• 제목/요약/키워드: Film Information

검색결과 2,260건 처리시간 0.029초

FBAR용 ZnO 박막의 열처리 온도변화에 따른 미세조직 및 전기적 특성 (Microstructure and Electrical Properties of ZnO Thin Film for FBAR with Annealing Temperature)

  • 김봉석;강영훈;조유혁;김응권;이종주;김용성
    • 한국세라믹학회지
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    • 제43권1호
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    • pp.42-47
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    • 2006
  • In this paper, we prepared high-quality ZnO thin films for application of FBAR (Film Bulk Acoustic Resonator) by using pulse DC magnetron sputtering. To prevent the formation of low dielectric layers between metal and piezoelectric layer, Ru film of 30 nm thickness was used as a buffer layer. In addition we investigated the influence of annealing condition with various temperatures. As the annealing temperature increased, the crystalline orientation with the preference of (002) c-axis and resistance properties improved. The single resonator which was fabricated at $500^{\circ}C$ exhibited the resonance frequency and the return loss 0.99 GHz and 15 dB, respectively. This work demonstrates potential feasibility for the use of thin film Ru buffer layers and the optimization of annealing condition.

Impedance Matching of Electrically Small Antenna with Ni-Zn Ferrite Film

  • Lee, Jaejin;Hong, Yang-Ki;Lee, Woncheol;Park, Jihoon
    • Journal of Magnetics
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    • 제18권4호
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    • pp.428-431
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    • 2013
  • We demonstrate that a partial loading of $Ni_{0.5}Zn_{0.5}Fe_2O_4$ (Ni-Zn ferrite) film remarkably improves impedance matching of electrically small $Ba_3Co_2Fe_{24}O_{41}$ ($Co_2Z$) hexaferrite antenna. A 3 ${\mu}m$ thick Ni-Zn ferrite film was deposited on a silicon wafer by the electrophoresis deposition process and post-annealed at $400^{\circ}C$. The fabricated Ni-Zn ferrite film has saturation magnetization of $268emu/cm^3$ and coercivity of 89 Oe. A partial loading of the Ni-Zn ferrite film on the $Co_2Z$ hexaferrite helical antenna increases antenna return loss to 24.7 dB from 9.0 dB of the $Co_2Z$ antenna. Experimental results show that impedance matching and maximum input power transmission to the antenna without additional matching elements can be realized, while keeping almost the same size as the $Co_2Z$ antenna size.

a-Si:H Photodiode Using Alumina Thin Film Barrier

  • Hur Chang-Wu;Dimitrijev Sima
    • Journal of information and communication convergence engineering
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    • 제3권4호
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    • pp.179-183
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    • 2005
  • A photodiode capable of obtaining a sufficient photo/ dark current ratio at both forward bias state and reverse bias state is proposed. The photodiode includes a glass substrate, an aluminum film formed as a lower electrode over the glass substrate, an alumina film formed as an insulator barrier over the aluminum film, a hydrogenated amorphous silicon film formed as a photo conduction layer over a portion of the alumina film, and a transparent conduction film formed as an upper electrode over the hydro-generated amorphous silicon film. A good quality alumina $(Al_2O_3)$ film is formed by oxidation of aluminum film using electrolyte solution of succinic acid. Alumina is used as a potential barrier between amorphous silicon and aluminum. It controls dark-current restriction. In case of photodiodes made by changing the formation condition of alumina, we can obtain a stable dark current $(\~10^{-12}A)$ in alumina thickness below $1000{\AA}$. At the reverse bias state of the negative voltage in ITO (Indium Tin Oxide), the photo current has substantially constant value of $5{\times}10^{-9}$ A at light scan of 100 1x. On the other hand, the photo/dark current ratios become higher at smaller thicknesses of the alumina film. Therefore, the alumina film is used as a thin insulator barrier, which is distinct from the conventional concept of forming the insulator barrier layer near the transparent conduction film. Also, the structure with the insulator thin barrier layer formed near the lower electrode, opposed to the ITO film, solves the interface problem of the ITO film because it provides an improved photo current/dark current ratio.

Fabrication of carbon nanotube electron beam (C-beam) for thin film modification

  • Kang, Jung Su;Lee, Su Woong;Lee, Ha Rim;Chung, Min Tae;Park, Kyu Chang
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2015년도 제49회 하계 정기학술대회 초록집
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    • pp.171.1-171.1
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    • 2015
  • Carbon nanotube emitters is very promising electron emitter for electron beam applications. We introduced the carbon nanotube electron beam (C-beam) exposure technic using triode structure. As a source, the electron beam emit from CNT emitters placed at the cathode by high electric field. Through the gate mesh, with high accelerating energy, the electron can be extracted easily and impact at the anode plate. For thin film modification, after the C-beam exposure on the amorphous silicon thin film, we found phase changes and it showed a high crystallinity from the Raman measurement. We expect that this crystallized film will be a good candidate as a new active layer of TFT.

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A Review of Wet Chemical Etching of Glasses in Hydrofluoric Acid based Solution for Thin Film Silicon Solar Cell Application

  • Park, Hyeongsik;Cho, Jae Hyun;Jung, Jun Hee;Duy, Pham Phong;Le, Anh Huy Tuan;Yi, Junsin
    • Current Photovoltaic Research
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    • 제5권3호
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    • pp.75-82
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    • 2017
  • High efficiency thin film solar cells require an absorber layer with high absorption and low defect, a transparent conductive oxide (TCO) film with high transmittance of over 80% and a high conductivity. Furthermore, light can be captured through the glass substrate and sent to the light absorbing layer to improve the efficiency. In this paper, morphology formation on the surface of glass substrate was investigated by using HF, mainly classified as random etching and periodic etching. We discussed about the etch mechanism, etch rate and hard mask materials, and periodic light trapping structure.

Fabrication of Novel Thin Film Diode with Multi-step Anodic Oxidation and Post Heat-treatment

  • Hong, Sung-Jei;Lee, Chan-Jae;Moon, Dae-Gyu;Kim, Won-Keun;Han, Jeong-In
    • Transactions on Electrical and Electronic Materials
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    • 제3권4호
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    • pp.27-31
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    • 2002
  • Thin film diode with reliable interfacial structure was fabricated by using multi-step anodic oxidation. The thickness of the oxide layer was preciously controlled with anodic voltage. Also, interfacial structure between oxide layer and top electrode was improved by applying post heat-treatment. The thin film diode showed symmetric and stable I-V characteristics after the post heat-treatment.

프린터 토너의 점착력 특성 및 평가 기법 (Characteristics and Assessment of Printer Toner Adhesion)

  • 이정은;김광일;김현준;김대은
    • 정보저장시스템학회논문집
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    • 제5권2호
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    • pp.82-88
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    • 2009
  • Understanding the adhesion behavior and characteristics of toner film is required to achieve image and text printing with high quality resolution. Toner can be considered as a thin film coating on a media such as paper or polymer film. Quantitative measurement of adhesion characteristics of the thin film is important to assess the reliability of the system. In this work the main objective was to investigate the adhesion characteristic between the toner and the media by ramp loading scratch test method. The scratch test may be used to obtain quantitative information about the adhesion of the film to the substrate. In the scratch test a diamond tip was used to scratch the surface of the toner film under an increasing normal load until the toner detached or fractured. The critical load (LC) was obtained from the experimental results. Also, the relationship between the critical load and the adhesive strength of the interface between the substrate and the toner was obtained by measuring the normal and tangential forces during the scratch test. Finally, theoretical analysis of the toner scratch characteristics was performed based on Benjamin and Weaver theory, Plowing model, and Laugier model.

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유기 반도체 CuPccp LB초박막의 제작 및 특성 (Fabrication and Properties of Organic Semiconductor CuPccp LB Thin Film)

  • 조민재;쑤양싸이양;이진수;안다현;정치섭
    • 센서학회지
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    • 제28권1호
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    • pp.23-29
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    • 2019
  • A copper tetracumylphenoxy phthalocyanine (CuPccp) thin film was formed on an organic insulator film by Langmuir-Blodgett (LB) deposition for gas sensor fabrication. To increase the reproducibility of film transfer, stearyl alcohol was used as a transfer promoter. The structural properties of the CuPccp layers were optically monitored through attenuated total reflection and polarization-modulated ellipsometry techniques. The average thickness of a single layer of the CuPccp LB film was measured to be 2.5 nm. Despite the role of the transfer promoter, the stability of the layer transfer was not sufficient to ensure homogeneity of the LB film. This was probably due to the presence of aggregates in the molecular structure of the CuPccp LB film. Nevertheless, copper phthalocyanine polymorphism can be greatly suppressed by the LB arrangement, which appears to contribute to the improvement of electrical conductivity. The p-type semiconductor characteristics were confirmed by Hall measurements from the CuPccp LB films.

Vision Inspection and Correction for DDI Protective Film Attachment

  • Kang, Jin-Su;Kim, Sung-Soo;Lee, Yong-Hwan;Kim, Young-Hyung
    • 한국정보기술학회 영문논문지
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    • 제10권2호
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    • pp.153-166
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    • 2020
  • DDI(Display Driver IC) are used to drive numerous pixels that make up display. For stable driving of DDI, it is necessary to attach a protective film to shield electromagnetic waves. When the protective film is attached, defects often occur if the film is inclined or the center point is not aligned. In order to minimize such defects, an algorithm for correcting the center point and the inclined angle using camera image information is required. This technology detects the corner coordinates of the protective film by image processing in order to correct the positional defects where the protective film is attached. Corner point coordinates are detected using an algorithm, and center point position finds and correction values are calculated using the detected coordinates. LUT (Lookup Table) is used to quickly find out whether the angle is inclined or not. These algorithms were described by Verilog HDL. The method using the existing software requires a memory to store the entire image after processing one image. Since the method proposed in this paper is a method of scanning by adding a line buffer in one scan, it is possible to scan even if only a part of the image is saved after processing one image. Compared to those written in software language, the execution time is shortened, the speed is very fast, and the error is relatively small.

종이 기판을 이용한 유기박막 트랜지스터의 제작 (Polymer Thin-Film Transistors Fabricated on a Paper)

  • 김영훈;문대규;한정인
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2005년도 하계학술대회 논문집 Vol.6
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    • pp.504-505
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    • 2005
  • In this report, we demonstrate a high performance polymer thin-film transistor fabricated on a paper substrate. As a water barrier layer, parylene was coated on the paper substrate by using vacuum deposition process. Using poly (3-hexylthiophene) as an active layer, a polymer thin-film transistor with field-effect of up to 0.086 $cm^2/V{\cdot}s$ and on/off ratio of $10^4$ was achieved. The fabrication of polymer thin-film transistor built on a cheap paper substrate is expected to open a channel for future applications in flexible and disposable electronics with extremely low-cost.

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