Transactions of the Korean Society of Mechanical Engineers A (대한기계학회논문집A)

The Korean Society of Mechanical Engineers (대한기계학회)
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Study on the Failure Mechanism of a Chip Resistor Solder Joint During Thermal Cycling for Prognostics and Health Monitoring

고장예지를 위한 온도사이클시험에서 칩저항 실장솔더의 고장메커니즘 연구

  • Han, Chang-Woon (Reliability Physics Research Center, Korea Electronics Technology Institute) ;
  • Park, Noh-Chang (Reliability Physics Research Center, Korea Electronics Technology Institute) ;
  • Hong, Won-Sik (Reliability Physics Research Center, Korea Electronics Technology Institute)
  • 한창운 (전자부품연구원 신뢰성물리연구센터) ;
  • 박노창 (전자부품연구원 신뢰성물리연구센터) ;
  • 홍원식 (전자부품연구원 신뢰성물리연구센터)
  • Received : 2011.02.10
  • Accepted : 2011.04.20
  • Published : 2011.07.01
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Abstract

A thermal cycling test was conducted on a chip resistor solder joint with real-time failure monitoring. In order to study the failure mechanism of the chip resistor solder joint during the test, the resistance between both ends of the resistor was monitored until the occurrence of failure. It was observed that the monitored resistance first fluctuated linearly according to the temperature change. The initial variation in the resistance occurred at the time during the cycle when there was a decrease in temperature. A more significant change in the resistance followed after a certain number of cycles, during the time when there was an increase in the temperature. In order to explain the failure patterns of the solder joint, a mechanism for the solder failure was suggested, and its validity was proved through FE simulations. Based on the explained failure mechanism, it was shown that prognostics for the solder failure can be implemented by monitoring the resistance change in a thermal cycle condition.

본 논문에서는 칩저항을 실장하는 솔더에 대한 온도사이클 시험을 수행하고, 그 결과로부터 고장 예지 실현을 위한 열하중에서의 솔더실장의 고장메커니즘을 연구하였다. 시험 중 솔더의 고장을 모니터링하기 위하여 실장된 칩저항 양단간의 저항 변화를 데이터 측정기로 실시간 관찰하였다. 관찰 데이터로부터 솔더의 크랙 진전 중과 크랙 진전 완료 시점의 고장 메커니즘을 제시하였다. 제시된 고장 메커니즘을 유한요소법으로 검증하여 솔더의 크랙이 진전 중에는 저온조건에서 크랙이 열리고 저항이 증가하며, 크랙의 진전이 완료된 후에는 고온조건에서 크랙이 열리고 저항이 증가하는 조건으로 바뀜을 보였다. 이런 결과에 기반하여 온도 사이클에서 저항측정을 통해 칩저항 실장 솔더의 고장예지가 가능함을 제시하였다.

Keywords

References

  1. Pecht, M., 2008, Prognostics and Health Management of Electroncis, John Wiley & Sons Inc, Hoboken, New Jersey.
  2. Zhang, S., Kang, R., Niu, G. and Pecht, M., 2010, "Status of Research and Development on Prognostics and Heath Management in China," PHM Conference 2010.
  3. Bailey, H. L. C., 2000, "Modeling the Fatigue Life of Solder Joints for Surface Mount Resistors," International Symposium on Elastic Materials and Packaging 2000.
  4. Han, C.-W. and Song, B., 2006, "Development of Life Prediction Model for Lead-Free Solder at Chip Resistor," 8th EPTC, 2006, pp.781-786.
  5. IPC Technical Committees, 2004, IPC-SM-785, "Guidelines for Accelerated Reliability Testing of Surface Mount Solder Attachments," pp.737-746,
  6. IPCTechnical Committees, 2002, IPC-9701, "Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments," p.13.
  7. Salemi, S., Yang, L., Dai, J., Qin, J. and Bernstein, J. B., 2008, Physics-of-Failure Based Handbook of Microelectronics Systems, Reliability Information Analysis Center, Utica, NY, p.189.

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