• Title/Summary/Keyword: Flexible Electronics

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Modeling of Belt-Pulley and Flexible Coupling Effects on Submarine Driven System Electrical Motors

  • Jafarboland, Mehrdad;Zadehbagheri, Mahmoud
    • Journal of Power Electronics
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    • v.11 no.3
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    • pp.319-326
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    • 2011
  • Nowadays numerous research projects are being conducted in the field of electric motors. Non-modeling of flexible connections such as couplings and the belt-pulley do not show some real behaviors. With an increase in the number of connections and drive factors, these Non-modeled modes become more important. The coupling of two electric motors, instead of one motor, in submarine propeller force is an obvious example which shows that Non-modeled vibration modes caused by flexible connections can disturb controller operation and make undesirable vibrations in the submarine body. In this paper a dynamic model of flexible connections and a completed dynamic model of two different coupled electric models is presented. A robust controller for the completed model is also amended so that the two controlling targets of a desired speed adjustment and an appropriate load division between the two motors with sufficient accuracy are achieved.

Loss Characteristics of Flexible Dielectric Tube Waveguides using Commercial Polymer Substances in Millimeter Wave Band

  • Kim, Ki-Young;Youngsik Ahn;Sohn, Jon-Ryul;Tae, Heung-Sik
    • Proceedings of the Korea Electromagnetic Engineering Society Conference
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    • 2000.11a
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    • pp.233-237
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    • 2000
  • Propagation losses including bath transmission losses and bending losses of the flexible dielectric tube waveguide using commercial polymer substances for a short distance millimeter wave transmission are analytically predicted. The transmission loss and the bending loss are strongly dependent on the power flow distributions in each region. The obtained propagation tosses are compared with those of the commercial metal rigid and flexible waveguides.

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Planar Fashionable Circuit Board Technology and Its Applications

  • Lee, Seul-Ki;Kim, Bin-Hee;Yoo, Hoi-Jun
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.9 no.3
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    • pp.174-180
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    • 2009
  • A new flexible electronics technology, named P-FCB (Planar Fashionable Circuit Board), is introduced. P-FCB is a circuit board technology implemented on the plain fabric patch for wearable electronics applications. In this paper, the manufacturing of P-FCB, and its electrical characteristics such as sheet resistance, maximum current density, and frequency characteristics are reported. The fabrication methods and their electrical characteristics of passive devices such as resistor, capacitor, and inductor in P-FCB are discussed. In addition, how to integrate silicon chip directly to the fabric for the flexible electronics system are described. Finally, examples of P-FCB applications will be presented.

Bending effect of flexible liquid crystal display

  • Lin, Yan-Rung;Jeng, Shie-Chang;Kuo, Chia-Wei;Liao, Chi-Chang;Chen, Cheng-Chung;Shy, Joe-Tsong
    • 한국정보디스플레이학회:학술대회논문집
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    • 2007.08a
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    • pp.710-712
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    • 2007
  • The effects of stress on the IZO/PC substrate and the electro-optical properties of a flexible LCD with microstructure in bending were investigated. It showed that the IZO/PC substrate and the periodic cross spacers are good enough to be employed in the application of the ECB or polarization rotation LC mode.

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Study on Joint of Micro Solder Bump for Application of Flexible Electronics (플렉시블 전자기기 응용을 위한 미세 솔더 범프 접합부에 관한 연구)

  • Ko, Yong-Ho;Kim, Min-Su;Kim, Taek-Soo;Bang, Jung-Hwan;Lee, Chang-Woo
    • Journal of Welding and Joining
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    • v.31 no.3
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    • pp.4-10
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    • 2013
  • In electronic industry, the trend of future electronics will be flexible, bendable, wearable electronics. Until now, there is few study on bonding technology and reliability of bonding joint between chip with micro solder bump and flexible substrate. In this study, we investigated joint properties of Si chip with eutectic Sn-58Bi solder bump on Cu pillar bump bonded on flexible substrate finished with ENIG by flip chip process. After flip chip bonding, we observed microstructure of bump joint by SEM and then evaluated properties of bump joint by die shear test, thermal shock test, and bending test. After thermal shock test, we observed that crack initiated between $Cu_6Sn_5IMC$ and Sn-Bi solder and then propagated within Sn-Bi solder and/or interface between IMC and solder. On the other hands, We observed that fracture propated at interface between Ni3Sn4 IMC and solder and/or in solder matrix after bending test.

Transparent TIO/Ag NW/TIO Hybrid Electrode Grown on PET for Flexible Organic Solar Cell

  • Seo, Ki-Won;Lee, Ju-Hyun;Na, Seok-In;Kim, Han-ki
    • Proceedings of the Korean Vacuum Society Conference
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    • 2014.02a
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    • pp.394.2-394.2
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    • 2014
  • We fabricated highly transparent and flexible Ti doped In2O3 (TIO)/Ag nanowire(NW)/TIO (TAT) multilayer electrodes by linear facing target sputtering (LFTS) and brush-painting for used as flexible for anode organic solar cells(FOSCs). The characteristics of TAT transparent anode as a function of number of brush-painting cycles was also investigated. At optimized conditions we achieved highly flexible TAT multilayer electrodes with a low sheet resistance of $9.01{\Omega}/square$ and a high diffusive transmittance more than 80% in visible region as well as superior mechanical stability. The effective embedment of the Ag NW network between top and bottom TIO films led to a metallic conductivity, high transparency. Based on FE-SEM HRTEM, and XRD analysis, we can find that the Ag NW network was effectively embedded between top and bottom TIO layers due to good flexibility of Ag NW, the TAT multilayer showed superior flexibility than single TIO layer. Successful operation of FOSCs with high power conversion efficiency of 3.01% indicates that TAT hybrid electrode is a promising alternative to conventional ITO electrode for high performance FOSCs.

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Ultra Thin Reflective Flexible Liquid Crystal Display

  • Liu, Kang-Hung;Kuo, Chia-Wei;Ku, Chun-Kang;Chang, Chih-Yuan;Liao, Chi-Chang
    • 한국정보디스플레이학회:학술대회논문집
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    • 2008.10a
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    • pp.1080-1082
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    • 2008
  • An ultra-thin reflective flexible LCD film has been demonstrated. The 30% thickness of the display can be reduced by applying a quarter-wave-plate film as upper substrate. A low temperature alignment material and special designed photo spacer were applied in this new display. The bending behavior was improved by reduced thickness.

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Novel Backplane for AM-OLED Device

  • Sung, Myeon-Chang;Lee, Ho-Nyun;Kim, Chang Nam;Kang, Sun Kil;Kim, Do Youl;Kim, Seong-Joong;Kim, Sang-Kyoon;Kim, Sung-Kab;Kim, Hong-Gyu;Kim, Sung-Tae
    • 한국정보디스플레이학회:학술대회논문집
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    • 2007.08a
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    • pp.133-136
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    • 2007
  • IGZO TFTs were fabricated by conventional photolithography and wet-etching processes on metal substrates for the flexible display. The characteristics of TFTs on metal substrates were comparable to those of TFTs on glass substrates. Moreover, AM-OLED panels based on IGZO TFT arrays on metal substrates were successfully driven, for the first time.

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