• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.227-227
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• 2014

OLED 소자에 사용되는 유기물들은 대부분 전자에 비해 정공의 이동속도가 매우 빨라 소자 효율의 손실이 일어난다. 본 연구에서는 이러한 전하 이동도의 불균형에 의한 OLED 소자 성능의 감소를 개선하기 위해 HBL (hole blocking layer) 물질로 BCP (HOMO : 6.5 eV, LUMO : 2.83 eV)를 도입하였다. 그러나 BCP의 LUMO 값이 약 3 eV를 가지기 때문에 전자의 이동에 영향을 미치는 것으로 예상되어 더 높은 효율을 가지는 소자를 제작하기 위해 host 물질을 상용물질(PGH02)로 교체하였다. PGH02의 HOMO 값은 약 5.86 eV로 소자에 사용된 HTL (hole transport layer)의 HOMO 값(5.54 eV)에 비해 높은 값을 가지기 때문에 HBL의 역할 역시 가능하여 소자의 성능이 상당히 개선되는 것을 확인할 수 있었다. 또한 전하 이동도의 균형을 맞추기 위해 ETL 물질로는 기존에 많이 사용되고 있는 Alq3 (${\mu}{\sim}10-5cm2/Vs$)에 비해 이동도가 10배 이상 빠른 Bebq2 (${\mu}{\sim}10-4cm2/Vs$)를 사용하였다. HTL (hole transport layer) 물질로는 상용물질(LHT 259)를 사용하였고, LHT 259의 전하 이동도는 FET (field effect transistor)를 제작하여 측정하였다. 이를 기반으로 하여 ETL과 HTL의 두께를 조절하여 전하 이동도가 균형을 이루는 OLED 소자를 제작하기 위해 실험을 진행하였다.

• Ceramist
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• v.2 no.4
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• pp.35-46
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• 1999

GMR 재료의 응용은 매우 광범위하며 크게 세 분야로 대별할 수 있다. 첫째는 자기 재생 헤드로서 $10Gbit/in^2$ 이상의 고밀도 자기기록 기술에서는 필수 불가결한 재료이다. 둘째는 다양한 분야에 응용될 고감도 자기센서 분야이며, 셋째는 집접화된 자기저항메모리(MRAM) 분야이다. GMR 센서를 사용한 자기헤드는 이미 시판되고 있고 기존의 AMR 재료인 퍼멀로이에 비하여 3~20배 이상으로 신호준위가 크고 사용온도 범위에서 선형성 및 열적안정성도 우수한 것으로 보고되고 있다. MRAM의 경우에는 스핀밸브 GMR 및 TMR 소자를 사용한 연구가 한창 진행중이다. GMR 현상은 발견 된지 고작 10년 밖에 되지 않았으나 GMR 자기센서는 이미 상업적으로 개발되어 응용되고 있다. 이러한 실질적인 응용에 유리한 고지를 선점하고 있는 것은 이방성결합형 스핀밸브 다층박막 구조로서 그 내구성과 특성 향상을 위한 연구가 다양하게 시도되고 있다. GMR현상의 발견은 자성재료분야 연구 및 응용에 있어 새로운 전기를 마련하였으며 특히 자성과 이동현상이 연계된 분야로서 소위 "Magneto-electronics" 또는 "Spintronics" 라는 [51] 새로운 미래기술의 장이 열리고 있다. 현재의 반도체 중심의 "Microelectronics" 기술에서는 전자와 전자공공을 이용하는 기술이라면 "Magneto-electronics" 기술에서는 스핀${\uparrow}$ 및 스핀${\downarrow}$의 두 종류의 전자를 이용하게 된다. 자성체와 도체를 접목한 스핀 트랜지스터 또는 자성체와 반도체를 접목한 스핀-polarized FET(field effect transistor) 등의 새로운 개념의 magnetoelectronics 소자가 창출되고 있다. 따라서 자기이동 현상의 기초 연구, 재료 측면의 연구 및 헤드, MRAM, 센서 등의 응용기술연구가 국내에서 활발하게 이루어져 21세기 새로운 자성전자(magneto-electronics)소자 응용에 경쟁력을 키워야 할 것이다.

• Bulletin of the Korean Chemical Society
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• v.28 no.11
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• pp.2056-2060
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• 2007

A successful combination of “oxygen-assisted chemical vapor deposition (CVD) process” and Co catalyst nanoparticles to grow highly pure single walled carbon nanotubes (SWNTs) was demonstrated. Recently, it was reported that addition of small amounts of oxygen during CVD process dramatically increased the purity and yield of carbon nanotubes. However, this strategy could not be applied for discrete Fe nanoparticle catalysts from which appropriate yields of SWNTs could be grown directly on solid substrates, and fabricated into field effect transistors (FETs) quite efficiently. The main reason for this failure is due to the carbothermal reduction which results in SiO2 nanotrench formation. We found that the oxygen-assisted CVD process could be successfully applied for the growth of highly pure SWNTs by switching the catalyst from Fe to Co nanoparticles. The topological morphologies and p-type transistor electrical transport properties of the grown SWNTs were examined by using atomic force microscope (AFM), Raman, and from FET devices fabricated by photolithography.

• Proceedings of the KIEE Conference
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• 2007.07a
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• pp.1339-1340
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• 2007

본 연구에서는 이종 차원 나노선과 나노입자의 결합에 따른 단일 나노선 소자의 전기적 특성 및 메모리 효과를 연구하였다. 열증착법으로 성장 된 p 형 Si 나노선에 Atomic Layer Deposition (ALD) 방법으로 10nm의 $Al_{2}O_{3}$를 증착한 후 Low Precensure - Chemical Vapor Deposition (LP-CVD)를 이용하여 Polycrystalline Sicon(Poly-Si)을 Si 나노선 위에 5nm 증착하고 습식 에칭법을 이용하여 poly Si 내의 $SiO_x$를 제거하여 Si 나노입자를 Si 나노선 위에 형성시켰다. 그 후 포토리소그래피 공정을 이용하여 Top gate 형태의 나노선-나노입자 이종결합 Field-Effect Transistor (FET) 소자를 제작하여 게이트 전압에 따른 드레인 전류-전압($I_{DS}-V_{DS}$)의 변화를 측정하여 나노선의 전기 소자로서의 특성을 확인하고, 게이트 전압을 양방향으로 swing 하면서 인가하여 $I_{DS}$ 전류 특성이 변화하는 것을 통해 메모리 효과를 조사하였다. 또한 나노입자의 결합이 게이트 전압의 인가 시간에 따라 드레인 전류에 영향을 미치는 것을 확인하여 메모리 소자로서의 가능성을 확인하였다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.136-137
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• 2007

In this study, a single ZnO nanowire - CdTe nanoparticle nano floating gate memory (NFGM) device is successfully fabricated and characterized their memory effects by comparison of electrical characteristics of ZnO nanowire-based field effect transistor (FET) devices with CdTe nanoparticles embedded in the $Al_2O_3$ gate materials and without the CdTe nanoparticles.

• Journal of the Korean institute of surface engineering
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• v.49 no.2
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• pp.152-158
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• 2016

We investigated the effect of capacitively coupled Ar plasma treatment on contact resistance ($R_c$) and channel sheet resistance ($R_{sh}$) of graphene field effect transistors (FETs), by varying their channel length in the wide range from 200 nm to $50{\mu}m$ which formed the transfer length method (TLM) patterns. When the Ar plasma treatment was performed on the long channel ($10{\sim}50{\mu}m$) graphene FETs for 20 s, $R_c$ decreased from 2.4 to $1.15k{\Omega}{\cdot}{\mu}m$. It is understood that this improvement in $R_c$ is attributed to the formation of $sp^3$ bonds and dangling bonds by the plasma. However, when the channel length of the FETs decreased down to 200 nm, the drain current ($I_d$) decreased upon the plasma treatment because of the significant increase of channel $R_{sh}$ which was attributed to the atomic structural disorder induced by the plasma across the transfer length at the edge of the channel region. This study suggests a practical guideline to reduce $R_c$ using various plasma treatments for the $R_c$ sensitive graphene and other 2D material devices, where $R_c$ is traded off with $R_{sh}$.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.32 no.3
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• pp.201-206
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• 2019

This report constitutes the first demonstration in Korea of single-crystal lateral gallium oxide ($Ga_2O_3$) as a metal-oxide-semiconductor field-effect-transistor (MOSFET), with a breakdown voltage in excess of 480 V. A Si-doped channel layer was grown on a Fe-doped semi-insulating ${\beta}-Ga_2O_3$ (010) substrate by molecular beam epitaxy. The single-crystal substrate was grown by the edge-defined film-fed growth method and wafered to a size of $10{\times}15mm^2$. Although we fabricated several types of power devices using the same process, we only report the characterization of a finger-type MOSFET with a gate length ($L_g$) of $2{\mu}m$ and a gate-drain spacing ($L_{gd}$) of $5{\mu}m$. The MOSFET showed a favorable drain current modulation according to the gate voltage swing. A complete drain current pinch-off feature was also obtained for $V_{gs}<-6V$, and the three-terminal off-state breakdown voltage was over 482 V in a $L_{gd}=5{\mu}m$ device measured in Fluorinert ambient at $V_{gs}=-10V$. A low drain leakage current of 4.7 nA at the off-state led to a high on/off drain current ratio of approximately $5.3{\times}10^5$. These device characteristics indicate the promising potential of $Ga_2O_3$-based electrical devices for next-generation high-power device applications, such as electrical autonomous vehicles, railroads, photovoltaics, renewable energy, and industry.

• Journal of the Korean Society of Safety
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• v.36 no.2
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• pp.10-17
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• 2021

This paper presents the robust design of each component used in the development of an induction bolt heating system for dismantling the high-temperature high-pressure casing heating bolts of turbines in power plants. The induction bolt heating system comprises seven assemblies, namely AC breaker, AC filter, inverter, transformer, work coil, cable, and CT/PT. For each of these assemblies, the various failure modes are identified by the failure mode and effects analysis (FMEA) method, and the causes and effects of these failure modes are presented. In addition, the risk priority numbers are deduced for the individual parts. To ensure robust design, the insulated-gate bipolar transistor (IGBT), switched-mode power supply (SMPS), C/T (adjusting current), capacitor, and coupling are selected. The IGBT is changed to a field-effect transistor (FET) to enhance the voltage applied to the induction heating system, and a dual-safety device is added to the SMPS. For C/T (adjusting current), the turns ratio is adjusted to ensure an appropriate amount of induced current. The capacitor is replaced by a product with heat resistance and durability; further, coupling with a water-resistant structure is improved such that the connecting parts are not easily destroyed. The ground connection is chosen for management priority.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.14 no.5
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• pp.536-541
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• 2003

In order to avoid oxygen contamination on the diamond surface as far as possible during the device process, the A1/Ca $F_2$/diamond MISFET(metal-insulator-semiconductor field-effect transistor) was prepared by ultrahigh vacuum process and its electrical properties were investigated. The surface conductive layer of fluorinated diamond surface was employed for the conducting channel of the MISFET. The observed effective mobility(${\mu}$e$\_$ff/) of the MISFET was 300 c $m^2$/Vs, which is the highest value obtained until now in the diamond FET. Besides, the measured surface state density of the device was ∼10$\^$11//c $m^2$ eV, which is comparable with conventional Si MOSFET$\_$s/(metal-oxide-semiconductor field-effect-transistors). This work is the first report of the fluorinated diamond MISFET prepared by ultrahigh vacuum process and its application to inverter circuit.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.491-491
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• 2011

Transparent and flexible electronic devices that are light-weight, unbreakable, low power consumption, optically transparent, and mechanical flexible possibly have great potential in new applications of digital gadgets. Potential applications include transparent displays, heads-up display, sensor, and artificial skin. Recent reports on transparent and flexible field-effect transistors (tf-FETs) have focused on improving mechanical properties, optical transmittance, and performances. Most of tf-FET devices were fabricated with transparent oxide semiconductors which mechanical flexibility is limited. And, there have been no reports of transparent and flexible all-organic tf-FETs fabricated with organic semiconductor channel, gate dielectric, gate electrode, source/drain electrode, and encapsulation for sensor applications. We present the first demonstration of transparent, flexible all-organic sensor based on multifunctional organic FETs with organic semiconductor channel, gate dielectric, and electrodes having a capability of sensing infrared (IR) radiation and mechanical strain. The key component of our device design is to integrate the poly(vinylidene fluoride-triflouroethylene) (P(VDF-TrFE) co-polymer directly into transparent and flexible OFETs as a multi-functional dielectric layer, which has both piezoelectric and pyroelectric properties. The P(VDF-TrFE) co-polumer gate dielectric has a high sensitivity to the wavelength regime over 800 nm. In particular, wavelength variations of P(VDF-TrFE) molecules coincide with wavelength range of IR radiation from human body (7000 nm ~14000 nm) so that the devices are highly sensitive with IR radiation of human body. Devices were examined by measuring IR light response at different powers. After that, we continued to measure IR response under various bending radius. AC (alternating current) gate biasing method was used to separate the response of direct pyroelectric gate dielectric and other electrical parameters such as mobility, capacitance, and contact resistance. Experiment results demonstrate that the tf-OTFT with high sensitivity to IR radiation can be applied for IR sensors.