• Proceedings of the Earthquake Engineering Society of Korea Conference
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• 2006.03a
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• pp.589-596
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• 2006

Torsional behavior of eccentric structures under seismic loading may cause stress and/or strain concentration, which result in the failure of the structures in an unexpected manner. This study propose how to assess the seismic capacity of plan-irregular RC wall structures. The seismic capacities ate expressed in terms of lateral displacement capacity of each wall. The seismic demands for displacement are assessed by so called displacement-based design approach. Those seismic capacity and demands are combined D-R coordinate, which is made up of lateral displacement and rotation angle. To expand these concepts to the inelastic region the adaptive modal analysis method is used. In addition, the failure mechanisms including torsional failure are defined on D-R coordinate. Finally, seismic assessments of two 3-story plan-irregular wall structures ate presented.

• Structural Engineering and Mechanics
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• v.37 no.1
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• pp.79-93
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• 2011

A simple mechanical model is proposed to demonstrate qualitatively the pancake progressive collapse of multi-storey structures. The impact between two collapsed storeys is simulated using a simple algorithm that builds on virtual mass-spring-damper system. To analyze various collapse modes, columns and beams are considered separately. Parametric studies show that the process of progressive collapse involves a large number of complex mechanisms. However, the proposed model provides a simple numerical tool to assess the overall behavior of collapse arising from a few initiating causes. Unique features, such as beam-to-beam connection failure criterion, and beam-to-column connection failure criterion are incorporated into the program. Besides, the criterion of local failure of structural members can also be easily incorporated into the proposed model.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.18 no.6
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• pp.37-43
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• 2017

This review investigates the basic principle of physical interactions and failure mechanisms introduced in the materials and inner parts of semiconducting components under electromagnetic pulses (EMPs). The transfer process of EMPs at the semiconducting component level can be explained based on three layer structures (air, dielectric, and conductor layers). The theoretically absorbed energy can be predicted by the complex reflection coefficient. The main failure mechanisms of semiconductor components are also described based on the Joule heating energy generated by the coupling between materials and the applied EMPs. Breakdown of the P-N junction, burnout of the circuit pattern in the semiconductor chip, and damage to connecting wires between the lead frame and semiconducting chips can result from dielectric heating and eddy current loss due to electric and magnetic fields. To summarize, the EMPs transferred to the semiconductor components interact with the chip material in a semiconductor, and dipolar polarization and ionic conduction happen at the same time. Destruction of the P-N junction can result from excessive reverse voltage. Further EMP research at the semiconducting component level is needed to improve the reliability and susceptibility of electric and electronic systems.

• The korean journal of orthodontics
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• v.30 no.1 s.78
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• pp.67-82
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• 2000

The purpose of this study was to present the causes and their mechanisms of eruption failure of teeth and to investigate the treatment modalities. There are so many reports about eruption failure, but most of them are dealing with local mechanical interferences. But, we have patients suffered from eruption failure of another causes. Many developmental failures show eruption problems of teeth, although in some cases, the primary failure of eruption (failure of the eruption mechanism itself) can be the primary cause. We have to know about the causes, differences, and the treatment modalities for those abnormalities.

• Tribology and Lubricants
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• v.33 no.4
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• pp.127-133
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• 2017

In order to characterize the adhesive properties and failure mechanisms of diamond-like carbon (DLC) films of two different thicknesses (130 nm and $1.2{\mu}m$), deposited by plasma-enhanced chemical vapor deposition on a Si substrate, scratch testing with a micro-indenter ($12.5{\mu}m$ tip radius) was performed under a linearly increasing load. These scratch tests were conducted under the same test conditions for both films. The critical load of each film was estimated from the scratch test results, based on a sharp increase in the coefficient of friction and a clear distinction of failure modes. The critical load was the basis for evaluating the adhesion strength of the films, and the $1.2{\mu}m-thick$ DLC film had superior adhesion strength. For better understanding of the failure modes, the following analyses were conducted: friction behavior and scratch tracks analysis using scanning electron microscopy, energy-dispersive spectroscopy, and 3-D profilometry. The scratch test results showed that failure modes were related to the thickness of the films. The 130 nm-thick DLC film underwent cohesive failure modes (cracks and chipping) before reaching to a gross failure stage. On the other hand, the thicker DLC film ($1.2{\mu}m-thick$) did not exhibit micro cracks before a sudden gross failure of the film together with the evidence of cracking and chipping of the Si substrate.

• KSII Transactions on Internet and Information Systems (TIIS)
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• v.10 no.9
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• pp.4023-4043
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• 2016

Network virtualization has been regarded as a core attribute of the Future Internet. In a network virtualization environment (NVE), multiple heterogeneous virtual networks can coexist on a shared substrate network. Thus, a substrate network failure may affect multiple virtual networks. In this case, it is increasingly critical to provide survivability for the virtual networks against the substrate network failures. Previous research focused on mechanisms that ensure the resilience of the virtual network. However, the resource efficiency is still important to make the mapping scheme practical. In this paper, we study the survivable virtual network embedding mechanisms against substrate link and node failure from the perspective of improving the resource efficiency. For substrate link survivability, we propose a load-balancing and re-configuration strategy to improve the acceptance ratio and bandwidth utilization ratio. For substrate node survivability, we develop a minimum cost heuristic based on a divided network model and a backup resource cost model, which can both satisfy the location constraints of virtual node and increase the sharing degree of the backup resources. Simulations are conducted to evaluate the performance of the solutions. The proposed load balancing and re-configuration strategy for substrate link survivability outperforms other approaches in terms of acceptance ratio and bandwidth utilization ratio. And the proposed minimum cost heuristic for substrate node survivability gets a good performance in term of acceptance ratio.

• Journal of the Korean Society for Marine Environment & Energy
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• v.1 no.2
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• pp.82-95
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• 1998

In this paper, two series of numerical simulations are performed using LS/DYNA3D: The first series of numerical simulations are collision events between a 310,000 DWT double hull VLCC (struck ship) and two 35,000 and 105,000 DWT tankers (striking ships). Collisions are assumed to occur at the middle of the VLCC with the striking ships moving at right angle to the YLCC centerline. The second ones, grounding accidents of two 40,000 DWT Conventional and Advanced Double Hull lanker bottom structures, CONV/PD328 and ADH/PD328 models. The overall objective of this study is to understand the structural failure and energy absorbing mechanisms during collision and grounding events for double hull tanker side and bottom structures, which lead to the initiation of inner shell rupture and cause the kinetic energy dissipation to bring the ship to a stop. These numerical simulations will contribute to the estimation of damage extents of collision and grounding accidents and the future improvements in lanker safety at the design stage.

• Journal of the Korean Society of Fisheries and Ocean Technology
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• v.39 no.2
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• pp.158-163
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• 2003

Thermosetting matrix composites have disadvantages in terms of moulding time, repairability and manufacturing cost. Thus the high-performance thermoplastic composites to eliminate such disadvantages have been developed so far. As a result of environmental and economical concerns, there is a growing interest in the use of thermoplastic composites. However, since their mechanical properties are very sensitive to the environment such as moisture, temperature etc., those behaviors need to be studied. Particularly the temperature is a very important factor influencing the mechanical behavior of thermoplastic composites. The effect of temperature have not yet been fully quantified. Since engineering applications of reinforced composites necessitate their fracture mechanic characterization, work is in progress to investigate the fracture and related failure behavior. An approach which predicts the tensile strength was perpormed in the tensile test. The main goal of this work is to study the effect of temperature on the result of tensile test with respect to GF/PE composite. The tensile strength and failure mechanisms of GF/PE composites were investigated in the temperature range 6$0^{\circ}C$ to -5$0^{\circ}C$. The tensile strength increased as the fiber volume fraction ratio increased. The tensile strength showed the maximum at -5$0^{\circ}C$, and it tended to decrease as the temperature increased from -5$0^{\circ}C$. The major failure mechanism was classified into the fiber matrix debonding, the fiber pull-out, the delamination and the matrix deformation.

• Korean Journal of Materials Research
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• v.22 no.10
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• pp.545-551
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• 2012

In semiconductor manufacturing, the circuit integrity of packaged BGA devices is tested by measuring electrical resistance using test sockets. Test sockets have been reported to often fail earlier than the expected life-time due to high contact resistance. This has been attributed to the formation of Sn oxide films on the Au coating layer of the probe pins loaded on the socket. Similar to contact failure, and known as "fretting", this process widely occurs between two conductive surfaces due to the continual rupture and accumulation of oxide films. However, the failure mechanism at the probe pin differs from fretting. In this study, the microstructural processes and formation mechanisms of Sn oxide films developed on the probe pin surface were investigated. Failure analysis was conducted mainly by FIB-FESEM observations, along with EDX, AES, and XRD analyses. Soft and fresh Sn was found to be transferred repeatedly from the solder bump to the Au surface of the probe pins; it was then instantly oxidized to SnO. The $SnO_2$ phase is a more stable natural oxide, but SnO has been proved to grow on Sn thin film at low temperature (< $150^{\circ}C$). Further oxidation to $SnO_2$ is thought to be limited to 30%. The SnO film grew layer by layer up to 571 nm after testing of 50,500 cycles (1 nm/100 cycle). This resulted in the increase of contact resistance and thus of signal delay between the probe pin and the solder bump.

• Journal of Physiology & Pathology in Korean Medicine
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• v.29 no.1
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• pp.1-10
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• 2015

This article is a study on palpitation of which disease cause, disease mechanism and formulas were analyzed with reference to annotations on "Shanghanlun" and "Jinkuiyaolue". And the scope of modern diseases related with palpitation was drawn by research on clinical papers. The source books are "Zhujieshanghanlun" and "Jinkuiyaoluefanglun" and the clinical papers are searched in China Academic Journals(CAJ) of China National Knowledge Infrastructure(CNKI). 13 clauses in "Shanghanlun" and 9 clauses in "Jinkuiyaolue" and 12 formulas are related with palpitation. Disease mechanisms of palpitation were classified as yang deficiency, yin deficiency, qi deficiency, blood deficiency, retained fluid, cold, etc and these days, qi stagnation, phlegm turbidity, blood stasis and fire heat are also considered as disease mechanisms. Modern diseases related with palpitation are arrhythmia(extrasystole, atrial fibrillation, bradycardia, tachycardia, sick sinus syndrome, atrioventricular block), vascular diseases(arterial occlusion, phlebothrombosis, Buerger's disease, coronary artery disease, vasculitis), blood pressure disorder(hypertension, hypotension) and heart diseases such as heart failure, angina pectoris, myocardial infarction, myocarditis, cardiomyopathy, pericardial effusion. And diseases related with psychological change(cardiac neurosis, anxiety neurosis, neurosis, depression, hyperthyroidism, hypothyroidism), pyrexia, anemia, drug intoxication, etc are also related with palpitation. Zhen Wu Tang showing an efficacy in dilating blood vessels and strengthening cardiac function, Wuling Powder with diuretic effect and Fried Glycyrrhizae Decoction acting on the ${\beta}$ receptor are applied to heart failure in different ways. Fried Glycyrrhizae Decoction(308 cases), Zhen Wu Tang(154), Wuling Powder(54), Xiao Chaihu Tang(34), Sini San(20) are reported to have been clinically applied to cardiovascular diseases and Zhen Wu Tang and Wuling Powder mainly applied to heart failure, Fried Glycyrrhizae Decoction, Lizhong Wan, Sini San and Zhen Wu Tang chiefly applied to arrhythmia related diseases. This study focuses on the general research and consideration on clinical applications and is a preliminary study to understand relations between Korean Medicine's symptoms and categories of modern diseases.