• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2007년도 7th International Meeting on Information Display 제7권2호
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• pp.1600-1602
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• 2007

TPS (Temperature Programmed Sublimation) technology is known to research for the plane evaporation of the organic film.[5] Using TPS technology, the plane source evaporation of NPB organic film has been studied for the first time. The NPB organic film consists of nano scale film phase and bulk phase on a substrate. The 400 ${\AA}$ in film phase thickness of NPB sublimates at the $175^{\circ}$ of the Ta made metal plate. It was proved that the sublimation temperature of the organic film has much lower than that of the organic powder. ($130^{\circ}$ is lower for Alq3 and $90^{\circ}$ is lower for NPB.)

• 한국표면공학회지
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• 제44권4호
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• pp.137-143
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• 2011

The internal stress and magnetic properties (coercivity and squareness) of Ni-Fe nano thin film synthesized by electrodeposition method were studied as a function of acidic chloride bath conditions (composition and temperature) and current density. Fe deposition patterns were different depending on the temperature of the solution, the stress of film decreased with increasing the solution temperature, and the depending on the amount of Fe deposition showed a parabolic shape. The grain size of film was inversely proportional to stress of thin film. The internal stress of thin film and magnetic properties were deeply relevant, and the stress of thin film had a relationship with bath conditions and grain size of the thin film surface.

• 한국세라믹학회지
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• 제45권9호
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• pp.567-571
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• 2008

The properties of a grown film by the chemical vapor deposition process depend on the deposition temperature because the deposition mechanism of the CVD film is controlled by the deposition temperature. The preferred orientation of the zrC film changed from (111) to (220) or (200) with an increase of the deposition temperature. The grain size of the ZrC film changes from $0.8{\mu}m$ to $2.5{\mu}m$ in the range of 1350 to $1500^{\circ}C$. The hardness of the deposited ZrC film depended on the preferred orientation and the grain size. The hardness of the ZrC film deposited at $1400^{\circ}C$ was 31 GPa.

• Tribology and Lubricants
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• 제23권6호
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• pp.288-297
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• 2007

Adhesion and friction tests were carried out in order to investigate the effect of temperature on the tribological characteristics of poly (methylmethacrylate) (PMMA) film using AFM. The pull-off and friction forces on the PMMA film were measured under a high vacuum condition (below $1{\times}10^{-4}$ Pa) as the temperature of the PMMA film was increased from 300 K to 420 K (heating) and decreased to 300K (cooling). Friction tests were also conducted in both high vacuum and air conditions at room temperature. When the temperature was 420 K, which is 25 K higher than the glass transition temperature $(T_g)$ of PMMA, the PMMA film surface became deformable. Subsequently, the pull-off force was proportional to the maximum applied load during the pull-off force measurement. In contrast, when the temperature was under 395 K, the pull-off force showed no correlation to the maximum applied load. The friction force began to increase when the temperature rose above 370 K, which is 25 K lower than the $T_g$ of PMMA, and rapidly increased at 420 K. Decrease of the PMMA film stiffness and plastic deformation of the PMMA film were observed at 420 K in force-displacement curves. After the heating to 420 K, the fiction coefficient was measured under the air condition at room temperature and was found to be lower than that measured before the heating. Additionally, the RMS roughness increased as a result of the heating.

• 한국윤활학회:학술대회논문집
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• 한국윤활학회 2000년도 제31회 춘계학술대회
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• pp.114-120
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• 2000

EHL analysis of connecting rod bearing is proposed which includes effects of temperature variation in lubrication film. Lubrication film temperature is treated as a time-dependent, two-dimensional variable which is averaged over the film thickness, while connecting rod big end temperature is assumed to be time-independent and three-dimensional. It is assumed that a portion of the heat generated by viscous dissipation in the lubrication Him is absorbed by the film itself, and the remainder flows into the bearing surface. Mass-conserving cavitation algorithm is applied and the effect of variable viscosity is included to solve the Reynolds equation. Simulation results of the connecting rod bearing of internal combustion engine are presented. It is shown that the temperature variation has remarkable effects on the bearing performance. It is concluded that the EHL analysis considering effects of the temperature variation is strongly recommended to predict the bearing performance of connecting rod big end On internal combustion engine.

• 한국세라믹학회지
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• 제28권6호
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• pp.437-442
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• 1991

Temperature and atmosphere dependence of electrical conduction of the metal Cu, Ag, Au films, vaccum evaporated on glass, was investigated. The structural changes of the metal films were examined by SEM and high temperature XRD. The electrical resistance slightly increased with initial temperature increase up to the inflection point and decreased to minimum value, after this rapidly increased with further temperature increased below minimum. These phenomena were caused by the thermally induced film failure as a result of the mass transport. The temperature for the film failure increased in the order of O2, Air, Vacuum, N2, Ar in Cu, Ag films and Air, Vacuum, N2, Ar in Au film. The increase of resistance at the lower temperature range was attributed to the lattice distortion by disordered crystal structure, while the decreasing resistance was attributed to the removal of structural defects and film densification.

• 한국세라믹학회지
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• 제31권2호
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• pp.171-176
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• 1994

The spin-casted PLZT(9/65/35) thin films through polymeric sol-gel process were prepared on Pt substrate. The crack-free, uniform and dense films were obtained by post-annealing at the temperature between 35$0^{\circ}C$ and $700^{\circ}C$. The composite structure mixed together with large grains called "rosette" and surrounding small grains were observed on the films annealed over $600^{\circ}C$. Pyrochlore phase was completely changed to perovskite phase above $600^{\circ}C$ with the increase of annealing temperature. Dielectric constant (k) was larger with the increase of film thickness and annealing temperature. from the measurements of dielectric constant as a function of measuring temperature, it was also observed that Curie temperature was shifted to higher temperature with the increase of film thickness and annealing temperature. The pyroelectric coefficient(P) of 10 times coated film annealed at $700^{\circ}C$ was 65 $\mu$C/$\textrm{cm}^2$.K.$.K.

• 대한기계학회논문집A
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• 제27권4호
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• pp.479-484
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• 2003

In this paper, film thickness and temperature distribution are measured in EHL point contact at high slip ratios. Infrared temperature mapping with two band pass fillers. proposed by Ausherman (1976). is used to measure temperature distribution. And the optical interferornetric method with two filters (red and green filters) is used to measure film thickness. Result of experiment showed that temperature rising at film and ball surface occurred very dramatically in Dimple zone. As slip velocity, slip ratio and load increased, size of Dimple and temperature rising became more large In addition, Position and shape of Dimple we changed by slip ratios, and increasing of Dimple size decreased traction coefficient. In short, it is appointed that the Dimple phenomenon be developed by the effect of viscosity wedge.

• 한국전기전자재료학회논문지
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• 제16권12S호
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• pp.1305-1309
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• 2003

To utilize FeCoSiB amorphous films for magnetoelastic sensors, the temperature dependency of magnetization (M-T curve) and the magnetization properties of the amorphous films were investigated in this study. As the amount of cobalt In the films increased, the Curie temperature decreased but the crystallization temperature increased. In addition to this, the crystallization temperature was lower than the Curie temperature in the film containing 20 at% cobalt. The optimized annealing condition was set up by analyzing the H-T curve. And then, the amorphous film that has excellent magnetic properties and uni-axal anisotropy could be prepared for construction of the magnetoelastic sensor devices. The coercive force of the film was below 0.5 Oe and the anisotripic field was about 5 Oe.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2011년도 제40회 동계학술대회 초록집
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• pp.288-289
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• 2011

Indium Tin Oxide (ITO) is a typical highly Transparent Conductive Oxide (TCO) currently used as a transparent electrode material. Most widely used deposition method is the sputtering process for ITO film deposition because it has a high deposition rate, allows accurate control of the film thickness and easy deposition process and high electrical/optical properties. However, to apply high quality ITO thin film in a flexible microelectronic device using a plastic substrate, conventional DC magnetron sputtering (DMS) processed ITO thin film is not suitable because it needs a high temperature thermal annealing process to obtain high optical transmittance and low resistivity, while the generally plastic substrates has low glass transition temperatures. In the room temperature sputtering process, the electrical property degradation of ITO thin film is caused by negative oxygen ions effect. This high energy negative oxygen ions(about over 100eV) can be critical physical bombardment damages against the formation of the ITO thin film, and this damage does not recover in the room temperature process that does not offer thermal annealing. Hence new ITO deposition process that can provide the high electrical/optical properties of the ITO film at room temperature is needed. To solve these limitations we develop the Magnetic Field Shielded Sputtering (MFSS) system. The MFSS is based on DMS and it has the plasma limiter, which compose the permanent magnet array (Fig.1). During the ITO thin film deposition in the MFSS process, the electrons in the plasma are trapped by the magnetic field at the plasma limiters. The plasma limiter, which has a negative potential in the MFSS process, prevents to the damage by negative oxygen ions bombardment, and increases the heat(-) up effect by the Ar ions in the bulk plasma. Fig. 2. shows the electrical properties of the MFSS ITO thin film and DMS ITO thin film at room temperature. With the increase of the sputtering pressure, the resistivity of DMS ITO increases. On the other hand, the resistivity of the MFSS ITO slightly increases and becomes lower than that of the DMS ITO at all sputtering pressures. The lowest resistivity of the DMS ITO is $1.0{\times}10-3{\Omega}{\cdot}cm$ and that of the MFSS ITO is $4.5{\times}10-4{\Omega}{\cdot}cm$. This resistivity difference is caused by the carrier mobility. The carrier mobility of the MFSS ITO is 40 $cm^2/V{\cdot}s$, which is significantly higher than that of the DMS ITO (10 $cm^2/V{\cdot}s$). The low resistivity and high carrier mobility of the MFSS ITO are due to the magnetic field shielded effect. In addition, although not shown in this paper, the roughness of the MFSS ITO thin film is lower than that of the DMS ITO thin film, and TEM, XRD and XPS analysis of the MFSS ITO show the nano-crystalline structure. As a result, the MFSS process can effectively prevent to the high energy negative oxygen ions bombardment and supply activation energies by accelerating Ar ions in the plasma; therefore, high quality ITO can be deposited at room temperature.