• Nuclear Engineering and Technology
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• v.51 no.7
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• pp.1822-1827
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• 2019

Mechanical responses and failure behaviors of advanced C/C composite tube are very important for structural component design in nuclear reactor. In this study, an experimental investigation was conducted to study mechanical properties of C/C composite tube. Quasi-static compression loading was applied to a type of advanced composite tube to determine the response of the quasi-static load displacement curve during progressive damage. Acoustic emissions (AE) signals were captured and analyzed to characterize the crack formation and crack development. In addition, the crack propagation of the specimens was monitored by imaging technique and failure mode of the specimen was analyzed. FEM is appled to simulate the stress distribution. Results show that advanced C/C composite tube exhibits considerable energy absorption capability and stability in load-carrying capacity.

• Journal of the Korean Society for Aviation and Aeronautics
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• v.27 no.3
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• pp.15-23
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• 2019

This paper contains analyses and development processes of the requirements to detect the possible intermittent failure in an old avionics backplane. Interconnections for signal transmission between electronic components, such as Pin-to-PCB, FPCB-to-FPCB, pin-to-FPCB, and pint-to-wire, were selected as the main cause of intermittent failure by analyzing target equipment and documents. The possibility of detecting intermittent failures occurring in the target equipment is verified by physics-of-failure analyses. In order to verify the occurrence of intermittent failures and their detectability, latching continuity circuit testers were manufactured and accelerated life tests were performed by applying temperature and vibration cycle in consideration of flight conditions. Through the above process, the detection requirements for the major intermittent failure in the target avionics backplane was developed.

• Journal of Korean Vacuum Science & Technology
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• v.6 no.2
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• pp.62-66
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• 2002

Hydraulic pumps are used to control the landing wheels of aircrafts, and their proper operation is vital to plane safety It is well hewn that adhesive wear failure is a major cause of pump failure. A dual nitrogen plasma immersion ion implantation process calling for the implantation of nitrogen at two different energies and doses has been developed to enhance the surface properties of the disks in the pumps. The procedures meet the strict temperature requirement of <200$^{\circ}C$, and after the treatment, the working lifetime of the pumps increases by more than a factor of two. This experimental protocol has been adopted by the hydraulic pump factory as a standard manufacturing procedure.

• Proceedings of the KWS Conference
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• 2009.11a
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• pp.71-71
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• 2009

전자제품의 다양한 기능들의 융복합화 및 휴대 편의성 경향은 이제 더 이상 새로운 것이 아니다. 이러한 추세에 따라 전자부품들은 모듈화 되고, 휴대하기 용이해 지고 있다. 또한 다양한 제품 디자인에 적용하기 위해 제품에 장착되는 부품의 기구적 위치 배열의 한계 또한 제약 받고 있다. 따라서 최근의 전자부품은 모듈화 되고 있으며, 기구적 한계를 극복하기 위한 Flexible 모듈의 사용이 증가하고 있다. 또한 양산측면에서 Roll-to-Roll(R2R) 방식을 적용함으로써 생산성을 극대화 하고 있다. 이때 R2R 적용을 위해서는 제품이 굴곡 될 수 있도록 유연성이 보장되는 Bendable 전자모듈의 개발이 필수적으로 요구되고 있다. Flexible 기판은 더 이상 새로운 기술이 아니지만, Felxible 기판 내부에 칩이 내장되고, 회로가 형성되어 자체적으로 기능을 수행할 수 있도록 한 Bendable 전자모듈을 R2R 방식으로 제조하는 기술은 매우 새로운 접근이라 할 수 있다. 이러한 기술개발이 현실화 된다면, Wearable Electronics 및 Flexible Display 등 다양한 전자제품에 응용될 수 있을 것으로 기대된다. 그러나 이러한 제품의 상용화를 위해서는 Bendable 전자모듈에 대한 신뢰성이 확보되고, 제품으로써의 수명이 보증되어야 한다. 신규 개발되는 제품의 신뢰성 검증항목이나 수명평가 모델은 현재까지 제안되지 않고 있는 실정이다. 또한 다양한 사용 환경에서 고장(Failure) 발생을 유발하는 스트레스 인자(Stress Factor)를 도출함으로써, 가속시험 또는 신뢰성 검증을 위한 인가 스트레스를 선정할 수 있다. 그러나 이러한 고장물리를 기반으로 스트레스 인자를 해석한 결과는 아직 보고되고 있지 않다. 따라서 본 연구에서는 $50{\mu}m$ 두께의 Si Chip에 저항변화를 관찰하기 위한 회로를 형성한 후 폴리이미드 기판을 이용하여 Si Chip이 임베딩된 Bendable 전자모듈을 제작하였다. 전자모듈의 실사용 환경에서의 수명예측을 위한 사전단계로써 고장물리에 기반한 고장모드와 고장메카니즘을 해석하는 것이 최우선 수행되어야 하며, 이를 바탕으로 고장을 유발하는 스트레스 인자를 도출 하였다. 고장도출을 위해 시제품은 JEDEC J-STD-020C의 MSL시험, 고온가압시험, 열충격시험 및 고온저장시험을 각각 수행하였으며, 이로부터 발생된 각각의 고장유형을 분석함으로써 스트레스 인자를 도출하였다. 또한 모아레(Moire) 간섭계를 이용하여 제작된 샘플의 온도변화에 따른 변형해석을 수행하였고, 동시에 Half Symetry Model을 이용한 유한요소해석(FEA)을 수행하여 변형해석 및 스트레스 유발원인을 도출하였다. 이 결과로 부터 고장물리 기반의 고장해석과 Moire 분석 그리고 시뮬레이션 해석 결과를 바탕으로 Bendable 전자모듈의 고장유발 스트레스 인자를 해석할 수 있었다.

• Journal of Welding and Joining
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• v.31 no.5
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• pp.59-63
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• 2013

A bendable electronic module has been developed for a mobile application by using a low-cost roll-to-roll manufacturing process. In flexible embedded electronic module, a thin silicon chip was embedded in a polymer-based encapsulating adhesive between flexible copper clad polyimide layers. To confirm reliability and durability of prototype bendable module, the following tests were conducted: Moisture sensitivity level, thermal shock test, high temperature & high humidity storage test, and pressure cooker tester. Those experiments to induce failure of the module due to temperature variations and moisture are the experiment to verify the reliability. Failure criterion was 20% increase in bump resistance from the initial value. The mechanism of the increase of the bump resistance was analyzed by using non-destructive X-ray analysis and scanning acoustic microscopy. During the pressure cooker test (PCT), delamination occurred at the various interfaces of the bendable embedded modules. To investigate the failure mechanism, moisture diffusion analysis was conducted to the pressure cooker's test. The hygroscopic characteristics of the encapsulating polymeric materials were experimentally determined. Analysis results have shown moisture saturation process of flexible module under high temperature/high humidity and high atmosphere conditions. Based on these results, stress factor and failure mechanism/mode of bendable embedded electronic module were obtained.

• Proceedings of the KSME Conference
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• 2007.05a
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• pp.1749-1753
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• 2007

The reliability, that is Long-Term Quality, require an approaching different from Short-Term Quality which is used before. As the electronic components are able to be easily normalized on the reliability testing, various testing standards are used. In this study, we proposed two reliability simulator that is PoF(Physics of Failure)-based and failure rate models-based. PoF-based simulator is introduced based on CalceEP program that is created by University of Maryland. This simulator can be modified by user interface of properties and PoF models and operated on stand alone system. Failure rate models-based simulator introduced according to analyzing reliability prediction documents. Also, unified database including failure data models is built from existing MIL-HDBK-217F N2, PRISM, and Bellcore, and web-based simulator is developed. The developed reliability simulator will service of the PoF model, properties, failure rate model accumulated and its data by web and internet.

• Journal of Korean Institute of Industrial Engineers
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• v.25 no.2
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• pp.204-216
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• 1999

Failure physics and statistical lifetime analysis constitute the two extreme ends of the reliability engineering spectrum, and studies that relate failure mechanisms to failure distributions have been near non-existent. This paper is an attempt to stimulate interest to fill the gap between the two extremes and proposes an approach of combining them through i) developing a failure mechanism model, ii) generating failure times by Monte Carlo simulation with the model, iii) deriving the failure time distribution and evaluating the product reliability, and iv) improving the product reliability by the sensitivity analysis. An application of the proposed approach to the BGA(Ball Grid Array) surface mount package is also provided.

• Korean Journal of Metals and Materials
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• v.47 no.8
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• pp.500-507
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• 2009

Pb-free solder has recently been used in electronics in efforts to meet environmental regulations, and a number of Pb-free solder alloy choices beyond the near-eutectic SnAgCu solder are now available. With increased demand for thin and portable electronics, the high cost of alloys containing significant amounts of silver and their poor mechanical shock performance have spurred the development of low Ag SnAgCu solder, which provides improved mechanical performance at a reasonable cost. Although low Ag SnAgCu solder exhibits significantly higher fracture resistance under high-strain rates, little thermal fatigue data exist for this solder. Therefore, it is necessary to investigate thermal fatigue reliability of low Ag SnAgCu solder under variation of thermal stress in order to allow its implementation in electronic products with high reliability requirements. In this study, the reliability of Sn0.3Ag0.7Cu(SAC0307), a low Ag solder alloy, is discussed and compared with that of Sn3Ag0.5Cu(SAC305). Three sample types and six samples size are evaluated. Mechanical properties and microstructure of the solder joint are investigated under thermal shock cycles. It was observed that the mechanical strength of SAC0307 dropped slightly with thermal cycling relative to that of SAC305. This reveals that the failure mode of SAC0307 is different from that SAC305 under this critical condition.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.35 no.7
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• pp.799-804
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• 2011

A thermal cycling test was conducted on a chip resistor solder joint with real-time failure monitoring. In order to study the failure mechanism of the chip resistor solder joint during the test, the resistance between both ends of the resistor was monitored until the occurrence of failure. It was observed that the monitored resistance first fluctuated linearly according to the temperature change. The initial variation in the resistance occurred at the time during the cycle when there was a decrease in temperature. A more significant change in the resistance followed after a certain number of cycles, during the time when there was an increase in the temperature. In order to explain the failure patterns of the solder joint, a mechanism for the solder failure was suggested, and its validity was proved through FE simulations. Based on the explained failure mechanism, it was shown that prognostics for the solder failure can be implemented by monitoring the resistance change in a thermal cycle condition.

• Journal of Advanced Navigation Technology
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• v.28 no.2
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• pp.216-224
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• 2024

This paper presents a method for analyzing the reliability of hardware electronic equipment, taking into account failures caused by radiation. Traditional reliability analysis primarily focuses on the wear out failure rate and often neglects the impact of radiation failure rates. We calculate the wear out failure rate through physics of failure analysis, while the radiation failure rate is semi-empirically estimated using the Verilog Fault Injection tool. Our approach aims to ensure reliability early in the development process, potentially reducing development time and costs by identifying circuit vulnerabilities in advance. As an illustrative example, we conducted a reliability analysis on the ISCAS85 circuit. Our results demonstrate the effectiveness of our method compared to traditional reliability analysis tools. This thorough analysis is crucial for ensuring the reliability of FPGAs in environments with high radiation exposure, such as in aviation and space applications.