• Title/Summary/Keyword: Flexible Metal foil

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Development of On-line Wrinkle Measurement System Using Machine Vision (머신 비젼을 이용한 실시간 링클 측정 시스템 개발)

  • Shin, Dong-Keun;To, Hoang-Minh;Ko, Sung-Lim
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.32 no.3
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    • pp.274-279
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    • 2008
  • Roll to roll (R2R) manufacturing process, also known as 'web processing', has been tried for producing electronic devices on a flexible plastic or metal foil. To increase the performance and productivity the R2R process, effective control and on-line supervision for web quality becomes very important. Wrinkle is one of the defects, which is incurred due to compressive stresses. A system for on-line measurement of wrinkle is developed using area scan camera and machine vision laser. The 2D image, obtained by area scan camera, is produced by Gaussian regression method to characterize the wrinkle on a transparent web. The experiment proves that 0.3mm wrinkle height can be measured successfully with 74fps.

Poly-Silicon TFT's on Metal Foil Substrates for Flexible Displays

  • Hatalis, Miltiadis;Troccoli, M.;Chuang, T.;Jamshidi, A.;Reed, G.
    • 한국정보디스플레이학회:학술대회논문집
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    • 2005.07a
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    • pp.692-696
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    • 2005
  • In an attempt to fabricate all inclusive display systems we are presenting a study on several elements that would be used as building blocks for all-on-board integrated applications on stainless steel foils. These systems would include in the same substrate all or many of the components needed to drive a flat panel OLED display. We are reporting results on both digital and analog circuits on stainless steel foils. Shift registers running at speeds greater than 1.0MHz are shown as well as oscillators operating at over 40MHz. Pixel circuits for driving organic light emitting diodes are presented. The device technology of choice is that based on poly-silicon TFT technology as it has the potential of producing circuits with good performance and considerable cost savings over the established processes on quartz or glass substrates (amorphous Silicon a-Si:H or silicon on Insulator SOI).

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Development of GDL-carbon Composite Bipolar Plate Assemblies for PEMFC (PEM 연료전지용 가스확산층-탄소 복합재료 분리판 조합체 개발)

  • Lim, Jun Woo
    • Composites Research
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    • v.34 no.6
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    • pp.406-411
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    • 2021
  • PEM (proton exchange membrane) fuel cells generate only water as a by-product, and thus are in the spotlight as an eco-friendly energy source. Among the various components composing the stack of the fuel cell, research on the bipolar plate that determines the efficiency of the fuel cell is being actively conducted. The composite bipolar plate has high strength, rigidity and corrosion resistance, but has the disadvantage of having a relatively low electrical conductivity. In this study, to overcome these shortcomings, a gas diffusion layer (GDL)-composite bipolar plate assembly was developed and its performance was experimentally verified. The graphite foil coating method developed in the previous study was applied to reduce the contact resistance between the bipolar plate and the GDL. In addition, in order to improve electron path in the stack and minimize the contact resistance between the GDL and the bipolar plate, a GDL-bipolar plate assembly was fabricated using a thin metal foil. As a result of the experiment, it was confirmed that the developed GDL-bipolar plate assembly had 98% lower electrical resistance compared to the conventional composite bipolar plate.

Rapid Thermal Annealing for Ag Layers on SiO2 Coated Metal Foils (이산화규소 증착된 스테인레스 기판위에 형성된 은 금속 박막의 급속 열처리에 대한 효과)

  • Kim, Kyoung-Bo
    • Journal of Convergence for Information Technology
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    • v.10 no.8
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    • pp.137-143
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    • 2020
  • This study examined the effects of rapid thermal annealing (RTA) on the physical and chemical characteristics of thin silver (Ag) layers on SiO2 coated metal foils. Ag layers were annealed at various temperatures of the range between 150 ℃ and 550 ℃ for 20 min. The surface roughness and resistivity are increased at the annealing temperatures of 550 ℃. We also found that oxygen (O) and silicon (Si) atoms exist at the Ag film surface by using compositional analysis in the annealing temperatures of 550 ℃. The total reflectance is decreased with increasing temperature. These phenomena are due to an out-diffusion of Si atoms from SiO2 layers during the RTA annealing. The results offer the possibility of using it as a substrate for various flexible optoelectronic devices.

Punching of Micro-Hole Array (미세 홀 어레이 펀칭 가공)

  • Son Y. K.;Oh S. I.;Rhim S. H.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2005.09a
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    • pp.193-197
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    • 2005
  • This paper presents a method by which multiple holes of ultra small size can be punched simultaneously. Silicon wafers were used to fabricate punching die. Workpiece used in the present investigation were the rolled pure copper of $3{\mu}m$ in thickness and CP titanium of $1.5{\mu}m$ in thickness. The metal foils were punched with the dies and arrays of circular and rectangular holes were made. The diameter of holes ranges from $2-10{\mu}m$. The process set-up is similar to that of the flexible rubber pad forming or Guerin process. Arrays of holes were punched successfully in one step forming. The punched holes were examined in terms of their dimensions, surface qualities, and potential defect. The effects of the die hole dimension on ultra small size hole formation of the thin foil were discussed. The optimum process condition such as proper die shape and diameter-thickness ratio (d/t) were also discussed. The results in this paper show that the present method can be successfully applied to the fabrication of ultra small size hole array in a one step operation.

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Effect of Plasma Treatment Times on the Adhesion of Cu/Ni Thin Film to Polyimide (폴리이미드와 Cu/Ni층과의 계면결합력에 미치는 플라즈마 처리 시간 효과)

  • Woo, Tae-Gyu;Park, Il-Song;Jung, Kwang-Hee;Jeon, Woo-Yong;Seol, Kyeong-Won
    • Korean Journal of Metals and Materials
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    • v.49 no.8
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    • pp.657-663
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    • 2011
  • This study represents the results of the peel strength and surface morphology according to the preprocessing times of polyimide (PI) in a Cu/Ni/PI structure flexible copper clad laminate production process based on the polyimide. Field emission scanning electron microscopy, X-ray diffraction, and X-ray photoelectron spectroscopy were used to analyze the surface morphology, crystal structure, and interface binding structure of sputtered Ni, Cu, and electrodeposited copper foil layers. The surface roughness of Ni, Cu deposition layers and the crystal structure of electrodeposited Cu layers were varied according to the preprocessing times. In the RF plasma times that were varied by 100-600 seconds in a preprocessing process, the preprocessing applied by about 300-400 seconds showed a homogeneous surface morphology in the metal layers and that also represented high peel strength for the polyimide. Considering the effect of peel strength on plastic deformation, preprocessing times can reasonably be at about 400 seconds.