die nozzle was modeled as 3-dimensional structure and three significant parameters were determined: inlet velocity of fluid, reservoir angles, number of strips none of which have been mentioned previously in the literature. The design of experiment, full factorial analysis was performed within determined design and process levels. The simulation result shows the inlet fluid velocity is most significant factor for the flows of inside nozzle. As an interaction effect, reservoir angle is closely related with number of strip that should address when the nozzle is designed. Moreover, the optimized values of each determined parameter were obtained as 35 mm/s of inlet velocity, 3 of strip numbers, and $22^{\circ}$ of reservoir angles. Based on these parameters, the outlet velocity was obtained as 0.53% of outlet uniformity which is improved from 8.67% of nominal results.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.38-38
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• 2010

Ever since the experimental discovery of graphene exfoiliated from the graphite flakes by Geim et at., this area has drawn a lot of attention for its possible application in IT industry. For the growth of graphene, chemical vapor deposition (CVD) has been widely used to fabricate the large area graphene. The lateral size of this graphene can be easily controlled by the size of the metal substrate though the chemical etching to remove this substrate is somewhat troublesome. Another problem which is hard to avoid is the folding at the grain boundary. We will discuss the origin of the folding first and introduce the way to avoid this folding. To solve this problem, we have used the various types of micro-thin metal foils. The precise control of hydro-carbon and the carrier gas results in the formation of the graphene on top of substrate. The thickness of graphene layers can be controlled with the control of gas flow on top of Cu substrate in contrast to the previously reported self-limiting growth $behavior^1$. Uniformity of this graphene layer has been checked by micro-raman spectroscopy and SEM. The size of grain can be enhanced by thermal treatment or use of other metal substrate. The dependence of grain size on the lattice size of the substrate will be discussed. By selecting the shape of substrate, we can grow various types of graphene. We will introduce the micron size graphene tube and its application.