• Journal of the Microelectronics and Packaging Society
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• v.29 no.2
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• pp.99-105
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• 2022

As the chip size gets smaller, the width of the electrode line is also fine, and the density of interconnections is increasing. As a result, RC delay is becoming a problem due to the difference in resistance between the capacitor layer and the electrical conductivity layer. To solve this problem, the development of electrodes with high electrical conductivity and dielectric materials with low dielectric constant is required. In this study, we developed low dielectric ink by mixing commercial PSR which protect PCB's circuits from external factors and PI with excellent thermal property and low-k characteristics. As a result, the ink mixture of PSR and PI 10:3 showed the best results, with a dielectric constant of about 2.6 and 2.37 at 20 GHz and 28 GHz, respectively, and dielectric dissipation was measured at about 0.022 and 0.016. In order to verify the applicability of future applications, various line-width transmission lines produced on Teflon were evaluated, and as a result, the loss of transmission lines using low dielectric ink mixed with PI was 0.12 dB less on average in S21 than when only PSR was used.

• Journal of Fashion Business
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• v.16 no.5
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• pp.57-73
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• 2012

The main objective of this research was to understand the characteristics of pleats design through the analysis of modern female fashion as they appear in the 'Collections' from '09 A/W to '12 S/S. Data collection of 1027 was done through the review of 'pr$\hat{e}$t-$\grave{a}$-porter Collections' of three cities; Milan, New York, Paris. Along with the qualitative interpretation of pleats design, statistical analysis of frequency and ${\chi}^2$-test were completed for data analysis. The main findings were as follows; 1. The five types of pleats design were founded in the order of accordion, knife, box, inverted, and sunburst pleats. The frequency and ratio of pleats design occurency showed significant difference between collections. 2. There were significant difference between the types of pleats and their line characteristics of thickness, continuity, length, direction. = Thin fabrics with delicate fine folds were mainly appeared in accordion and sunburst pleats. On the other hand, midium thickness fabrics were used for knife, box & inverted pleats, however, the different images were projected according to the width and the number of folds, characteristics of fabrics and textures. = In all the type of pleats but sunburst, continuity line was appeared the most. The discontinuous lines were appeared the most in the layered types and, sometimes, at some construction lines to add some decorative details or design variations. = The long line were the most frequently appeared in long one-pieces or long skirts of knife, accordion, sunburst pleats. While, the shorter lines showed the most frequently in box and inverted pleats, which mainly used for skirts or the lower part of one-piece. = For the line directions, the vertical lines were the most frequently appeared, and followed by mixed and diagonal line. In mixed or diagonal lines, same type of pleat was repeated in one design. For diagonal lines, one direction was mainly used, however, the symmetrical arrangements or repeated diagonal pleats in various directions also used. In mixed lines, the type of one or two diagonal and one vertical line was the most frequently appeared.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.1
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• pp.21-28
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• 2004

We have demonstrated the applicability of dry film photoresist (DFR) in photolithography process for fine pitch solder bumping on the polytetrafluoroethylene (PTFE/Teflon ) printed circuit board (PCB). The copper lines were formed with 100$\mu\textrm{m}$ width and 18$\mu\textrm{m}$ thickness on the PTFE test board, and varying the gaps between two copper lines in a range of 100-200$\mu\textrm{m}$. The DFRs of 15$\mu\textrm{m}$ thickness were laminated by hot roll laminator, by varying laminating temperature from $100{\circ}C$ to 15$0^{\circ}C$ and laminating speed from 0.28-0.98cm/s. We have found the optimum process of DFR lamination on PTFE PCB and accomplished the formation of indium solder bumps. The optimum lamination condition was temperature of $150^{\circ}C$ and speed of about 0.63cm/s. And the smallest size of indium solder bump was diameter of 50$\mu\textrm{m}$ with pitch of 100$\mu\textrm{m}$.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.37 no.9
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• pp.873-877
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• 2013

The application of inkjet technology has been broadening from home printers to manufacturing tools. Recently, there have been demands for high-resolution printing, especially in the field of printed electronics applications. To improve upon the conventional inkjet printing patterning method, electrohydrodynamic (EHD) inkjet technology has recently attracted attention because droplets smaller than the nozzle diameter can be ejected and materials with wider viscosity range can be used for jetting. In this study, an EHD jet printing system for fine patterning is presented. To print various patterns based on drop on demand printing, vector and raster printing algorithm are implanted in the printing software. Fine conductive patterns with line width of less than $7{\mu}m$ can be easily achieved via EHD jet using a nozzle with inner diameter of $8{\mu}m$.

• Journal of the Korean Vacuum Society
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• v.5 no.4
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• pp.309-314
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• 1996

We found that SOG which had been used in plarnarization of VLSI circuit fabrication at present could be used as a resist material for AFM lithography. In this experiment on the basis of previous studies, we improved the process flexibility by controlling the coating film thickness, etching time, etching selectively and proper applied voltage on the pattern size to apply for practical VLSI lithography process. We obtained pattern with the current of 5 nA at 60 V. The line width was 800 $\AA$. With the developed flexibility of SOG as a resist material, AFM lithography will be a expedient technique in the next generation DRAM fabrication.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.24 no.5
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• pp.374-380
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• 2011

In this paper a printing process for patterning electrodes on large area substrate was developed by combining screen printing with reverse off-set printing. Ag ink was uniformly coated by screen printing. And then etching resist (ER) was patterned in the Ag film by reverse off-set printing, and then the non-desired Ag film was etched off by etchant. Finally, the ER was stripped-off to obtain the final Ag patterns. We extracted the suitable conditions of reverse Using the process we successfully fabricated gate electrodes and scan bus lines of OTFT-backplane used for e-paper, in which the diagonal size was 6 inch, the resolution $320{\times}240$, the minimum line width 30 um, and sheet resistance 1 ${\Omega}/{\Box}$.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.26 no.6
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• pp.462-467
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• 2013

In this paper, we analyzed the effects of doctoring process on the patterns of Ag ink in gravure off-set printing. The parameters of doctoring process were the angle and the pressure, which was represented by the depth of blade movement to the gravure roll, of doctor blade to the surface of gravure roll, and the angle of patterns engraved on the gravure roll to the doctor blade moving direction. The proper parameters were extracted for the fine patterns and they were 15 mm for the pressure, $60^{\circ}$ for the blade angle. And the angle of patterns with respect to the blade movement should be less than $40^{\circ}$ for the best results. The gravure off-set printing with the above parameters was carried out to print gate electrodes and scan bus lines of OTFT-backplane for e-paper. The line width of $50{\mu}m$ was successfully obtained. The thickness of electrodes was $2.5{\mu}m$ and the surface roughness was $0.65{\mu}m$ and the sheet resistance was $15.8{\Omega}/{\Box}$.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.9 no.3
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• pp.56-61
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• 2010

Recently, UV pulse laser is widely used in micro machining of the research, development and industry field of IT, NT and BT products because the laser short wavelength provides not only micro drilling, micro cutting and micro grooving which has a very fine line width, but also high absorption coefficient which allows a lot of type of materials to be machined more easily. To analyze the dynamic deformation during a very short processing time, which is nearly about several tens nanoseconds, the commercial Finite Element Analysis (FEA) code, LS-DYNA 3D, was employed for the computitional simulation of the UV laser micro machining behavior for thin copper material in this paper. A finite element model considering high strain rate effect is especially suggested to investigate the micro phenomena which are only dominated by mechanically pressure impact in disregard of thermally heat transfer. From these computational results, some of dynamic deformation behaviors such as dent deformation shapes, strains and stresses distributions were observed and compared with previous experimental works. These will help us to understand micro interaction between UV laser beam and material.

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.217-221
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• 2002

In the coarse grain HAZ adjacent to the fusion line, most of the TiN particles in conventional Ti added steel are dissolved and austenite grain growth is easily occupied during welding process. To avoid this difficulty, thermal stability of TiN particle is improved by increasing the nitrogen content in steel. In this study, the effect of high nitrogen TiN particle on preventing austenite grain growth in HAZ was investigated. Increased thermal stability of TiN particle is helpful for preventing the austenite grain growth by pinning effect. High nitrogen TiN particle in simulated HAZ were not dissolved even at high temperature such as 1400 C and prevented the austenite grain growth in simulated HAZ. Owing to small austenite grain size in HAZ the width of coarse grain HAZ in high nitrogen TiN steel was decreased to 1/10 of conventional TiN steel. Even high heat input welding, the microstructure of coarse grain HAZ consisted of fine polygonal ferrite and pearlite and toughness of coarse grain HAZ was significantly improved.

• Transactions of the Korean Society of Mechanical Engineers
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• v.8 no.3
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• pp.224-231
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• 1984

Having found by means of a tension-shear test an optimal spot welding condition under which the maximum weld strength is to be brought forth, this study made an examination of behavior of fracture concerned with behavior of stress distribution, observed around the nugget periphery of the specimens prepared under the optimal conditions, with one point spot welded mild steel sheets. The resultant findings are as follows: (1)There remarkably exists an optimal spot welding condition to indicate the maximum weld strength, and fracture of the specimens spot welded under that condition occurs outside the nugget boundary. (2)An experiment on the basis of a photoelastic model reveals that the maximum stress is distributed along the center line of the steel plate width but occurs on the region corresponding to heat affected zone of spot welds. (3)Heat affected zone of spot welds consists of coarse grains with considerably low micro Vickers hardness value and of fine grains of high micro Vickers hardness value, and in this unbalanced structure weak region are represented in coarse grain region, where fracture is initiated and continues its propagation.