• Journal of the Semiconductor & Display Technology
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• v.20 no.3
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• pp.32-38
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• 2021

We developed an inductively coupled plasma (ICP) etcher for GaN etching using a parallel plasma electrode source with a multifunctional chuck matched to it in order for the low power consumption and low process cost in comparison with the conventional ICP system with a helical-type plasma electrode source. The optimization process condition using it for the micro light-emitting diode (µ-LED) chip fabrication was established, which is an ICP RF power of 300 W, a chuck power of 200 W, a BCl₃/Cl₂ gas ratio of 3:2. Under this condition, the mesa structure with the etch depth over 1 ㎛ and the etch angle over 75° and also with no etching residue was obtained for the µ-LED chip. The developed ICP showed the improved values on the process pressure, the etch selectivity, the etch depth uniformity, the etch angle profile and the substrate temperature uniformity in comparison with the commercial ICP. The µ-LED chip fabricated using the developed ICP showed the similar or improved characteristics in the L-I-V measurements compared with the one fabricated using the conventional ICP method

• Korean Chemical Engineering Research
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• v.59 no.1
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• pp.100-105
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• 2021

This paper proposes the polydimethylsiloxane (PDMS) blade coating method for fabrication of paper-based analytical device (PAD) that is able to monitor the disease diagnosis and progress without special analytical equipment. The mold that has PAD design is easily modified by using laser cutting technique. And the fabricated mold is used for hydrophobic barrier formation by blade coating. We have optimized the stable formation of PDMS hydrophobic barrier as blade coating condition, which is established by analyzing the structure of the PDMS hydrophobic barrier and change of hydrophilic channel size as thickness of the ink and contact time with the chromatography paper. Based on optimal condition, we demonstrate that PAD as biosensor can apply to detect protein, glucose, and metal ion without special analysis equipment.

• Korean Journal of Materials Research
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• v.8 no.9
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• pp.783-790
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• 1998

New process development of nuclear fuel fabrication for nuclear power plant was attempted by induction plasma technology with yttria-stabilized-zirconia ($\textrm{ZrO}_{2}$-$\textrm{Y}_{2}\textrm{O}_{3}$)powder, similar to $\textrm{UO}_{2}$, in the respect of melting point and physicochemical characteristics. Extent of powder melting was affected greatly by plasma plate power and particle size. Being optimized such as, sheath gas composition, probe position, particle size and spraying distance, dense deposit of 97.91% T.D. with deposition rate 20mm/min was attained at the condition of 120/20$\ell$/min of Ar/$\textrm{H}_{2}$ flow rate, 80kw of plate power, 8cm of probe position, 200Torr of chamber pressure and 18cm of spraying distance. The pellet of 96.5% of theoretical density was formed with homogeneity and nice exterior view at the best condition of deposition experiments, and the possibility of new nuclear pellet fabrication process was confirmed. The main and interrelated effects on deposit density were assessed by ANOVA(Ana1ysis of Variance).

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.18 no.9
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• pp.29-35
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• 2019

The structure of the machinery industry due to the 4th industrial revolution is changing from precision and durability to intelligent and smart machinery through sensing and interconnection(IoT). There is a growing need for research on prognostics and health management(PHM) that can prevent abnormalities in processing machines and accurately predict and diagnose conditions. PHM is a technology that monitors the condition of a mechanical system, diagnoses signs of failure, and predicts the remaining life of the object. In this study, the vibration generated during machining is measured and a classification algorithm for normal and fault signals is developed. Arbitrary fault signal is collected by changing the conditions of un stable supply cutting oil and fixing jig. The signal processing is performed to apply the measured signal to the learning model. The sampling rate is changed for high speed operation and performed machine learning using raw signal without FFT. The fault classification algorithm for 1D convolution neural network composed of 2 convolution layers is developed.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.14 no.7
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• pp.1680-1686
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• 2010

Optical fiber Bragg grating to have the lowest transmitivity at 1549.9nm wavelength was fabricated using a Gaussian distributed KrF Eximer laser of 248nm lasing wavelength and a phase mask of 1.072um period. The proper alignment of an optic setup to fabricate fiber gratings was investigated and the reproductivity of the grating fabrication was examined using the obtained optimum fabrication condition in this experiment.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.28A no.11
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• pp.902-909
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• 1991

A reproducible selective dry etch process of GaAs/AlGaAs Heterostructures for High Electron Mobility Transistor(HEMT) Device fabrication is developed. Using RIE mode with $CCl_{2}F_{2}$ as the basic process gas, the observed etch selectivity of GaAs layer with respect to GaAs/$Al_{0.3}Ga_{0.7}$As is about 610:1. Severe polymer deposition problem, parialy generated from the use of $CCl_{2}F_{2}$ gas only, has been significantly reduced by adding a small amount of He gas or by $O_{2}$ plasma ashing after etch process. In order to obtain an optimized etch process for HEMT device fabrication, we com pared the properties of the wet etched Schottky contact with those of the dry etched one, and set dry etch condition to approach the characteristics of Schottky diode on wet etched surface. By applying the optimized etch process, the fabricated HEMT devices have the maximum transconductance $g_{mext}$ of 224 mS/mm, and have relatively uniform distribution across the 2inch wafer in the value of 200$\pm$20mS/mm.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.15 no.11
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• pp.958-962
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• 2002

This paper reports on the fabrication of free-standing microstructures by DRIE (deep reactive ion etching). SOI (Si-on-insulator) structures with buried cavities are fabricated by SDB (Si-wafer direct bonding) technology and electrochemical etch-stop. The cavity was formed the upper handling wafer by Si anisotropic etch technique. SDB process was performed to seal the formed cavity under vacuum condition at -760 mmHg. In the SDB process, captured air and moisture inside of the cavities were removed by making channels towards outside. After annealing (100$0^{\circ}C$, 60 min.), the SDB SOI structure with a accurate thickness and a good roughness was thinned by electrochemical etch-stop in TMAH solution. Finally, it was fabricated free-standing microstructures by DRIE. This result indicates that the fabrication technology of free-standing microstructures by combination SDB, electrochemical etch-stop and DRIE provides a powerful and versatile alternative process for high-performance bulk micromachining in MEMS fields.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.4
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• pp.298-302
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• 2010

We investigated the resistance change behavior of SABiT (Samsung Advanced Bump interconnection Technology) technology-applied PCB (Printed Circuit Board) with the various bump sizes and fabrication conditions. Many testing samples with different bump size, prepreg thickness, number of print on the formation of Ag paste bump, were made. The resistance of Ag paste bump itself was calculated from the Ag paste resistivity and bump size, measured by using 4-point probe method and FE-SEM (Field Emission Scanning Electron Microscope), respectively. The contact resistance between Ag paste bump and conducting Cu line were obtained by subtracting the Cu line and bump resistances from the measured total resistance. It was found that the contact resistance drastically changed with the variation of Ag paste bump size and the contact resistance had the largest influence on total resistance. We found that the bump size and contact resistance obeyed the power law relationship. The resistance of a circuit in PCB can be estimated from this kind of relationship as the bump size and fabrication technique vary.

• Journal of Korean Society on Water Environment
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• v.33 no.1
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• pp.34-39
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• 2017

Under a corrosive environment, electrodes that are applied in the water-treatment system need not only very high electrochemical activity for fast reactions, but also high durability for cost saving. Therefore, the fabrication condition of iridium electrodes was examined to produce a more durable iridium electrode in this study. Tantalum was selected as a binder to enhance the durability of the iridium electrode. Investigation of the weight ratio between the catalyst and the binder to improve electrochemical activity was performed. Also, to compare the effect of the different coating amounts of the catalyst, the results of CV (Cyclic Voltammetry) and EIS (Electrochemical Impedance Spectroscopy) were discussed. Furthermore, an ALT(Accelerated Lifetime Test) was designed and applied to the electrodes to determine the conditions for highly durable electrode fabrication.

• Journal of the Korean Ceramic Society
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• v.50 no.6
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• pp.384-389
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• 2013

Activated alumina was fabricated with aluminum hydroxide in this study. High-purity alumina gel and boehmite were prepared from aluminum hydroxide by a hydrothermal process and fired to activate alumina having a surface area of 380 ~ 480 $m^2/g$ with less loss of ignition. The aging and drying condition during the fabrication process affected the loss of ignition, the sedimentation time of the alumina suspension, as well as the surface area of the activated alumina. For pellet-type activated alumina, the pre-fired alumina gel and boehmite were press-formed and fired at $400^{\circ}C$ and $550^{\circ}C$ for 6 h, respectively. The fired pellets showed a low density of 2.0 ~ 2.2 $g/cm^3$ with 20% firing shrinkage and sufficient handling strength. In this study, a new fabrication process for high-quality activated alumina with aluminum hydroxide is introduced. The effects of the processing parameters on the activated alumina properties are also examined.