• Title/Summary/Keyword: Film Consumption

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Electrodeposition of Silicon in Ionic Liquid of [bmpy]$Tf_2N$

  • Park, Je-Sik;Lee, Cheol-Gyeong
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2011.10a
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    • pp.30.1-30.1
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    • 2011
  • Silicon is one of useful materials in various industry such as semiconductor, solar cell, and secondary battery. The metallic silicon produces generally melting process for ingot type or chemical vapor deposition (CVD) for thin film type. However, these methods have disadvantages of high cost, complicated process, and consumption of much energy. Electrodeposition has been known as a powerful synthesis method for obtaining metallic species by relatively simple operation with current and voltage control. Unfortunately, the electrodeposition of the silicon is impossible in aqueous electrolyte solution due to its low oxidation-reduction equilibrium potential. Ionic liquids are simply defined as ionic melts with a melting point below $100^{\circ}C$. Characteristics of the ionic liquids are high ionic conductivities, low vapour pressures, chemical stability, and wide electrochemical windows. The ionic liquids enable the electrochemically active elements, such as silicon, titanium, and aluminum, to be reduced to their metallic states without vigorous hydrogen gas evolution. In this study, the electrodeposion of silicon has been investigated in ionic liquid of 1-butyl-3-methylpyrolidinium bis (trifluoromethylsulfonyl) imide ([bmpy]$Tf_2N$) saturated with $SiCl_4$ at room temperature. Also, the effect of electrode materials on the electrodeposition and morphological characteristics of the silicon electrodeposited were analyzed The silicon electrodeposited on gold substrate was composed of the metallic Si with single crystalline size between 100~200nm. The silicon content by XPS analysis was detected in 31.3 wt% and the others were oxygen, gold, and carbon. The oxygen was detected much in edge area of th electrode due to $SiO_2$ from a partial oxidation of the metallic Si.

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Study on Surface Characteristics of Fe Doped MgO Protective Layer (Fe가 첨가된 MgO 보호막의 표면특성 개선에 관한 연구)

  • Lee, Don-Kyu;Park, Cha-Soo;Kim, Kwong-Toe;Sung, Youl-Moon
    • Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.24 no.2
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    • pp.106-112
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    • 2010
  • In order to compete with other flat display devices such as Liquid Crystal Displays (LCDs) and organic light emitting diodes (OLEDs), Plasma Display Panels (PDPs) require to have high performances like high image quality, low power consumption and high speed driving. In this paper, Fe doped MgO protective layer was introduced for higher performance. Both the surface characteristics of the deposited thin films and the electro-optical properties of 4 inch test panels were investigated. It has been demonstrated experimentally that ac PDP with Fe doped MgO protective layer has lower discharge voltage than that of undoped MgO film, which corresponds to measured secondary electron emission coefficients. The crystallinity and surface roughness of thin films were determined by XRD patterns and AFM images. In addition, ac PDP with Fe doped MgO protective layer has improved address discharge time lag for high speed driving.

Nickel Silicide Nanowire Growth and Applications

  • Kim, Joondong
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.02a
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    • pp.215-216
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    • 2013
  • The silicide is a compound of Si with an electropositive component. Silicides are commonly used in silicon-based microelectronics to reduce resistivity of gate and local interconnect metallization. The popular silicide candidates, CoSi2 and TiSi2, have some limitations. TiSi2 showed line width dependent sheet resistance and has difficulty in transformation of the C49 phase to the low resistive C54. CoSi2 consumes more Si than TiSi2. Nickel silicide is a promising material to substitute for those silicide materials providing several advantages; low resistivity, lower Si consumption and lower formation temperature. Nickel silicide (NiSi) nanowire (NW) has features of a geometrically tiny size in terms of diameter and significantly long directional length, with an excellent electrical conductivity. According to these advantages, NiSi NWs have been applied to various nanoscale applications, such as interconnects [1,2], field emitters [3], and functional microscopy tips [4]. Beside its tiny geometric feature, NW can provide a large surface area at a fixed volume. This makes the material viable for photovoltaic architecture, allowing it to be used to enhance the light-active region [5]. Additionally, a recent report has suggested that an effective antireflection coating-layer can be made with by NiSi NW arrays [6]. A unique growth mechanism of nickel silicide (NiSi) nanowires (NWs) was thermodynamically investigated. The reaction between Ni and Si primarily determines NiSi phases according to the deposition condition. Optimum growth conditions were found at $375^{\circ}C$ leading long and high-density NiSi NWs. The ignition of NiSi NWs is determined by the grain size due to the nucleation limited silicide reaction. A successive Ni diffusion through a silicide layer was traced from a NW grown sample. Otherwise Ni-rich or Si-rich phase induces a film type growth. This work demonstrates specific existence of NiSi NW growth [7].

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The Study of Disney's Twelve Animation Method in (<인크레더블>에 표현된 디즈니의 12가지 애니메이션 기법에 관한 연구)

  • Lee, Dong-Jin;Lee, Jong-Han
    • Cartoon and Animation Studies
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    • s.12
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    • pp.74-85
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    • 2007
  • The animation exercises its influence all over the our lives, specially it has originated the new film industry by combining and applying with movies and CF. The current of time being active of animation industry brought about many changes to all the field of making films, planning and consumption. This paper is written for to inspect animation techniques that has developed to expand and break the limit of the animation's processing and expanding the part of expression. Specially by analyzing which is made by PIXAR, inquired how the 12 Disney animation skills were applied. As a result, the 12 Disney animation skills were combined to express one natual movement. Even though is 3D animation made by not Disney but PIXAR and made in 2004, it was applied and followed the 2D animation's the processing skill in 1987. Consequently, we could know even if the production, the way to produce and the time change, the exact same way of the 1987's producing skill has applied for now.

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Investigation of Ni Silicide formation at Ni/Cu/Ag Contact for Low Cost of High Efficiency Solar Cell (고효율 태양전지의 저가화를 위한 Ni/Cu/Ag 전극의 Ni Silicide 형성에 관한 연구)

  • Kim, Jong-Min;Cho, Kyeong-Yeon;Lee, Ji-Hun;Lee, Soo-Hong
    • 한국태양에너지학회:학술대회논문집
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    • 2009.04a
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    • pp.230-234
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    • 2009
  • It is significant technique to increase competitiveness that solar cells have a high energy conversion efficiency and cost effectiveness. When making high efficiency crystalline Si solar cells, evaporated Ti/Pd/Ag contact system is widely used in order to reduce the electrical resistance of the contact fingers. However, the evaporation process is no applicable to mass production because high vacuum is needed. Furthermore, those metals are too expensive to be applied for terrestrial applications. Ni/Cu/Ag contact system of silicon solar cells offers a relatively inexpensive method of making electrical contact. Ni silicide formation is one of the indispensable techniques for Ni/Cu/Ag contact sytem. Ni was electroless plated on the front grid pattern, After Ni electroless plating, the cells were annealed by RTP(Rapid Thermal Process). Ni silicide(NiSi) has certain advantages over Ti silicide($TiSi_2$), lower temperature anneal, one step anneal, low resistivity, low silicon consumption, low film stress, absence of reaction between the annealing ambient. Ni/Cu/Ag metallization scheme is an important process in the direction of cost reduction for solar cells of high efficiency. In this article we shall report an investigation of rapid thermal silicidation of nickel on silngle crystalline silicon wafers in the annealing range of $350-390^{\circ}C$. The samples annealed at temperatures from 350 to $390^{\circ}C$ have been analyzed by SEM(Scanning Electron Microscopy).

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A Novel Spiral Type MEMS Power Generator with Shear Mode Piezoelectric Thick Film (압전 후막의 전단 변형을 이용한 나선형 MEMS 발전기)

  • Song, Hyun-Cheol;Kim, Sang-Jong;Moon, Hi-Gyu;Kang, Chong-Yun;Yoon, Seok-Jin
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.11a
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    • pp.219-219
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    • 2008
  • Energy harvesting from the environment has been of great interest as a standalone power source of wireless sensor nodes for ubiquitous sensor networks (USN). There are several power generating methods such as thermal gradients, solar cell, energy produced by human action, mechanical vibration energy, and so on. Most of all, mechanical vibration is easily accessible and has no limitation of weather and environment of outdoor or indoor. In particular, the piezoelectric energy harvesting from ambient vibration sources has attracted attention because it has a relative high power density comparing with other energy scavenging methods. Through recent advances in low power consumption RF transmitters and sensors, it is possible to adopt a micro-power energy harvesting system realized by MEMS technology for the system-on-chip. However, the MEMS energy harvesting system hassome drawbacks such as a high natural frequency over 300 Hz and a small power generation due to a small dimension. To overcome these limitations, we devised a novel power generator with a spiral spring structure. In this case, the energy harvester has a lower natural frequency under 200 Hz than a normal cantilever structure. Moreover, it has higher an energy conversion efficient because shear mode ($d_{15}$) is much larger than 33 mode ($d_{33}$) and the energy conversion efficiency is proportional to the piezoelectric constant (d). We expect the spiral type MEMS power generator would be a good candidate as a standalone power generator for USN.

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Human Visual System-aware Dimming Method Combining Pixel Compensation and Histogram Specification for TFT-LCDs

  • Jin, Jeong-Chan;Kim, Young-Jin
    • KSII Transactions on Internet and Information Systems (TIIS)
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    • v.11 no.12
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    • pp.5998-6016
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    • 2017
  • In thin-film transistor liquid-crystal displays (TFT-LCDs), which are most commonly used in mobile devices, the backlight accounts for about 70% of the power consumption. Therefore, most low-power-related studies focus on realizing power savings through backlight dimming. Image compensation is performed to mitigate the visual distortion caused by the backlight dimming. Therefore, popular techniques include pixel compensation for brightness recovery and contrast enhancement, such as histogram equalization. However, existing pixel compensation techniques often have limitations with respect to blur owing to the pixel saturation phenomenon, or because contrast enhancement cannot adequately satisfy the human visual system (HVS). To overcome these, in this study, we propose a novel dimming technique to achieve both power saving and HVS-awareness by combining the pixel compensation and histogram specifications, which convert the original cumulative density function (CDF) by designing and using the desired CDF of an image. Because the process of obtaining the desired CDF is customized to consider image characteristics, histogram specification is found to achieve better HVS-awareness than histogram equalization. For the experiments, we employ the LIVE image database, and we use the structural similarity (SSIM) index to measure the degree of visual satisfaction. The experimental results show that the proposed technique achieves up to 15.9% increase in the SSIM index compared with existing dimming techniques that use pixel compensation and histogram equalization in the case of the same low-power ratio. Further, the results indicate that it achieves improved HVS-awareness and increased power saving concurrently compared with previous techniques.

Theoretical considerations on the giant magnetoimpedance effect in amorphous ribbons

  • Phan, Manh-Huong;Nguyen Cuong;Yu, Seong-Cho
    • Proceedings of the Korean Magnestics Society Conference
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    • 2003.06a
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    • pp.60-61
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    • 2003
  • Theoretical considerations on a giant magneto-impedance (GMI) effect in amorphous ribbons (i.e., thin films) have been made in terms of the expressions of effective permeability and impedance derived in the frame of classical electrodynamics and ferromagnetism. The dependence of GMI effect on the external do magnetic field (H$\_$ext/) and the frequency of alternating current are simulated and discussed in the knowledge of energy conversion consisting of the current energy loss, the ferromagnetic energy consumption, and the magnetic energy storage in the film. The obtained results are summarized as follow: (a) As frequency f< 20 ㎒, the real part of effective permeability (${\mu}$′) changes slightly. The peak of the ${\mu}$′curve always locates at H$\_$ext/=H$\_$ani/ - the anisotropy field. However, the peak value of ${\mu}$′ tends to increase with increasing frequency in the frequency range of 11-20 ㎒. (b) In the frequency range, f= 21-23 ㎒, a negative peak additionally appears. Meanwhile, both the positive and negative peak values rapidly increase with increasing frequency and their peak positions shift towards a high H$\_$ext/. (c) The positive peak value of ${\mu}$′ starts to decrease at f= 29 ㎒ and its negative peak does so at about 35 ㎒. Then, both peaks keep such a tendency and their peak positions move to high H$\_$ext/, as increasing frequency. (d) The dependence of the imaginary part of effective permeability (${\mu}$") on the external dc magnetic field and the frequency of the alternating field indicates that there is only one peak involved in ${\mu}$" for the whole frequency range. (e) The impedance vs. magnetic field curves at various frequencies show that there is a critical value of frequency around f= 18-19 ㎒ where the transition between two frequency regimes occurs; the one (low frequency) in which ${\mu}$′ predominantly contributes to the GMI effect and the other (high frequency) in which ${\mu}$" determines the GMI effect.

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Decrease of Interface Trap Density of Deposited Tunneling Layer Using CO2 Gas and Characteristics of Non-volatile Memory for Low Power Consumption (CO2가스를 이용하여 증착된 터널층의 계면포획밀도의 감소와 이를 적용한 저전력비휘발성 메모리 특성)

  • Lee, Sojin;Jang, Kyungsoo;Nguyen, Cam Phu Thi;Kim, Taeyong;Yi, Junsin
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.29 no.7
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    • pp.394-399
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    • 2016
  • The silicon dioxide ($SiO_2$) was deposited using various gas as oxygen and nitrous oxide ($N_2O$) in nowadays. In order to improve electrical characteristics and the interface state density ($D_{it}$) in low temperature, It was deposited with carbon dioxide ($CO_2$) and silane ($SiH_4$) gas by inductively coupled plasma chemical vapor deposition (ICP-CVD). Each $D_{it}$ of $SiO_2$ using $CO_2$ and $N_2O$ gas was $1.30{\times}10^{10}cm^{-2}{\cdot}eV^{-1}$ and $3.31{\times}10^{10}cm^{-2}{\cdot}eV^{-1}$. It showed $SiO_2$ using $CO_2$ gas was about 2.55 times better than $N_2O$ gas. After 10 years when the thin film was applied to metal/insulator/semiconductor(MIS)-nonvolatile memory(NVM), MIS NVM using $SiO_2$($CO_2$) on tunneling layer had window memory of 2.16 V with 60% retention at bias voltage from +16 V to -19 V. However, MIS NVM applied $SiO_2$($N_2O$) to tunneling layer had 2.48 V with 61% retention at bias voltage from +20 V to -24 V. The results show $SiO_2$ using $CO_2$ decrease the $D_{it}$ and it improves the operating voltage.

MEMS-Based Micro Sensor Detecting the Nitrogen Oxide Gases (산화질소 검출용 마이크로 가스센서 제조공정)

  • Kim, Jung-Sik;Yoon, Jin-Ho;Kim, Bum-Joon
    • Korean Journal of Materials Research
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    • v.23 no.6
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    • pp.299-303
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    • 2013
  • In this study, a micro gas sensor for $NO_x$ was fabricated using a microelectromechanical system (MEMS) technology and sol-gel process. The membrane and micro heater of the sensor platform were fabricated by a standard MEMS and CMOS technology with minor changes. The sensing electrode and micro heater were designed to have a co-planar structure with a Pt thin film layer. The size of the gas sensor device was about $2mm{\times}2mm$. Indium oxide as a sensing material for the $NO_x$ gas was synthesized by a sol-gel process. The particle size of synthesized $In_2O_3$ was identified as about 50 nm by field emission scanning electron microscopy (FE-SEM). The maximum gas sensitivity of indium oxide, as measured in terms of the relative resistance ($R_s=R_{gas}/R_{air}$), occurred at $300^{\circ}C$ with a value of 8.0 at 1 ppm $NO_2$ gas. The response and recovery times were within 60 seconds and 2 min, respectively. The sensing properties of the $NO_2$ gas showed good linear behavior with an increase of gas concentration. This study confirms that a MEMS-based gas sensor is a potential candidate as an automobile gas sensor with many advantages: small dimension, high sensitivity, short response time and low power consumption.