• Journal of the Korean institute of surface engineering
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• v.35 no.4
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• pp.218-231
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• 2002

As the environmental regulation worldwide emerges, most notably in Europe and Japan, the elimination of Pb usage in electronic assemblies has been an important issue for microelectronics assembly due to the inherent toxicity of Pb. This has provided an impetus towards the development of Pb-free solders. A major factor affecting alloy selection is the melting point, since this will have a major impact on the other polymeric materials used in microelectronic assembly and encapsulation. Other important manufacturing issues are cost, availability, and wetting characteristics. Reliability related properties include mechanical strength, fatigue resistance, coefficient of thermal expansion and reactivity with substrate. In this article, Pb-free solder alloys have been proposed so far have been reviewed and are summarized.

• Journal of the Korean Ceramic Society
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• v.44 no.8
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• pp.403-406
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• 2007

Ferroelectric Ce-doped $Bi_4Ti_3O_{12}$ (BCT) thin films were deposited by liquid delivery metal organic chemical vapor deposition (MOCVD) onto a $Pt(111)/Ti/SiO_2/Si(100)$ substrate. X-ray diffraction (XRD) and scanning electron microscopy (SEM) were used to identify the crystal structure, the surface, and the cross-section morphology of the deposited ferroelectric flims. After annealing above $640^{\circ}C$, the BCT films exhibited a polycrystalline structure with preferred (001) and (117) orientations. The BCT lam capacitor with a top Pt electrode showed a large remnant polarization ($2P_r$) of $44.56{\mu}C/cm^2$ at an applied voltage of 5 V and exhibited fatigue-free behavior up to $1.0{\times}10^{11}$ switching cycles at a frequency of 1 MHz. This study clearly reveals that BCT thin film has potential for application in non-volatile ferroelectric random access memories and dynamic random access memories.

• Korean Chemical Engineering Research
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• v.50 no.2
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• pp.211-216
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• 2012

Wet chemical etching of stainless steel foil by aqueous ferric chloride solution was investigated in this study. Effects of various process parameters (e.g. etchant agitation rate, etchant temperature, $Fe^{3+}$ ion concentration, free HCl concentration, specific gravity, etc.) on the etch rate was first studied, and it was found that the etch rate of AK (aluminum-killed) steel, chromium metal and stainless steel (STS430J1L alloy) follows the pseudo-first order reaction equation. When the fatigue ratio of etchant was kept under 16%, sludge was not formed in the solution, and the etched surface showed smooth roughness. The etch rate decreases as Baume of etchant increases, but the effect of free HCl concentration on the etch rate turned out to be minimal. Experimental data were compared with the calculated results from modeled equation, showing very good agreement.

• Transactions of the Korean Society of Automotive Engineers
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• v.22 no.3
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• pp.90-96
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• 2014

The conventional SnPb solders were widely used for several decades in the electronic packing system due to the superior mechanical properties such as low melting point, better wettavility and good mechanical fatigue. However, in recent years, owing to adverse effect on the human health and environment, conventional SnPb solders have been replaced by Lead-free solders. In this research, the shear punch(SP) test of Sn-4Ag-(Cu)/Ni pad was performed. Pb-free solder alloys which are the environmentally friendly of the electronic components were performed at $150^{\circ}C$ for 100hr~1000hr to artificial aging processing. In order to evaluate the mechanical properties of solder joints, the SP test was conducted at $30^{\circ}C$ and $50^{\circ}C$. As a result, the maximum shear strength of almost the whole specimens was decreased with the increase in aging time and temperature of SP test. The mechanical properties of Sn-4Ag-0.5Cu solder were most excellent in all Pb-free solder which were produced by the SP test at $30^{\circ}C$.

• Composites Research
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• v.13 no.1
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• pp.89-97
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• 2000

Fatigue damage detection and vibration sensing for a laminated composites and impact location detection for a steel beam have been carried out using optical fiber sensor. Intensity based optical fiber sensor is constructed by placing two cleaved fiber end in a hollow glass tube, and multiple reflection within the cavity is considered. Fatigue signals are measured by embedded optical fiber, surface mounted optical fiber sensor and strain gage simultaneously. For vibration sensing, optical fiber sensor is mounted on the carbon fiber composite beam and its response to free vibration and forced vibration is investigated. In impact location detection, two optical fiber sensors are used and the information obtained from two sensors is arrival time delay of vibration caused by impact. Impact location can be calculated from this time delay. The obtained results show that the intensity based optical fiber sensor provide reliable data during long-term fatigue loading, unlike strain gage which deteriorate during the early part of the fatigue test. Optical fiber sensor signals coincide with gap sensor in vibration sensing. The precise locations of impact can be detected within 4.1% error limit.

• Korean Journal of Pharmacognosy
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• v.44 no.1
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• pp.83-90
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• 2013

The aim of this study was to evaluate the effect of hot water extract of peduncle obtained from Hovenia dulcis Thunb (HD) which is commercially developed for the protective effect on the alcoholic hepatotoxicity, on the endurance capacity for weight loaded forced swimming mice. The swimming times to exhaustion in mice fed 100 and 200 mg/kg HD for 2 weeks were prolonged 3.6 and 3.7 fold, and for 4 weeks 1.9 and 2.7 fold compared with each vehicle control ($42.8{\pm}20.5$ min and $67.7{\pm}47.8$ min, for 2 and 4 weeks), respectively. Blood biochemical parameters for ALT, AST, creatinine and BUN were not significantly different between from HD fed or control mice. Although HD fed mice swam over 2 fold longer time than vehicle control mice at 4 weeks, blood biomarkers of physical fatigue such as glucose, triglyceride and free fatty acid, lactate were not significant different and even tended to ameliorate. Hepatic lipid peroxidation and SOD activity did not significantly change in HD fed- and vehicle control exhausted swimming mice at 2 or 4 weeks. However, catalase activity in HD-fed mice was significantly increased in a dose-dependent manner compared with vehicle control mice. The present study indicates that HD improved physical fatigue and exercise performance in mice. Therefore, it has a potential for the pharmacological effect of anti-fatigue.

• Korean Journal of Metals and Materials
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• v.47 no.8
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• pp.500-507
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• 2009

Pb-free solder has recently been used in electronics in efforts to meet environmental regulations, and a number of Pb-free solder alloy choices beyond the near-eutectic SnAgCu solder are now available. With increased demand for thin and portable electronics, the high cost of alloys containing significant amounts of silver and their poor mechanical shock performance have spurred the development of low Ag SnAgCu solder, which provides improved mechanical performance at a reasonable cost. Although low Ag SnAgCu solder exhibits significantly higher fracture resistance under high-strain rates, little thermal fatigue data exist for this solder. Therefore, it is necessary to investigate thermal fatigue reliability of low Ag SnAgCu solder under variation of thermal stress in order to allow its implementation in electronic products with high reliability requirements. In this study, the reliability of Sn0.3Ag0.7Cu(SAC0307), a low Ag solder alloy, is discussed and compared with that of Sn3Ag0.5Cu(SAC305). Three sample types and six samples size are evaluated. Mechanical properties and microstructure of the solder joint are investigated under thermal shock cycles. It was observed that the mechanical strength of SAC0307 dropped slightly with thermal cycling relative to that of SAC305. This reveals that the failure mode of SAC0307 is different from that SAC305 under this critical condition.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2007.05a
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• pp.393-398
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• 2007

Balance shaft has a key role in reducing a engine vibration in a vehicle and widely applied for current models. Since balance shaft module consists many sub-component and each part had its own operational characteristics, some different analysis background should be integrated into one sub-part in balance shaft module and this is the main obstacles in making a design process. Moreover, the balancing shaft rotating in high speed and such condition requires large safety factors in a design process owing to a lot of unexpected problems with the overwhelming rotation. Balance shaft is the core-component generating the intended unbalance as well as canceling the unbalance force or moment by the engine module. So, the balance shaft should meet the high fatigue resistance not to mention of NVH performance. In this paper, a design strategy focused on balance shaft is developed to build a optimal model considering a engine vibration. Putting the unbalance mass distribution as main design parameter, some candidate model is verified with structural and fatigue analysis most appropriate model is proposed here.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.59 no.6
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• pp.1083-1086
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• 2010

The $Sr_{0.7}Bi_{2.3}Nb_2O_9$ thin films were deposited on Si substrate using RF magnetron sputtering method. And the SBN thin films were annealed at 650~800$[^{\circ}C$]. The surface rougness showed about 0.42[nm] in annealed thin film at $650[^{\circ}C$]. The dielectric constant(150) of SBN thin film was obtained by annealing temperature above $700[^{\circ}C$]. The voltage dependence of dielectric loss showed a value within 0.02 in voltage ranges of -10~＋10[V]. The dielectric constant characteristics showed a stable value with the increase of frequency. Also, the SBN thin films annealed at $750[^{\circ}C$] showed a fatigue-free characteristics up to $1.0\times10^8$ cycles.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2006.10a
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• pp.170-173
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• 2006

Ferroelectric $Bi_{3.35}Sm_{0.65}Ti_3O_{12}(BST)$ thin films were deposited on $Pt(111)/Ti/SiO_2/Si(100)$ substrates by a sol-gel spin-coating process. In this experiments, $Bi(TMHD)_3$, $Sm_5(O^iPr)_{13}$, $Ti(O^iPr)_4$ were used as precursors, which were dissolved in 2-methoxyethanol. Thereafter, the thin films with the thickness, of 240nm were annealed from 600 to $720^{\circ}C$ in oxygen atmosphere for 1 hr, and post-annealed in oxygen atmosphere for 1 hr after deposition of Pt electrode to enhance the electrical properties. The remanent polarization and coercive voltage of the BST thin films annealed at $720^{\circ}C$ were $19.48\;{\mu}C/cm^2$ and 3.40 V, respectively, and a fatigue-free characteristics. As a result, Sm-substituted bismuth titanate films with good ferroelectric properties and excellent fatigue resistance are useful candidates for ferroelectric memory applications.