• Title/Summary/Keyword: Fabrication Error

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Image Enhancement Using Error Diffusion with APL in PDP (APL 적용 오차 확산법을 이용한 PDP 화질 개선)

  • Jang Soo-Wook;Pyo Se-Jin;Lee Sung-Hak;Sohng Kyu-Ik;Kim Eun-Su
    • Journal of Korea Multimedia Society
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    • v.8 no.10
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    • pp.1360-1368
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    • 2005
  • PDP is the flat panel display, suitable for high definition television because of large-sire and high-brightness. It has many advantages such as fast response, wide viewing angle, low weight, and simple manufacturing process for fabrication. However, there are some disadvantages and one of them is the image quality degradation, which is dependent on the digital signal processing. Although image quality of PDP is improving by many researches and experimentations, it still isn't as good as that of CRT because of various factors. One of them is worm-like pattern generated by an error diffusion process. And the worm-like pattern is severely increased after an APL process. An increased worm-like pattern occur a drop of resolution in image and a change of CCT according to each grayscale. In this paper, a method for improvement of image quality using the error diffusion which considers the APL process is proposed. In the proposed method, the APL process is performed before the error diffusion process. Simulation results showed that the proposed method has better performances for resolution in images and CCT uniformity according to each grayscale than the conventional method.

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Cu Electroplating and Low Alpha Solder Bumping on TSV for 3-D Packaging (3차원 실장을 위한 TSV의 Cu 전해도금 및 로우알파 솔더 범핑)

  • Jung, Do hyun;Kumar, Santosh;Jung, Jae pil
    • Journal of the Microelectronics and Packaging Society
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    • v.22 no.4
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    • pp.7-14
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    • 2015
  • Research and application of three dimensional packaging technology in electronics have been increasing according to the trend of high density, high capacity and light weight in electronics. In this paper, TSV fabrication and research trend in three dimensional packaging are reported. Low alpha solder bumping which can solve the soft error problem in electronics is also introduced. In detail, this paper includes fabrication of TSV, functional layers deposition, Cu filling in TSV by electroplating using PPR (periodic pulse reverse) and 3 step PPR processes, and low alpha solder bumping on TSV by solder ball. TSV and low alpha solder bumping technologies need more studies and improvements, and the drawbacks of three dimensional packaging can be solved gradually through continuous attentions and researches.

Change of stochastic properties of MEMS structure in terms of dimensional variations using function approximation moment method (함수 근사 모멘트 기법을 활용한 치수 분포에 따른 MEMS 구조물의 통계적 특성치 변화에 관한 연구)

  • Huh J.S.;Kwak B.M.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2005.06a
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    • pp.602-606
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    • 2005
  • A systematic procedure of probability analysis for general distributions is developed based on the first four moments estimated from polynomial interpolation of the system response function and the Pearson system. The function approximation is based on a specially selected experimental region for accuracy and the number of function evaluations is taken equal to that of the unknown coefficient for efficiency. For this purpose, three error-minimizing conditions are proposed and corresponding canonical experimental regions are formed for popular probability. This approach is applied to study the stochastic properties of the performance functions of a MEMS structure, which has quite large fabrication errors compared to other structures. Especially, the vibratory micro-gyroscope is studied using the statistical moments and probability density function (PDF) of the performance function to be the difference between resonant frequencies corresponding to sensing and driving mode. The results show that it is very sensitive to the fabrication errors and that the types of PDF of each variable also affect the stochastic properties of the performance function although they have same the mean and variance.

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Design and Fabrication of a Wideband Ground Impedance Meter (광대역 접지임피던스 측정기의 설계 및 제작)

  • Kil, Gyung-Suk;Park, Dae-Won;Jang, Un-Yong;Han, Ju-Seop;Gil, Hyoung-Jun
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.23 no.10
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    • pp.793-797
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    • 2010
  • The basic performance of the ground system is evaluated as the ground resistance by applying low frequency current below 1 kHz. However, characteristics of the ground system should be analyzed by high frequency current up to 1 MHz since transient currents having a few hundred kHz component flow during a line-to-ground fault and/or a lightning strike. This paper deals with the design and fabrication of a wideband ground impedance meter (WGIM) which measures the impedance of ground systems in ranges from 65 Hz to 1.28 MHz. Also, a noise elimination algorithm using a digital bandpass filter is proposed. The maximum error of the WGIM is 4.91% in the measurement frequency range.

Eight-axis-polishing Machine for Large Off-axis Aspheric Optics

  • Rhee, Hyug-Gyo;Yang, Ho-Soon;Moon, Il-Kweon;Kihm, Hag-Yong;Lee, Jae-Hyub;Lee, Yun-Woo
    • Journal of the Optical Society of Korea
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    • v.15 no.4
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    • pp.394-397
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    • 2011
  • For the purpose of fabricating off-axis aspheric optics, we propose an 8-axis-polishing machine combined with a testing tower whose height is up to 9 m. The proposed polishing machine was designed and analyzed by using a well-known finite element method. The eight axes of the machine have a synchronized motion generated by a computer, and each axis was calibrated by a heterodyne laser interferometer or an optical encoder. After calibration, the maximum positioning error of the machine was less than 2 ${\mu}m$ within a whole 2 m ${\times}$ 2 m area. A typical fabrication result of a ${\phi}1.5$ m concave mirror was also described in this manuscript.

Fabrication of Metallic Sandwich Plates with Inner Dimpled Shell Structure and Static Bending Test (딤플형 내부구조 금속 샌드위치 판재의 제작 및 정적 굽힘 실험)

  • Seong Dae-Yong;Jung Chang-Gyun;Yoon Seok-Joon;Lee Sang-Hoon;Ahn Dong-Gyu;Yang Dong-Yol
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.30 no.6 s.249
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    • pp.653-661
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    • 2006
  • Metallic sandwich plates with various inner cores have important new features with not only ultra-light material characteristics and load bearing function but also multifunctional characteristics. Because of production possibility on the large scale and a good geometric precision, sandwich plates with inner dimpled shell structure from a single material have advantages as compared with other solid sandwich plates. Inner dimpled shell structures can be fabricated with press or roll forming process, and then bonded with two face sheets by multi-point resistance welding or adhesive bonding. Elasto-plastic bending behavior of sandwich plates have been predicted analytically and measured. The measurements have shown that elastic perfectly plastic approximation can be conveniently employed with less than 10% error in elastic stiffness, collapse load, and energy absorption. The dominant collapse modes are face buckling and bonding failure after yielding. Sandwich plates with inner dimpled shell structure can absorb more energy than other types of sandwich plates during the bending behavior.

Fabrication of InP/InGaAs Avlanche Photodeode with Floating Guard Ring by Double Diffusion (Floating Guard Ring 구조를 갖는 InP/InGaAs Avalanche Photodiode의 이중확산 방법에 의한 제작)

  • 박찬용;강승구;현경숙;김정수;김홍만
    • Korean Journal of Optics and Photonics
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    • v.7 no.1
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    • pp.66-71
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    • 1996
  • We analyzed and fabricated InP/InGaAs avalanche photodiode (APD) having floating guard ring (FGR). Since the FGR-APD is very simple to fabricate and highly reliable, the fabrication of FGR-APD and its application to the optical receiver are very useful and interesting. A double zinc diffusion was employed to fabricate and one dimensional electric field analysis was used for design. Two dimensional gain measurement showed that the FGR suppressed gain at the curved edge, indicating the successful behavior as a guard ring. The fabricated device had 35 GHz of gain-bandwidth product, and showed the sensitivity of -31.9 dBm at a bit error rate of $10^{-9}$ when it was applied to a 2.5 Gbps optical receiver.

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A Study on Accuracy Improvement of Dual Micro Patterns Using Magnetic Abrasive Deburring (자기 디버링을 이용한 복합 미세패턴의 형상 정밀도 향상)

  • Jin, Dong-Hyun;Kwak, Jae-Seob
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.40 no.11
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    • pp.943-948
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    • 2016
  • In recent times, the requirement of a micro pattern on the surface of products has been increasing, and high precision in the fabrication of the pattern is required. Hence, in this study, dual micro patterns were fabricated on a cylindrical workpiece, and deburring was performed by magnetic abrasive deburring (MAD) process. A prediction model was developed, and the MAD process was optimized using the response surface method. When the predicted values were compared with the experimental results, the average prediction error was found to be approximately 7%. Experimental verification shows fabrication of high accuracy dual micro pattern and reliability of prediction model.

Effect of the Correlated Random Fluctuation in Grating Half-period on the Characteristics of Quarter Wavelength Shifted DFB Lasers (회절격자 반주기의 상관관계가 있는 랜덤 변이가 ${\lambda}/4$ 위상천이 DFB 레이저 특성에 미치는 영향)

  • Han, Jae-Woong;Kim, Sang-Bae
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.37 no.8
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    • pp.48-56
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    • 2000
  • Effects of the correlated random fluctuation in each grating half-period have been studied by an effective index transfer matrix method in quarter wavelength shifted DFB lasers. As the correlation coefficient changes from 0 to -1, single mode stability and wavelength accuracy are less degraded by the reduced error in the grating period. This fact shows that holographic grating fabrication is better than electron-beam lithography in discrete device fabrication provided that the magnitude of the random fluctuation is the same.

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A Case Study on the Improvement of Display FAB Production Capacity Prediction (디스플레이 FAB 생산능력 예측 개선 사례 연구)

  • Ghil, Joonpil;Choi, Jin Young
    • Journal of Korean Society of Industrial and Systems Engineering
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    • v.43 no.2
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    • pp.137-145
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    • 2020
  • Various elements of Fabrication (FAB), mass production of existing products, new product development and process improvement evaluation might increase the complexity of production process when products are produced at the same time. As a result, complex production operation makes it difficult to predict production capacity of facilities. In this environment, production forecasting is the basic information used for production plan, preventive maintenance, yield management, and new product development. In this paper, we tried to develop a multiple linear regression analysis model in order to improve the existing production capacity forecasting method, which is to estimate production capacity by using a simple trend analysis during short time periods. Specifically, we defined overall equipment effectiveness of facility as a performance measure to represent production capacity. Then, we considered the production capacities of interrelated facilities in the FAB production process during past several weeks as independent regression variables in order to reflect the impact of facility maintenance cycles and production sequences. By applying variable selection methods and selecting only some significant variables, we developed a multiple linear regression forecasting model. Through a numerical experiment, we showed the superiority of the proposed method by obtaining the mean residual error of 3.98%, and improving the previous one by 7.9%.