• 제목/요약/키워드: Fabricated design area

검색결과 320건 처리시간 0.038초

집적형 광 픽업용 대면적 실리콘 미러 제작 (Fabrication of Large Area Silicon Mirror for Integrated Optical Pickup)

  • 김해성;이명복;손진승;서성동;조은형
    • 정보저장시스템학회논문집
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    • 제1권2호
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    • pp.182-187
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    • 2005
  • A large area micro mirror is an optical element that functions as changing an optical path by reflection in integrated optical system. We fabricated the large area silicon mirror by anisotropic etching using MEMS for implementation of integrated optical pickup. In this work, we report the optimum conditions to better fabricate and design, greatly improve mirror surface quality. To obtain mirror surface of $45^{\circ},\;9.74^{\circ}$ off-axis silicon wafer from (100) plane was used in etching condition of $80^{\circ}C$ with 40wt.% KOH solution. After wet etching, polishing process by MR fluid was applied to mirror surface for reduction of roughness. In the next step, after polymer coating on the polished Si wafer, the Si mirror was fabricated by UV curing using a trapezoid bar-type way structure. Finally, we obtained peak to valley roughness about 50 nm in large area of $mm^2$ and it is applicable to optical pickup using blu-ray wavelength as well as infrared wavelength.

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다층 기판 위에 표면실장된 SRAM 모듈 설계 제작 (The Design and Fabrication of SRAM Modules Surface Mounted on Multilayer Borads)

  • 김창연;지용
    • 전자공학회논문지A
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    • 제32A권3호
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    • pp.89-99
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    • 1995
  • In this paper, we ecamined the effect that MCM-L technique influencess on the design and fabrication of multichip memory modules in increasing the packing desity of memory capacity and maximizing its electrical characteristics. For that purpose, we examined the effective methods of reducing the area of module layout and the wiring length with the variation of chip allocation and the number of wiring layers. We fabricated a 256K${\times}$8bit SRAM module with eight 32K${\times}$8bit SRAM chips. The routing experiment showed that we could optimize the area of module layout and wiring length by placing chips in a row, arranging module I/O pads parallel to chip I/O pads, and equalizing the number of terminal sides of module I/O's to that of chip I/O's. The routing was optimized when we used three wire layers in case of one sided chip mounting or five wire layers in case of double sided chip mounting. The fabricated modules showed 18.9 cm/cm$^{2}$ in wiring density, 65 % in substrate occupancy efficiency, and module substrate and functionally tested to find out the module working perfectly.

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A Design for a CPW-Fed Monopole Antenna with Two Modified Half Circular Rings for WLAN/WiMAX Operations

  • Kim, Woo-Su;Yoon, Joong-Han
    • Journal of information and communication convergence engineering
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    • 제13권3호
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    • pp.159-166
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    • 2015
  • In this paper, a novel design for a triple-band coplanar waveguide (CPW)-fed monopole antenna for WLAN/WiMAX operations is proposed. The proposed antenna is printed on an FR4 substrate with an area of 22.0 mm × 30.0 mm, a thickness of 1.0 mm, and a relative permittivity of 4.4. The effects of various parameters of the proposed for triple band operation is investigated. Two half circular rings and a microstrip feed line are fabricated on the substrate to achieve triple band operation and good impedance matching. Prototypes of the proposed antenna have been fabricated and tested. Experiment results reveal that the measured return loss exhibits an acceptable agreement with the simulated return loss and satisfies the impedance bandwidth requirement of -10 dB, while simultaneously covering the WLAN and WiMAX bands. In addition, the proposed antenna shows good radiation characteristics and gains in the three operating bands.

고속 전류 구동 Analog-to-digital 변환기의 설계 (Design of A High-Speed Current-Mode Analog-to-Digital Converter)

  • 조열호;손한웅;백준현;민병무;김수원
    • 전자공학회논문지B
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    • 제31B권7호
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    • pp.42-48
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    • 1994
  • In this paper, a low power and high speed flash Analog-to-Digital Converter using current-mode concept is proposed. Current-mode approach offers a number of advantages over conventional voltage-mode approach, such as lower power consumption small chip area improved accuracy etc. Rescently this concept was applied to algorithmic A/D Converter. But, its conversion speed is limited to medium speed. Consequently this converter is not applicable to the high speed signal processing system. This ADC is fabricated in 1.2um double metal CMOS standard process. This ADC's conversion time is measured to be 7MHz, and power consumption is 2.0mW, and differential nonlinearity is less than 1.14LSB and total harmonic distortion is -50dB. The active area of analog chip is about 350 x 550u$m^2$. The proposed ADC seems suitable for a single chip design of digital signal processing system required high conversion speed, high resolution small chip area and low power consumption.

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대면적 플랫폼을 갖는 Probe-based Storage Device(PSD)용 정전형 2축 MEMS 스테이지의 설계 (Design of an Electrostatic 2-axis MEMS Stage having Large Area Platform for Probe-based Storage Devices)

  • 정일진;전종업
    • 한국공작기계학회논문집
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    • 제15권3호
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    • pp.82-90
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    • 2006
  • Recently the electrostatic 2-axis MEMS stages have been fabricated for the purpose of an application to PSD (Probe-based Storage Device). However, all of the components(platform, comb electrodes, springs, anchors, etc.) in those stages are placed in-plane so that they have low areal efficienceis, which is undesirable as data storage devices. In this paper, we present a novel structure of an electrostatic 2-axis MEMS stage that is characterized by having large area platform. for obtaining large area efficiency, the actuator part consisting of mainly comb electrodes and springs is placed right below the platform. The structure and operational principle of the MEMS stage are described, followed by a design procedure, structural and modal analyses using FEM(Finite Element Method). The areal efficiency of the MEMS stage was designed to be about 25%, which is very large compared with the conventional ones having a few percentage.

Flexible 마이크로시스템을 위한 압전 박막 공진기의 설계 및 제작 (Design and fabrication of film Bulk Acoustic Resonator for flexible Microsystems)

  • 강유리;김용국;김수원;주병권
    • 한국전기전자재료학회논문지
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    • 제16권12S호
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    • pp.1224-1231
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    • 2003
  • This paper reports on the air-gap type thin film bulk acoustic wave resonator(FBAR) using ultra thin wafer with thickness of 50$\mu\textrm{m}$. It was fabricated to realize a small size devices and integrated objects using MEMS technology for flexible microsystems. To reduce a error of experiment, MATLAB simulation was executed using material characteristic coefficient. Fabricated thin FBAR consisted of piezoelectric film sandwiched between metal electrodes. Used piezoelectric film was the aluminum nitride(AlN) and electrode was the molybdenum(Mo). Thin wafer was fabricated by wet etching and dry etching, and then handling wafer was used to prevent damage of FBAR. The series resonance frequency and the parallel frequency measured were 2.447㎓ and 2.487㎓, respectively. Active area is 100${\times}$100$\mu\textrm{m}$$^2$.Q-factor was 996.68 and K$^2$$\_$eff/ was 3.91%.

다양한 CAD/CAM 제조 방식으로 제작한 3본 고정성 임시 치과 보철물의 정확도 비교 (Accuracy comparison of 3-unit fixed dental provisional prostheses fabricated by different CAD/CAM manufacturing methods)

  • 이혁준;이하빈;노미준;김지환
    • 대한치과기공학회지
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    • 제45권2호
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    • pp.31-38
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    • 2023
  • Purpose: This in vitro study aimed to compare the trueness of 3-unit fixed dental provisional prostheses (FDPs) fabricated by three different additive manufacturing and subtractive manufacturing procedures. Methods: A reference model with a maxillary left second premolar and the second molar prepped and the first molar missing was scanned for the fabrication of 3-unit FDPs. An anatomically shaped 3-unit FDP was designed on computer-aided design software. 10 FDPs were fabricated by subtractive (MI group) and additive manufacturing (stereolithography: SL group, digital light processing: DL group, liquid crystal displays: LC group) methods, respectively (N=40). All FDPs were scanned and exported to the standard triangulated language file. A three-dimensional analysis program measured the discrepancy of the internal, margin, and pontic base area. As for the comparison among manufacturing procedures, the Kruskal-Wallis test and the Mann-Whitney test with Bonferroni correction were evaluated statistically. Results: Regarding the internal area, the root mean square (RMS) value of the 3-unit FDPs was the lowest in the MI group (31.79±6.39 ㎛) and the highest in the SL group (69.34±29.88 ㎛; p=0.001). In the marginal area, those of the 3-unit FDPs were the lowest in the LC group (25.39±4.36 ㎛) and the highest in the SL group (48.94±18.98 ㎛; p=0.001). In the pontic base area, those of the 3-unit FDPs were the lowest in the LC group (8.72±2.74 ㎛) and the highest in the DL group (20.75±2.03 ㎛; p=0.001). Conclusion: A statistically significant difference was observed in the RMS mean values of all the groups. However, in comparison to the subtractive manufacturing method, all measurement areas of 3-unit FDPs fabricated by three different additive manufacturing methods are within a clinically acceptable range.

에너지 제어 용착을 이용한 스테인리스 316L의 적층 특성 및 기계적 물성 평가 (Deposition Characteristics and Mechanical Properties of Stainless Steel 316L Fabricated via Directed Energy Deposition)

  • 양승원;이협;심도식
    • 한국기계가공학회지
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    • 제20권6호
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    • pp.59-69
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    • 2021
  • Directed energy deposition (DED) is an additive manufacturing technology involving a focused high-power laser or electron beam propagating over the substrate, resulting in melt pool formation while simultaneously supplying metal powder to the melt pool area to deposit the material. DED is performed to repair and strengthen parts in various applications, as it can be easily integrate local area cladding and cross-material deposition. In this study, we characterize stainless steel 316 L parts fabricated via DED based on various deposition conditions and geometries to widen the application of DED. The deposition characteristics are investigated by varying the laser power and powder feed rate. Multilayer deposition with a laser power of 362 W and a powder feed rate of 6.61 g/min indicate a height closest to the design value while affording high surface quality. The microhardness of the specimen increases from the top to the bottom of the deposited area. Tensile tests of specimens with two different deposition directions indicate that horizontally long specimens with respect to a substrate demonstrate a higher ultimate tensile strength and yield strength than vertically long specimens with lower elongation.

Co90Fe10/SiO2 Multilayer를 이용한 GHz 자성박막 인덕터 설계 및 제작에 관한 연구 (A Study on the Design and Fabrication of GHz Magnetic Thin Film Inductor Utilizing Co90Fe10/SiO2 Multilayer)

  • 공기준;윤의중;진현준;박노경;문대철
    • 한국통신학회논문지
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    • 제25권5B호
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    • pp.985-991
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    • 2000
  • 본 논문에서는 인덕터의 면적을 극소화시키고 인덕턴스와 Q값을 극대화시키기 위한 최적구조의 2GHz 자성박막 인덕터를 설계하고 제작하였다. Eddy-current 표피효과를 위해서 Co90Fe10와 SiO2의 multilayer를 사용하고, multilayer를 적용한 새로운 lumped 소자모델을 고려하여 최적설계를 수행하였다. 2GHz에서 동작하는 새로운 자성박막 인덕터는 photo-lithography와 lift-off기술을 이용하여 Si 기판위에 제작되었다. 50개 이상의 동일한 인덕터들의 주파수 특성은 RF Impedance Analyzer로, 자기공진주파수는 Vector Network 분석기(HP8510)로 측정되었다. 개발된 인덕터들은 1.8~2.3GHz 범위의 자기공진주파수, 47~68nH 범위의 L값, 그리고 1GHz이상의 주파수에서 70~80정도의 Q값을 가지므로 L과 Q가 극대화된 아주 우수한 최적구조의 소형(면적=30.8$\times$30.8mil2) 박막인덕터가 성공적으로 제작되었다.

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광분배를 위한 Y-branch 제작과 광파이버와의 결합특성에 관한 연구 (A study on the fabrication of Y-branch for optical power distribution and its coupling properties with optical fiber)

  • 김상덕;박수봉;윤중현;이재규;김종빈
    • 한국통신학회논문지
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    • 제21권12호
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    • pp.3277-3285
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    • 1996
  • In this paper, w designed an opical power distribution device for application to an optical switching and an optical subscriber loop. We fabricated PSG thin film by LPCVD. Based on the measured index of fabricted thin film, rib-type waveguide was transformed to two-dimension by the effective index method and we simulated dispersion property to find asingle-mode condition. We found that the optimum design parameters of rib-type waveguide are:cladding layer of 3.mu.m, core layer of 3.mu.m, buffer layer of 10.mu.m, and core width of 4.mu.m. Each side of the guiding region was etched down to 4.mu.m to shape the core. We used these optimum parameters of the rib-type waveguide with branching angle of 0.5.deg. and simulted the Y-branch waveguide by the BPM simulation. Numerical loss in branching area was claculated to be 0.1581dB and equal to the total loss of the Y-branch. The loss of the fabricated Y-branch waveguide on PSG film ws 1.6dB at .lambda.=1.3.mu.m before annealing but was 1.2dB after annealing at 1000.deg. C for 10 minutes. Consequently, the loss of branching area from 3000.mu.m to 6000.mu.m in the z-direction was 0.8dB, and single-mode propagation was confirmed by measuring the near field pattern. For coupling the fabricated Y-branch waveguide with an optical fiber, we fabricated V-groove which was used as the upholder of optical fiber. An etching angle was 54.deg. and the width and depth of guiding groove was 150.mu.m, 70.mu.m, respectively. The optical fiber is inserted onto V-groove. Both the Y-branch and V-groove were connected through the index matching oil. Coupling loss after connecting Y-branch and the optical fiber on V-groove was 0.34dB and that after injecting index mateching oil was 0.14dB.

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