Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Organic-inorganic Hybrid Dielectric with UV Patterning and UV Curing for Global Interconnect Applications

글로벌 배선 적용을 위한 UV 패턴성과 UV 경화성을 가진 폴리실록산

  • Song, Changmin (Graduate School of Nano-IT Design Convergence, Seoul National University of Science and Technology) ;
  • Park, Haesung (Department of Mechanical Engineering, Seoul National University of Science and Technology) ;
  • Seo, Hankyeol (Media IT Engineering Program, Seoul National University of Science and Technology) ;
  • Kim, Sarah Eunkyung (Graduate School of Nano-IT Design Convergence, Seoul National University of Science and Technology)
  • 송창민 (서울과학기술대학교 나노IT디자인융합대학원) ;
  • 박해성 (서울과학기술대학교 일반대학원 기계공학과) ;
  • 서한결 (서울과학기술대학교 정보통신대학 전자IT미디어공학과) ;
  • 김사라은경 (서울과학기술대학교 나노IT디자인융합대학원)
  • Received : 2018.10.30
  • Accepted : 2018.12.24
  • Published : 2018.12.31
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Abstract

As the performance and density of IC (integrated circuit) devices increase, power and signal integrities in the global interconnects of advanced packaging technologies are becoming more difficult. Thus, the global interconnect technologies should be designed to accommodate increased input/output (I/O) counts, improved power grid network integrity, reduced RC delay, and improved electrical crosstalk stability. This requirement resulted in the fine-pitch interconnects with a low-k dielectric in 3D packaging or wafer level packaging structure. This paper reviews an organic-inorganic hybrid material as a potential dielectric candidate for the global interconnects. An organic-inorganic hybrid material called polysiloxane can provide spin process without high temperature curing, an excellent dielectric constant, and good mechanical properties.

Keywords

MOKRBW_2018_v25n4_1_f0001.png 이미지

Fig. 1. Schematic diagrams of device structures.

MOKRBW_2018_v25n4_1_f0002.png 이미지

Fig. 2. RC Delay Trends for transistor and interconnect.

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Fig. 3. Schematic diagram of organic-inorganic material structure.

MOKRBW_2018_v25n4_1_f0004.png 이미지

Fig. 4. Example of patterning characteristic of polysiloxane (SEM images).

Table 1. List of dielectrics.7-11)

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Table 2. Material properties of selected organic-based dielectrics.16)

MOKRBW_2018_v25n4_1_t0002.png 이미지

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