• 반도체디스플레이기술학회지
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• 제20권3호
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• pp.32-38
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• 2021

We developed an inductively coupled plasma (ICP) etcher for GaN etching using a parallel plasma electrode source with a multifunctional chuck matched to it in order for the low power consumption and low process cost in comparison with the conventional ICP system with a helical-type plasma electrode source. The optimization process condition using it for the micro light-emitting diode (µ-LED) chip fabrication was established, which is an ICP RF power of 300 W, a chuck power of 200 W, a BCl₃/Cl₂ gas ratio of 3:2. Under this condition, the mesa structure with the etch depth over 1 ㎛ and the etch angle over 75° and also with no etching residue was obtained for the µ-LED chip. The developed ICP showed the improved values on the process pressure, the etch selectivity, the etch depth uniformity, the etch angle profile and the substrate temperature uniformity in comparison with the commercial ICP. The µ-LED chip fabricated using the developed ICP showed the similar or improved characteristics in the L-I-V measurements compared with the one fabricated using the conventional ICP method

• Korean Chemical Engineering Research
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• 제59권1호
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• pp.100-105
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• 2021

본 연구는 적은 비용으로 분석 장치 없이 질병 진단 및 경과를 모니터링할 수 있는 종이-기반 분석 장치(paper-based analytical device, PAD)를 제작하기 위해 polydimethylsiloxane (PDMS) 블레이드 코팅 방법을 제안하였다. PAD 디자인은 레이저 커팅 기술로 쉽게 몰드에 적용할 수 있으며, 제작된 몰드로 블레이드 코팅을 수행하여 완전한 소수성 장벽 형성에 필요한 조건을 확립하였다. 코팅 조건인 잉크의 두께와 종이와의 접촉시간에 따라 PDMS 소수성 장벽의 구조와 친수성 채널의 크기 변화를 분석하여 안정적으로 소수성 장벽을 형성할 수 있는 조건을 최적화하였다. 최적화된 방법을 바탕으로 PAD를 제작하여 특별한 분석기기 없이 단백질, 당, 메탈이온을 검출하여 바이오센서에 응용가능함을 증명하였다.

• 한국재료학회지
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• 제8권9호
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• pp.783-790
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• 1998

용융점 및 물리.화학적 특성이 $\textrm{UO}_{2}$와 비슷한 yttria-stabilized-zirconia ($\textrm{ZrO}_{2}$-$\textrm{Y}_{2}\textrm{O}_{3}$)분말을 유도플라즈마(induction plasma)로 용융 침적시켜 원자력발전용 핵연료펠렛 제조공정에 응용하고자 하였다. 분말의 용융정도는 플라즈마동력 및 분말의 크기에 영향을 받는 것으로 나타났으며, 쉬스가스 조성, 분말분사관 위치, 입자크기 및 분사거리 등을 최적화 하여 Ar/$\textrm{H}_{2}$유량120/20$\ell$/min, 플리즈마 동력 80KW, 분사관의위치 8cm , 챔버압력 200Torr, 분사거리 18cm에서 이론밀도의 97.91%, 침적속도 20mm/min의 최적조건을 도출하였다. 침적시험에서 도출된 최적조건으로 펠렛몰더에서 제조한 펠렛은 96.5%의 밀도를 나타내었으며, 균일도 및 외곤도 우수하여 신기술에 의한 핵연료의 제조가능성을 확인하였다. 고밀도 침적에 영향을 미치는 각 변수들의 영향과 이들 변수들의 상호영향은 ANOVA(Analysis of Variance)을 이용하여 분석하였다.

• 한국기계가공학회지
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• 제18권9호
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• pp.29-35
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• 2019

The structure of the machinery industry due to the 4th industrial revolution is changing from precision and durability to intelligent and smart machinery through sensing and interconnection(IoT). There is a growing need for research on prognostics and health management(PHM) that can prevent abnormalities in processing machines and accurately predict and diagnose conditions. PHM is a technology that monitors the condition of a mechanical system, diagnoses signs of failure, and predicts the remaining life of the object. In this study, the vibration generated during machining is measured and a classification algorithm for normal and fault signals is developed. Arbitrary fault signal is collected by changing the conditions of un stable supply cutting oil and fixing jig. The signal processing is performed to apply the measured signal to the learning model. The sampling rate is changed for high speed operation and performed machine learning using raw signal without FFT. The fault classification algorithm for 1D convolution neural network composed of 2 convolution layers is developed.

• 한국정보통신학회논문지
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• 제14권7호
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• pp.1680-1686
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• 2010

가우스 광분포를 가지는 248nm 파장의 KrF 엑시머 레이저 빔과 1.072um 주기를 가지는 위상마스크를 이용하여 최저 투과율 파장이 1549.9nm 인 광섬유 브래그 격자(Fiber Bragg Grating)를 제작하였다. 레이저 빔과 마스크 그리고 광섬유의 최적 정렬 과정을 조사하기 위해 평행 정렬 오차와 각 정렬 오차가 조사되었고 또한 엑시머 레이저의 투과 에너지와 발진 주파수의 변화에 따른 영향도 조사되었다. 실험 결과 얻어진 최적 정렬 조건 하에서 제작된 광섬유 격자의 광 투과 스펙트럼 형성 과정을 측정하여 특성이 분석되었고 이 같이 사용된 제작 조건의 안정성을 확인하기 위해 재현성 실험이 수행되었다.

• 전자공학회논문지A
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• 제28A권11호
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• pp.902-909
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• 1991

A reproducible selective dry etch process of GaAs/AlGaAs Heterostructures for High Electron Mobility Transistor(HEMT) Device fabrication is developed. Using RIE mode with $CCl_{2}F_{2}$ as the basic process gas, the observed etch selectivity of GaAs layer with respect to GaAs/$Al_{0.3}Ga_{0.7}$As is about 610:1. Severe polymer deposition problem, parialy generated from the use of $CCl_{2}F_{2}$ gas only, has been significantly reduced by adding a small amount of He gas or by $O_{2}$ plasma ashing after etch process. In order to obtain an optimized etch process for HEMT device fabrication, we com pared the properties of the wet etched Schottky contact with those of the dry etched one, and set dry etch condition to approach the characteristics of Schottky diode on wet etched surface. By applying the optimized etch process, the fabricated HEMT devices have the maximum transconductance $g_{mext}$ of 224 mS/mm, and have relatively uniform distribution across the 2inch wafer in the value of 200$\pm$20mS/mm.

• 한국전기전자재료학회논문지
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• 제15권11호
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• pp.958-962
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• 2002

This paper reports on the fabrication of free-standing microstructures by DRIE (deep reactive ion etching). SOI (Si-on-insulator) structures with buried cavities are fabricated by SDB (Si-wafer direct bonding) technology and electrochemical etch-stop. The cavity was formed the upper handling wafer by Si anisotropic etch technique. SDB process was performed to seal the formed cavity under vacuum condition at -760 mmHg. In the SDB process, captured air and moisture inside of the cavities were removed by making channels towards outside. After annealing (100$0^{\circ}C$, 60 min.), the SDB SOI structure with a accurate thickness and a good roughness was thinned by electrochemical etch-stop in TMAH solution. Finally, it was fabricated free-standing microstructures by DRIE. This result indicates that the fabrication technology of free-standing microstructures by combination SDB, electrochemical etch-stop and DRIE provides a powerful and versatile alternative process for high-performance bulk micromachining in MEMS fields.

• 한국전기전자재료학회논문지
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• 제23권4호
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• pp.298-302
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• 2010

We investigated the resistance change behavior of SABiT (Samsung Advanced Bump interconnection Technology) technology-applied PCB (Printed Circuit Board) with the various bump sizes and fabrication conditions. Many testing samples with different bump size, prepreg thickness, number of print on the formation of Ag paste bump, were made. The resistance of Ag paste bump itself was calculated from the Ag paste resistivity and bump size, measured by using 4-point probe method and FE-SEM (Field Emission Scanning Electron Microscope), respectively. The contact resistance between Ag paste bump and conducting Cu line were obtained by subtracting the Cu line and bump resistances from the measured total resistance. It was found that the contact resistance drastically changed with the variation of Ag paste bump size and the contact resistance had the largest influence on total resistance. We found that the bump size and contact resistance obeyed the power law relationship. The resistance of a circuit in PCB can be estimated from this kind of relationship as the bump size and fabrication technique vary.

• 한국물환경학회지
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• 제33권1호
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• pp.34-39
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• 2017

Under a corrosive environment, electrodes that are applied in the water-treatment system need not only very high electrochemical activity for fast reactions, but also high durability for cost saving. Therefore, the fabrication condition of iridium electrodes was examined to produce a more durable iridium electrode in this study. Tantalum was selected as a binder to enhance the durability of the iridium electrode. Investigation of the weight ratio between the catalyst and the binder to improve electrochemical activity was performed. Also, to compare the effect of the different coating amounts of the catalyst, the results of CV (Cyclic Voltammetry) and EIS (Electrochemical Impedance Spectroscopy) were discussed. Furthermore, an ALT(Accelerated Lifetime Test) was designed and applied to the electrodes to determine the conditions for highly durable electrode fabrication.

• 한국세라믹학회지
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• 제50권6호
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• pp.384-389
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• 2013

Activated alumina was fabricated with aluminum hydroxide in this study. High-purity alumina gel and boehmite were prepared from aluminum hydroxide by a hydrothermal process and fired to activate alumina having a surface area of 380 ~ 480 $m^2/g$ with less loss of ignition. The aging and drying condition during the fabrication process affected the loss of ignition, the sedimentation time of the alumina suspension, as well as the surface area of the activated alumina. For pellet-type activated alumina, the pre-fired alumina gel and boehmite were press-formed and fired at $400^{\circ}C$ and $550^{\circ}C$ for 6 h, respectively. The fired pellets showed a low density of 2.0 ~ 2.2 $g/cm^3$ with 20% firing shrinkage and sufficient handling strength. In this study, a new fabrication process for high-quality activated alumina with aluminum hydroxide is introduced. The effects of the processing parameters on the activated alumina properties are also examined.