• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.253-254
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• 2009

본 연구는 다결정 알루미나 소결체와 사파이어웨이퍼(sapphire wafer)의 견고한 접합을 위해 활성금속 Ti가 함유된 Active Filler Metal을 사용하였고, 이를 브레이징한 후 접합 반응층과 Ti 거동 특성에 관한 것이다. 브레이징 (brazing)은 Ar 분위기 종에 $850^{\circ}C$에서 이행하였으며. 이때 다결정 알루미나, 사파이어와 Active Filler Metal 사이의 접합 반응층을 확인하였다. Active Filler Metal 내어| 존재하는 Ti가 접할 반응층의 양계면에 집중되는 것을 SEM을 이용하여 확인하였다. 또한 EDS Line Scanning을 실시하여 접합부에서 원소들의 분포를 관찰하였다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.26 no.11
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• pp.810-815
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• 2013

In this study, the capacitance and dielectric loss tangent of the silicone rubber which is combined with filler (30 phr~50 phr) have been measured on the range of 100 Hz~100 kHz and $30{\sim}170^{\circ}C$. It was found that when the frequency is 0.1 kHz~100 kHz and the silicone rubber is combined with 30 phr to 50 phr of filler, the capacitance of silicone rubber has increased by about 28.6 pF to 33 pF in 30 phr of filler, about 20 pF to 46.1 pF in 40 phr of filler and about 36.4 pF to 44 pF in 50 phr of filler. It seems that the volume of dielectric loss has gradually increased due to the temperature rise and the rotating of dipole in electric field through the electric dipole generated by the Si-O group which is induced by adding of filler, or the carbonyl group which is caused by oxidation. It seems that the dielectric dispersion in 0.1 kHz is caused by molecular motion of Siloxane group in main chain, and the dielectric dispersion in 10 kHz is caused by molecular motion of Methyl group in side chain.

• Composites Research
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• v.18 no.5
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• pp.21-26
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• 2005

The validity of Eshelby-type model with Mori-Tanaka's mean field theory to predict the effective material properties of composites have been investigated in terms of filler size and its arrangement. The 2-dimensional plate composites including constant volume fraction of fillers are used as the model composite for the analytical studies, where the filler size and its arrangement are considered as parameters. The exact effective material properties of the composites are computed by finite element analysis(FEA), which are compared with effective material properties from the Eshelby-type model. Although the fillers are periodically or randomly arranged, the average Young's moduli by Eshelby-type model and FEA are in good agreement, specially for the ratio of specimen size to filler size being smaller than 0.03. However, Poisson's ratio of the composite by the Eshelby-type model is overestimated by $20\%$.

• Composites Research
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• v.35 no.6
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• pp.431-438
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• 2022

Efficient heat dissipation in current electronics is crucial to ensure the best performance and lifespan of the devices along with the users' safety. Materials with high thermal conductivity are often used to dissipate the generated heat from the electronics to the surroundings. For this purpose, polymer composites have been attracted much attention as they possess advantages rooted from both polymer matrix and thermally conductive filler. In order to meet the thermal conductivity required by relevant industries, composites with high filler loadings (i.e., >60 vol%) have been fabricated. At such high filler loadings, however, composites lose benefits originated from the polymer matrix. To achieve high thermal conductivity at a relatively low filler loading, therefore, constructing the heat conduction pathway by controlling filler structure within the composites may represent a judicious strategy. To this end, this review introduces several recent approaches to manufacturing heat dissipating materials with high thermal conductivity by manipulating thermally conductive filler structures in polymer composites.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.225-225
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• 2009

In this study, Nano and micro-filler mixture composites were fabricated by fixed value of $SiO_2$ nano-filler 0.4 [wt%] according to increase of $SiO_2$ micro-filler [wt%] from 1 to 10. Composites with a good dispersion of mixed $SiO_2$ Nano and micro-particles in the epoxy resins were prepared and experiments were performed to measure the dielectric breakdown strength properties with various temperature and thickness. The dielectric strength properties are compared and analyzed with respect to nano/micro-composites filled with $SiO_2$ fillers less than properties obtained for nanocomposites.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.9
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• pp.793-797
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• 2007

In this paper, the long time breakdown characteristic of the epoxy composite, which is widely used in the insulation system for high voltage application, was estimated with Weibull distribution. In the procedure of the estimation, the short time breakdown characteristics for the epoxy composite specimens, which were made with the variation of hardener and/or filler, were tested firstly. Then the long time voltage-to-time test was implemented. Finally, the long time breakdown voltage of each specimen was estimated with the parameters obtained from the statistical treatment with Weibull distribution. Base on the results, it has been found that the optimal weight ratio of epoxy resin/hardener/filler that has the excellent long time breakdown characteristic was 100/100/65. It was due to the silane treatment which relieves the electric field at the interface between filler and epoxy.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1995.11a
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• pp.171-174
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• 1995

Space charge formation in epoxy loaded with silica and calcium carbonate has been studied. The epoxy itself showed almost no charge at up to 40 kV/mm. The addition of fillers such as SiO$_2$and CaCO$_3$resulted in homocharge formation, which was attributed to the interfacial trapping of injected charge at epoxy/filler interfaces. The amount of charge showed a maximum at 20-40 parts per hundred resin above which the charge decreased gradually. This was tentatively attributed to the enhanced interconection of charge transport path by an increased filler content

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1988.05a
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• pp.67-69
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• 1988

In this study, after changing the curing condition of hardner(DDM) and filler($SiO_2$) contents dielectric and dynamic mechanical properties were studied according to the variation of temperature. As the result we obtained a correlative $\alpha$-peak at 125-150[$^{\circ}C$] from dielectric and mechanical properties. With increasing curing condition and filler contents both dielectric and internal friction loss were, decreased, peak temperature shifted to high temperature, but there was no variation on peak temperature with filler contents. As the above result we knew the correspondence between dielectric and mechanical characteristics.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.13 no.3
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• pp.247-253
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• 2000

We evaluated the electric properties of Bi-2223 jointed tapes processed by both resistive-and superconducting-joint methods. For resistive-joint. filler materials of wood metal Pb/Sn. In and silver paste were used whereas for superconductive-joint lap joint method was used. In the resistive joint tape. critical transport property(CCR) n-value and contact resistance were observed to be in the range of 10-85% 1-8,9. and 0.71x10$\^$-6/-0.13x10$\^$-6/Ω, respectively. depending on their filler materials. Specifically it is believed that the electrical properties of resistive joint tape are significantly related to the resistivity of filler materials. On the other hand the CCR of superconductin joint type was varied 55 to 85% with uniaxial pressure probably due to the irregular microstructure in the transition region.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.36-36
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• 2007

$R_2O_3$(R=Bi, B)-RO(R=Ba, Zn)를 주성분으로 하는 Pb-free유리프리트에 높은 굴절률을 가지고 있는 $TiO_2$ filler를 첨가하여 PDP용 백색유전체를 제조하였다. $TiO_2$ type, 함량에 따른 백색유전체로의 반사율 및 유전 특성을 조사하였다. 백색유전체를 소성한 결과 rutile과 anatase를 중량비로 75:25로 혼합하여 $520^{\circ}C$에서 소성한 경우 밀도 및 수축율의 변화를 거의 나타나지 않았다. 그러나 $TiO_2$함량이 15wt.%를 혼합하여 첨가했을 경우 반사율은 높고 접합특성 또한 우수하였다. 또한, 유전상수는 $TiO_2$첨가량이 증가함에 따라 증가하는 경향을 나타내었다.