• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.301-301
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• 2008

최근의 세라믹 공정기술은 고집적화 추세에 따라 그린시트의 두께가 얇아지면서 다층화되고 있으므로 fine patterning, Via Hole 크기의 최소화, Via Hole 간의 층간 연결을 위한 그린시트 층간 정밀도가 더욱 중요해지고 있다. 따라서 세라믹의 소성후 수축율 제어는 고집적 세라믹 기판 모듈 제작을 위한 핵심공정기술로 기술 개발에 대한 필요성이 증대되고 있다. 온 연구에서는 일축가압 이용한 PAS법 (Pressure Assisted Constrained Sintering)과 Al2O3를 희생층으로 이용한 Constrained법을 혼합하여 저온 동시소성 세라믹 기판의 x-y축 방향의 수축율을 zero로 제어하고자하였다. Al2O3/LTCC/Al2O3인 샌드위치 구조로 세라믹 시트를 적층하여 Load에 따른 소성수축율 및 LTCC 두께에 따른 Edge Curvature의 Radius를 측정하였다. 그 결과 소성온도 $900^{\circ}C$에서 Constrian Layer $500{\mu}m$, Load 0.92kg/cm3일때 LTCC의 두께가 $400{\mu}m$에서 $2500{\mu}m$로 증가함에 따라 Edge Curvature Radius가 $430{\mu}m$에서 $2200{\mu}m$로 증가하는 것을 확인하였다. 이때 소결 밀도는 2.95g/$cm^3$로 우수한 특성을 나타내었다.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.18 no.6
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• pp.551-557
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• 2009

A development of smart materials is becoming a prominent issue on present industries. A smart material, included in functions, is needed for micro fabrication. A shape memory alloy(SMA) in a smart material is best known material. Ni-Ti alloy, composed of nikel and titanium is one of the best shape memory alloy(SMA). Nitinol SMA is used for a lot of high tech industry such as aero space, medical device, micro actuator, sensor system. However, Ni-Ti SMA is difficult to process to make a shape and fabrications as traditional machining process. Because nitinol SMA, that is contained nikel content more than titanium content, has similar physical characteristics of titanium. In this paper, the characteristics of ECM grooving process for nitinol SMA are investigated by experiments. The experiments in this study are progressed for power, gap distance and machining time. The characteristics are found each part. Fine shape in work piece can be found on conditions; current 6A, duty factor 50%, gap distance 15%, gap distance $15{\mu}m$, machining time 10min.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.29 no.4 s.235
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• pp.504-511
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• 2005

The generation of fine relics of inorganic and metallic materials from precursor suspensions is of significant current interest as it holds the key to the fabrication of display and printed circuit board. Some novel printing methods depositing ceramic particles have been suggested in recent years. When a conducting liquid is supplied to a capillary nozzle at a low flow rate and when the interface between air and the liquid is charged to a sufficiently high electrical potential, the liquid meniscus takes the form of a stable cone, whose apex emits a microscopic jet. This is called as a cone-jet mode. In our experiments, an alumina particles flowing through a nozzle were subjected to electro-hydrodynamic printing in the cone-jet mode. The pattern of 'YONSEI' characters was tested at $10 {\mu}l/min$ of alumina ink flow rate and different applied voltages. At an applied voltage of 6 kV, feature size was in the range of $250 {\mu}m.$

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.17 no.5
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• pp.8-15
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• 2018

Films with special properties (e.g., water-repellent films, optical films, anti-reflection films, and flexible films) are referred to as functional films. Recently, there has been interest in fine patterning methods for film fabrication. In particular there have been many studies that use a UV nanoimprint process involving a UV curing method. In this paper, a polymer film was fabricated by the UV nanoimprint process with a micro-pattern, and its durability was evaluated by a wear test and a nano-indentation test. The film mechanical properties (such as coefficient of friction, hardness, and modulus of elasticity) were measured. Moreover, the choice of PUA type resin used in the UV nanoimprint process was confirmed to impact the durability of the thin film. Despite making the polymer film samples using the same method and PUA type resin, different coefficient of friction, hardness, and modulus of elasticity values were obtained. PUA 4 resin had the most favorable coefficient of friction, hardness, and modulus of elasticity. This material is predicted to produce a high durability functional film.

• Korean Journal of Materials Research
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• v.29 no.1
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• pp.59-64
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• 2019

This study investigates the optical characteristics of InGaN multiple quantum wells(MQWs) light emitting diodes(LEDs) on planar sapphire substrates(PSSs), nano-sized PSS(NPSS) and micro-sized PSS(MPSS). We obtain the results as the patterning size of the sapphire substrates approach the nanometer scale: The light from the back side of the device increases and the total light extraction becomes larger than the MPSS- and planar-LEDs. The experiment is conducted by Monte Carlo ray-tracing, which is regarded as one of the most suitable ways to simulate light propagation in LEDs. The results show fine consistency between simulation and measurement of the samples with different sized patterned substrates. Notably, light from the back side becomes larger in the NPSS LEDs. We strongly propose that the increase in the light intensity of NPSS LEDs is due to an abnormal optical distribution, which indicates an increase of extraction probability through NPSS.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.1-7
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• 2018

As the performance and density of IC (integrated circuit) devices increase, power and signal integrities in the global interconnects of advanced packaging technologies are becoming more difficult. Thus, the global interconnect technologies should be designed to accommodate increased input/output (I/O) counts, improved power grid network integrity, reduced RC delay, and improved electrical crosstalk stability. This requirement resulted in the fine-pitch interconnects with a low-k dielectric in 3D packaging or wafer level packaging structure. This paper reviews an organic-inorganic hybrid material as a potential dielectric candidate for the global interconnects. An organic-inorganic hybrid material called polysiloxane can provide spin process without high temperature curing, an excellent dielectric constant, and good mechanical properties.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.38 no.8
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• pp.709-714
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• 2014

Reverse-offset printing is one of the technologies that can be used for patterning fine features of the order of a few micrometers for printed electronics. In reverse-offset printing, a coated ink film is transferred to a blanket made of elastomer-like poly-dimethylsiloxane. Then, the blanket is impressed onto a clich$\acute{e}$ that has intaglio patterns. The blanket is deformed by penetrating the intaglio of the clich$\acute{e}$ according to the printing pressure. Excessive deformation of the blanket can cause printing defects upon touching the bottom of the intaglio pattern, especially in large patterns. In this paper, we modelled the deformation of the blanket using the finite element method. Considering the actual printing parameters, a condition for fabricating a clich$\acute{e}$ is proposed to prevent defects by the deformation of the blanket.

• Journal of the Korean Ceramic Society
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• v.41 no.10 s.269
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• pp.788-791
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• 2004

We have studied the fabrication of silver micro lines using the silver nano sol on ITO substrate by an ink-jet method. The average particles size of $10wt\%$ silver nano sol synthesized with polyelectrolytes was smaller than 10 nm. The pattern formation of silver nano sol on the substrate closely related with the contact angle of the silver nano sol. The dot shaped of silver nano sol on bare ITO substrate was formed due to the high contact angle of silver nano sol. When ITO substrates was treated with 100 ppm polyethylenimine for silver nano sol patterning, fine silver micro lines of $60{\sim}100{\mu}m$ width was fabricated by ink-jet method.

• Journal of the Korean Home Economics Association
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• v.38 no.1
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• pp.75-87
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• 2000

The aims of this study are to establish a mode of housing life style that meet the demands of families living in big cities, and the contribute to the development of a better housing life style pattern by considering metropolitan residents' choice of housing and basic concepts of their behavioral patterns. The results of this study were as follows: 1. Value orientation of family life was divided into value orientation of family and value orientation of housing. Value orientation of family was constituted of four factors such as 'harmony', 'leisure and hobbies', 'individual development and its support' , 'education' . Value orientation of housing is constituted of three factors such as 'physical characteristics of house' , '\`environmental condition', 'socio-economic conditions of housing'. The comprehensive life values were constituted of six factors such as 'the importance of communal family', 'the importance of housing decoration and housing life benefits', 'the importance of security and holding environment' , 'the importance of familial harmony', 'the importance of privacy', 'the importance of convenience and natural environment'. Based on three factors, were found to be fine types of value orientation of family life which were 'pursue healthy of family', 'comfort of family', 'clean environment', 'convenient environment', and 'harmonious relationship among family members'. Variables influencing the value orientation of family life were property and price of housing. 2. Consumption propensity when buying house, furniture and durables were constituted of four factors which were propensity to 'beauty', 'fashion', 'tradition and symbol', and 'pragmatic use'. Based on these factors, there were found to be four types of consumption propensity when buying house, furniture and durables which were 'fashion', 'tradition and symbol', 'beauty', and 'pragmatic use'. Variables influencing spending habits were found to be objective social class (SES), types of residence, wife's educational background, and price of housing. 3. Propensity to using space were constituted of three factors which were 'convenience', 'politeness and social grace', and 'housekeeping'. Based on these factors, there were found to be three types of propensity to using space which were 'individuality', 'convenience', and 'politeness and housekeeping'. Variables influencing propensity to use of space were found to be objective social class (SES), wife's educational background, types of homeownership and price of housing 4. According to this study, there were found to be six patterns of housing life style: 1) family that seeks formalist life, 2) family that seeks harmonious life, 3) family that seeks active healthy life, 4) family that combine various factors, 5) family that seeks convenience, 6) family that stresses environment.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.11a
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• pp.11-11
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• 2000

이동통신기술의 급격한 발달로 고주파회로의 packaging과 interconnect 기술의 고성능화 와 저가격화에 대한 새로운 도전이 요구되고 있다‘ 대부분 기존의 무선통신 부품은 P PCB(Printed Wiring Board)기술을 활용하고 있으나 이러한 기술이 점차로 고주파화되는 경 향을 만족시킬수 없어 새로운 고주파 부품기술이 요구되고 있는 실정이다 .. RF 회로를 구성 하기 위하여 PCB소재의 환경적, 치수안정성 문제를 극복하기 위하여 L TCC(Low T Temperature Cofired Ceramics)기술이 최근 주목을 받고 있다. 차세대 이동통신 기술은 수십 GHz 이상의 고주파특성이 우수하고, 고성능의 초소형의 부품을 저가격으로 제조할수 있으며, 시장의 변화에 기민하게 대처할수 있는 기술이 요구되 고 있으며, 이러한 기술적 필요성에 부합할수 있도록 LTCC 기술이 제안되었다. 이러한 C Ceramic Interconnect 기술은 높은 신뢰성을 바탕으로 fine patterning 기술과 저가의 m metallizing 기술로 가능하게 되었다. 초고주파 통신부품기술은 미국과 유럽 등을 중심으로 G GHz 대역또는 mm wave 대역의 기술에 대하여 치열한 기술개발 경쟁을 벌이고 있으며, 이 러한 고주파 패키징 기술을 바탕으로 미래의 군사, 항공, 우주 및 이동통신 기술에 지대한 영향을 미칠수 있는 기반기술로 자리잡을 전망이다. L LTCC 기술은 기존의 후막혼성기술에 비하여 공정이 단순하고 대량생산이 가능하고 가 격이 비교적 저렴하다. 또한 다층구조로 제작할수 있고, 수동소자를 내장할수 있어 회로의 소형화와 고밀도화가 가능하다. 특히 무선으로 초고속 정보를 처리하기 위하여 이동통신기 기의 고주파화가 빠르게 진행됨에 따라서 고분자재료에 비하여 고주파특성이 우수할뿐아니 라 환경적, 치수안정성이 우수한 세라믹소재플 사용함으로써 고주파 손실율을 저감할 수 있 다 .. LTCC 기술은 후막회로 기술과 tape dielectric 기술이 결합된 기술이다. 표준화된 소재 와 공정기술을 활용하여 저가격으로 고성능소자플 제작할 수 있으며, 전극재료로서 높은 전 도도를 갖고 있는 Ag, Cu, Au 및 Pd! Ag릎 사용함으로써 고주파 손실을 저감시킬 수 있다. L LTCC 기술이 최종적으로 소형화, 고기능 고주파 부품기술로 지속적으로 발전하기 위하여 무수축(Zero shrinkage) 소성기술, 광식각 후막기술 등이 원천기술로서 확립될 수 있어야 하 며, 특히 국내의 이동통신 기술에 대한 막대한 투자에도 불구하고 차세대 이동통신 부품기 술에 대한 개발은 상대적으로 미흡한 실정이므로 국내에 LTCC 관련 소재공정 및 부품소자 기술에 대한 개발투자가 시급히 이루워져야 할 것으로 판단된다. 본 발표에서는 지금까지 국내외 LTCC 기술의 발전과정을 정리하였고, 현재 이 기술의 응용과 소재와 공정을 중심으로한 개발현황에 대하여 조사하였으며, 앞으로 LTCC가 발전 해야할 방향을 제시하고자 한다.