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http://dx.doi.org/10.6117/kmeps.2018.25.4.001

Organic-inorganic Hybrid Dielectric with UV Patterning and UV Curing for Global Interconnect Applications  

Song, Changmin (Graduate School of Nano-IT Design Convergence, Seoul National University of Science and Technology)
Park, Haesung (Department of Mechanical Engineering, Seoul National University of Science and Technology)
Seo, Hankyeol (Media IT Engineering Program, Seoul National University of Science and Technology)
Kim, Sarah Eunkyung (Graduate School of Nano-IT Design Convergence, Seoul National University of Science and Technology)
Publication Information
Journal of the Microelectronics and Packaging Society / v.25, no.4, 2018 , pp. 1-7 More about this Journal
Abstract
As the performance and density of IC (integrated circuit) devices increase, power and signal integrities in the global interconnects of advanced packaging technologies are becoming more difficult. Thus, the global interconnect technologies should be designed to accommodate increased input/output (I/O) counts, improved power grid network integrity, reduced RC delay, and improved electrical crosstalk stability. This requirement resulted in the fine-pitch interconnects with a low-k dielectric in 3D packaging or wafer level packaging structure. This paper reviews an organic-inorganic hybrid material as a potential dielectric candidate for the global interconnects. An organic-inorganic hybrid material called polysiloxane can provide spin process without high temperature curing, an excellent dielectric constant, and good mechanical properties.
Keywords
Dielectric; PSSQ; Global Interconnect; UV Curing; Metallization;
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