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http://dx.doi.org/10.3795/KSME-A.2003.27.4.479

Measurements of Film Thickness and Temperature Distribution in Dimple Zone Developed in EHL Point Contact at High Slip Ratios  

Kim, Sung-Gi (KAIST 기계공학과)
Kazuyuki Yagi (TIT(동경공업대학))
Tsunamitsu Nakahara (TIT(동경공업대학))
Keizi Kyougoku (TIT(동경공업대학))
Kim, Kyung-Woong (KAIST 기계공학과)
Publication Information
Transactions of the Korean Society of Mechanical Engineers A / v.27, no.4, 2003 , pp. 479-484 More about this Journal
Abstract
In this paper, film thickness and temperature distribution are measured in EHL point contact at high slip ratios. Infrared temperature mapping with two band pass fillers. proposed by Ausherman (1976). is used to measure temperature distribution. And the optical interferornetric method with two filters (red and green filters) is used to measure film thickness. Result of experiment showed that temperature rising at film and ball surface occurred very dramatically in Dimple zone. As slip velocity, slip ratio and load increased, size of Dimple and temperature rising became more large In addition, Position and shape of Dimple we changed by slip ratios, and increasing of Dimple size decreased traction coefficient. In short, it is appointed that the Dimple phenomenon be developed by the effect of viscosity wedge.
Keywords
Dimple; EHL; Viscosity Wedge; High Slip Ratios; Infrared Temperature Mapping;
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