• Restorative Dentistry and Endodontics
• /
• v.16 no.1
• /
• pp.121-132
• /
• 1991

The purpose of the study was to evaluate the marginal sealing effect of composite resin inlays according to the luting techniques and compare them to the conventional direct resin filling technique. 90 cavities of class V were prepared on the buccal surface of 90 extracted molar teeth, which were divided into four groups. Cavities of control group were directly filled with Scotchbond 2 and P - 50, and those of composite resin inlay groups were luted with one of the followings: Adhesive bond followed by Adhesive cement, All bond followed by Adhesive cement, Fuji - ionomer type L All the specimens were immersed in India ink dye solution for 7 days at $37^{\circ}C$ incubator after thermocycling between $5^{\circ}C$ and $60^{\circ}C$ and longitudinally sectioned with diamond disk inot two parts All the specimens were observed at the occlusal and gingival margins and statistical analysis was performed. The results were as follows: 1. Groups filled with composite resin inlay showed less marginal leakage than the group directly filled(p<0.01). 2. There was no significant difference in marginal leakage between composite resin inlay groups luted with Adhesive bond followed by Adhesive cement and the group luted with All bond followed by Adhesive cement(p>0.05). 3. At occlusal margins, Composite resin inlay group luted with Adhesive bond followed by Adhesive cement showed less marginal leakage than the group luted with Fuii ionomer type I(p<0.01). At gingival margins, composite resin inlay group luted with All bond followed by Adhesive cement showed less marignal leakage than the group luted with Fuji ionomer type I(P<0.01).

• Restorative Dentistry and Endodontics
• /
• v.32 no.1
• /
• pp.9-18
• /
• 2007

The purposes of this study were to examine the variability of adhesive thickness on the different site of the cavity wall when used total-etch system without filler and simplified self-etch system with filler and to evaluate the relationship between variable adhesive thickness and microtensile bond strength to the cavity wall. A class I cavity in six human molars was prepared to expose all dentinal walls. Three teeth were bonded with a filled adhesive, $Clearfil^{TM}$ SE bond ana the other three teeth were bonded with unfilled adhesives, $Scotchbond^{TM}$ Multi Purpose. Morphology and thickness of adhesive layer were examined using fluorescence microscope. Bonding agent thickness was measured at three points along the axial cavity wall edge of cavity margin (rim). halfway down each cavity wall (h1f), internal angle of the cavity (ang). After reproducing the adhesive thickness at rim, h1f and ang, micro-tensile bond strength were evaluated. For both bonding agents, adhesive thickness of ang was significantly thicker than that of rim and h1f (P <0.05). As reproduced the adhesive thickness, microtensile bond strength was increased as adhesive thickness was increased in two bonding agents. Adhesive thickness of internal angle of the cavity was significantly thicker than that of the cavity margin and the halfway cavity wall for both bonding agents. Microtensile bond strength of the thick adhesive layer at the internal angle of the cavity was higher than that of the thin adhesive layer at 1,he cavity margin and the halfway cavity in the two bonding systems.

• Journal of the Semiconductor & Display Technology
• /
• v.10 no.4
• /
• pp.37-42
• /
• 2011

In this paper, novel carbon nanotube (CNT)-filled Solderable electrically conductive adhesive (ECA) and joining process have been developed. To investigate the bonding characteristics of CNT-filled Solderable ECA, three types of Solderable ECAs with different CNT weight percent (0, 0.1, 1wt%) were formulated. For a joining process, the quad flat package (QFP) chip was used. The QFP chip had a size of $14{\times}14{\times}2.7$ mm and a 1 mm lead pitch. The test board had a Cu daisy-chained pattern with 18 ${\mu}m$ thick. After the bonding process, the bonding characteristics such as morphology of conduction path, electrical resistance and pull strength were measured for each formulated ECAs. As a result, the electrical and mechanical bonding characteristics for a QFP joints using CNT-filled ECA were improved about 10% compared to those of QFP joints using ECA without CNT.

• Proceedings of the KIEE Conference
• /
• 1987.11a
• /
• pp.387-391
• /
• 1987

We have observed the optical bistabilities at $5145{\AA}$ in nonlinear etalons filled with NOA8l optical adhesive which is cured with UV light under the temperature gradient of $7^{\circ}C/mm$ on the NOA81 layer surface. The critical switch-on irradiance and switch-on time are $17\;KW/cm^2$ and $350{\mu}sec$. respectively. The switching contrast of up to 8 observed in NOA81 etalons is higher than that of ZnS or ZnSe interference filter, and the thermo-optic coefficient (dn/ndT) of NOA81 is measured to be at least $-3.8{\times}10^{-4}/^{\circ}C$ which is larger in magnitude than that of ZnS or ZnSe.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2011.06a
• /
• pp.621-622
• /
• 2011

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2002.07a
• /
• pp.32-35
• /
• 2002

The work focuses on the development of a Cu lead-frame with a single-sided adhesive tape for cost reduction and reliability improvement of LOC (lead on chip) package products, which are widely used for the plastic-encapsulation of memory chips. Most of memory chips are assembled by the LOC packaging process where the top surface of the chip is directly attached to the area of the lead-frame with a double-sided adhesive tape. However, since the lower adhesive layer of the double-sided adhesive tape reveals the disparity in the coefficient of thermal expansion from the silicon chip by more than 20 times, it often causes thermal displacement-induced damage of the IC pattern on the active chip surface during the reliability test. So, in order to solve these problems, in the resent work, the double-sided adhesive tape is replaced by a single-sided adhesive tape. The single-sided adhesive tape does net include the lower adhesive layer but instead, uses adhesive materials, which are filled in clear holes of the base film, just for the attachment of the lead-frame to the top surface of the memory chip. Since thermal expansion of the adhesive materials can be accommodated by the base film, memory product packaged using the lead-flame with the single-sided adhesive tape is shown to have much improved reliability. Author allied this invention to the Korea Patent Office for a patent (4-2000-00097-9).

• Restorative Dentistry and Endodontics
• /
• v.32 no.5
• /
• pp.445-458
• /
• 2007

The purpose of this study was to evaluate the bond strength of a new Single step system with different curing mode composites, and to evaluate the effect of the intermediate resins which have different hydrophilicity on bonding ability by means of the micro shear bond testing and TEM examination for the adhesive interface. The adhesive used in this study was an experimental single step system (Bisco Inc., Schaumburg IL). Experimental groups were produced by using six kinds of intermediate resin having different hydrophilicity that was hydrophilic, hydrophobic and most hydrophobic resin and as filled or not after applying adhesive. Each experimental group was further divided into two subgroups whether the adhesive was light cured or not. Dual cured composite (Bis Core, Bisco Ltd., Schaumburg, IL) was placed on the adhesive layer as light cure or self cure mode. The results or bond strength were statistically analyzed using one way ANOVA and multiple comparisons are made using Tukey's test at ${\alpha}\;<\;0.05$ level. The results of this study were as follows ; 1. The application of intermediate resin did not increase the bond strength for light cured composite. 2. The bond strength of an experimental adhesive with self cured composite was significantly increased by the application of intermediate resin layer. 3. The bond strength of adhesive was irrespective of the cure or not of itself before intermediate resin layer applied. 4. As applied hydrophilic resin layer was, the initial bond strength was higher than both hydrophobic and most hydrophobic one used but there was no significance. Using a single step adhesive with dual/self cured composite, the incompatibility between both of them should be solved by the application of intermediate hydrophobic resin to reduce the adhesive permeability. However, Single step adhesive can be used in the light cured composite restoration without any decrease of the initial bond strength.

• Restorative Dentistry and Endodontics
• /
• v.12 no.2
• /
• pp.55-63
• /
• 1987

The purpose of this study is to evaluate the effect of dentin bonding agents on marginal leakage. V-shaped cavities were prepared on the faciocervical area of 140 extracted human teeth. In Groups of twenty cavities, they were restored as follow: Group 1 with enamel bonding resin and Silux, Group 2 Scotchbond and Silux, Group 3 enamel bonding resin and Heliomolar, Group 4 Dentin Adhesit and Heliomolar, Group 5 enamel bonding resin and Durafill, Group 6 Dentin Adhesive and Durafill, Group 7 Chembond. All specimens were thermocycled alternatively at $4^{\circ}C$ and $60^{\circ}C$ of 2% methylene blue dye solution, and sectioned faciolingually with diamond disk under water spray. The sectioned specimens observed with stereo microscope. Following results were obtained: 1. The groups filled with Scotchbond-Silux or Dentin Adhesit-Heliomolar had appeared lesser marginal leakage compared with the groups with enamel bonding resin-Silux or enamel bonding resin-Helimolar. 2. The group filled with Dentin Adhesive-Durafill did not show the reduction of the marginal leakage compared with the group with enamel bonding resin-Durafill. 3. There was significant difference among the four dentin bonding agents. Scotchbond showed the greatest marginal sealing ability, and Dentin Adhesit was the next. The marginal sealing ability of Dentin Adhesive was the worst.

• Restorative Dentistry and Endodontics
• /
• v.26 no.4
• /
• pp.316-325
• /
• 2001

The purpose of this study was to evaluate the effect of adhesive curing timing on the direction of polymerization shrinkage of light-curing composite resin. In this study, the curing times of adhesive and composite resin were measured by differential scanning calorimeter(DSC). 28 extracted human molars were embedded in clear resin and box-type cavities were prepared. Based on DSC data, the experimental teeth were divided into 4 groups. Group 1: no bond; Group 2: late curing; Group 3: Intermediate curing; Group 4: Early curing. After treating with adhesive, the buccal cavities were filled with Z-100 hybrid composite resin and the lingual ones were filled with AEliteflo flowable composite resin. The depressions at the surface were measured by surface profilometer, then the specimens were embedded in clear resin and sectioned. Impressions were obtained and used to get epoxy resin replicas. The epoxy replicas were gold-coated and observed under SEM. Average Maximum Gap(AMG), Gap Proportion(GP), Average Marginal Index(AMI) were used to compare the shrinkage gap of each group. The results were statistically analyzed using the Kruskal-Wallis One Way ANOVA, Student-Newman-Keuls method. The results of this study were as follows. 1. Average Maximum Gap, Gap Proportion, Average Marginal Index and depression at the surface or Z-100 hybride composite resin were smaller than those of AEliteflo flowable composite resin(P<0.05). 2. When the bonding between composite resin and tooth structure was strong, the shrinkage gap was small, and depression at the surface was deep(P<0.05). 3. In the well-bonded group, light-curing composite resin shrank toward bonded cavity wall, not toward light source. The result suggested that the direction of polymerization shrinkage was affected by the quality of bonding in the dentin-resin interface. The strong was the bonding between composite resin and tooth structure, the smaller was the gap and the deeper was the depression at the surface. Then the flow to compensate the polymerization shrinkage proceeded from surface to bonded cavity wall.

• Restorative Dentistry and Endodontics
• /
• v.37 no.1
• /
• pp.41-49
• /
• 2012

Objectives: The internal adaptation of composite restorations with or without resin modified glass ionomer cement (RMGIC) was analyzed non-destructively using Microcomputed tomography (micro-CT). Materials and Methods: Thirty intact human teeth were used. The specimens were divided into 3 groups. In the control group, the cavities were etched with 10% phosphoric acid for 15 sec. Composite resin was filled into the cavity without adhesive. In group 1, light cured glass ionomer cement (GIC, Fuji II LC, GC) was applied as a base. The cavities were then etched, bonded, light cured and filled with composites. In group 2, the cavities were then etched, bonded, light cured and filled with composites without base application. They were immersed in a 25% silver nitrate solution. Micro-CT was performed before and after mechanical loading. One-way ANOVA with Duncan analysis was used to compare the internal adaptation between the groups before or after loading. A paired t-test was used to compare internal adaptation before and after mechanical loading. All statistical inferences were made within the 95% confidence interval. Results: The silver nitrate solution successfully penetrated into the dentinal tubules from the pulp spaces, and infiltrated into the gap between restoration and pulpal floor. Group 2 showed a lower adaptation than the control group and group 1 (p < 0.05). There was no significant difference between the control group and group 1. For all groups, there was a significant difference between before and after mechanical loading (p < 0.05). Conclusions: The internal adaptation before and after loading was better when composites were bonded to tooth using adhesive than composites based with RMGIC.