• Industrial Engineering and Management Systems
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• v.4 no.1
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• pp.47-53
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• 2005

The efficiency of fabrication (fab) operation is one of the key factors in order for a semiconductor manufacturing company to stay competitive. Optimization of manpower and forecasting manpower needs in a modern fab is an essential part of the future strategic planing and a very important to the operational efficiency. As the semiconductor manufacturing technology has entered the 8-inch wafer era, the complexity of fab operation increases with the increase of wafer size. The wafer handling method has evolved from manual mode in 6-inch wafer fab to semi-automated or fully automated factory in 8-inch and 12-inch wafer fab. The distribution of manpower requirement in each specialty varied as the trend of fab operation goes for downsizing manpower with automation and outsourcing maintenance work. This paper is to study the specialty distribution of manpower from the requirement in a typical 6-inch, 8-inch to 12-inch wafer fab. The human resource planning in today’s fab operation shall consider many factors, which include the stability of technical talents. This empirical study mainly focuses on the human resource planning, the manpower distribution of specialty structure and the forecast model of internal demand/supply in current semiconductor manufacturing company. Considering the market fluctuation with the demand of varied products and the advance in process technology, the study is to design a headcount forecast model based on current manpower planning for direct labour (DL) and indirect labour (IDL) in Taiwan’s fab. The model can be used to forecast the future manpower requirement on each specialty for the strategic planning of human resource to serve the development of the industry.

• Safety and Health at Work
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• v.9 no.3
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• pp.249-256
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• 2018

This article aims to provide a systematic review of the exposure assessment methods used to assign wafer fabrication (fab) workers in epidemiologic cohort studies of mortality from all causes and various cancers. Epidemiologic and exposure-assessment studies of silicon wafer fab operations in the semiconductor industry were collected through an extensive literature review of articles reported until 2017. The studies found various outcomes possibly linked to fab operations, but a clear association with the chemicals in the process was not found, possibly because of exposure assessment methodology. No study used a tiered assessment approach to identify similar exposure groups that incorporated manufacturing era, facility, fab environment, operation, job and level of exposure to individual hazardous agents. Further epidemiologic studies of fab workers are warranted with more refined exposure assessment methods incorporating both operation and job title and hazardous agents to examine the associations with cancer risk or mortality.

• Journal of Korean Society of Occupational and Environmental Hygiene
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• v.32 no.2
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• pp.111-115
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• 2022

Objectives: The purpose of this study is to verify whether droplet-induced propagation, the main route of infectious diseases such as COVID-19, can occur in semiconductor FAB (Fabrication), based on research results on general droplet propagation. Methods: Through data surveys droplet propagation was modeled through simulation and experimental case analysis according to general (without mask) and mask-wearing conditions, and the risk of droplet propagation was inferred by reflecting semiconductor FAB operation conditions (air current, air conditioning system, humidity, filter conditions). Results: Based on the results investigated to predict the possibility of spreading infectious diseases in semiconductor FAB, the total amount of droplet propagation (concentration), propagation distance, and virus life in FAB were inferred by reflecting the management parameter of semiconductor FAB. Conclusions: The total amount(concentration) of droplet propagation in the semiconductor fab is most affected by the presence or absence of wearing a mask and the line air dilution rate has some influence. when worn it spreads within 0.35~1m, and since the humidity is constant the virus can survive in the air for up to 3 hours. as a result the semiconductor fab is judged to be and effective space to block virus propagation due to the special environmental condition of a clean room.

• Proceedings of the Korean Operations and Management Science Society Conference
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• 2006.05a
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• pp.1765-1770
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• 2006

본 논문에서는 반도체 fab 라인의 물류 설비를 event graph로 모델링 하는 방법론을 제안하고 있다. 최근 반도체 fab 라인 같은 대표적인 자본 집약적 제조라인에서는 운영단계에서 투입 계획, PM schedule 및 operation rule 등을 변화시켜 가며 평가 및 검증해 볼 수 있는 what-if simulation을 위한 line simulator의 필요성이 점점 높아지고 있다. 그러나 상용 simulator는 각 제조라인의 특성에 맞게 customization하는데 많은 시간과 비용이 소요될 뿐만 아니라 특성을 반영하는데 한계가 있다. 따라서 이러한 line simulator를 개발할 때 근간이 되는 설비의 simulation model이 필요하다. 이 때 설비들은 생산(processing) 및 물류(handling) 설비로 나눌 수 있는데, 본 논문에서는 반도체 fab 라인의 물류 설비 모델링 방법을 제시하고 실제 물류 설비를 모델링 해 봄으로써 그 효용성을 알아본다.

• Journal of Korean Society of Industrial and Systems Engineering
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• v.43 no.2
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• pp.137-145
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• 2020

Various elements of Fabrication (FAB), mass production of existing products, new product development and process improvement evaluation might increase the complexity of production process when products are produced at the same time. As a result, complex production operation makes it difficult to predict production capacity of facilities. In this environment, production forecasting is the basic information used for production plan, preventive maintenance, yield management, and new product development. In this paper, we tried to develop a multiple linear regression analysis model in order to improve the existing production capacity forecasting method, which is to estimate production capacity by using a simple trend analysis during short time periods. Specifically, we defined overall equipment effectiveness of facility as a performance measure to represent production capacity. Then, we considered the production capacities of interrelated facilities in the FAB production process during past several weeks as independent regression variables in order to reflect the impact of facility maintenance cycles and production sequences. By applying variable selection methods and selecting only some significant variables, we developed a multiple linear regression forecasting model. Through a numerical experiment, we showed the superiority of the proposed method by obtaining the mean residual error of 3.98%, and improving the previous one by 7.9%.

• Journal of Korean Society of Occupational and Environmental Hygiene
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• v.26 no.1
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• pp.1-10
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• 2016

Objectives: The aim of this study is to review the results of exposure to chemicals and to extremely low frequency(ELF) magnetic fields generated in wafer fabrication operations in the semiconductor industry. Methods: Exposure assessment studies of silicon wafer fab operations in the semiconductor industry were collected through an extensive literature review of articles reported until the end of 2015. The key words used in the literature search were "semiconductor industry", "wafer fab", "silicon wafer", and "clean room," both singly and in combination. Literature reporting on airborne chemicals and extremely low frequency(ELF) magnetic fields were collected and reviewed. Results and Conclusions: Major airborne hazardous agents assessed were several organic solvents and ethylene glycol ethers from Photolithography, arsenic from ion implantation and extremely low frequency magnetic fields from the overall fabrication processes. Most exposures to chemicals reported were found to be far below permissible exposure limits(PEL) (10% < PEL). Most of these results were from operators who handled processes in a well-controlled environment. In conclusion, we found a lack of results on exposure to hazardous agents, including chemicals and radiation, which are insufficient for use in the estimation of past exposure. The results we reviewed should be applied with great caution to associate chronic health effects.

• Journal of Korean Society of Industrial and Systems Engineering
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• v.41 no.3
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• pp.120-128
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• 2018

OLED Display fabrication system is one of the most complicated discrete processing systems in the world. As the glass size grows from $550{\times}650mm$ to $1,500{\times}1,850mm$ in recent years, the efficiency of Automated Material Handling System (AMHS) has become very important and OLED glass manufacturers are trying to improve the overall efficiency of AMHS. Aiming to meet the demand for high efficiency of transportation, various kind of approaches have been applied for improving dispatching rules and facility layout, while simultaneously considering the system parameters such as glass cassettes due date, waiting time, and stocker buffer status. However, these works did not suggest the operational policy and conditions of distribution systems, especially for handling unnecessary material flows such as detour. Based on this motivation, in this paper, we proposed an efficient algorithm for improving detour transportation in OLED FAB. Specifically, we considered an OLED FAB simplifying OLED production environment in a Korean company, where four stockers are constructed for the delivery of Lot in a bay and linked to processing equipments. We developed a simulation model using Automod and performed a numerical experiment using real operational data to test the performance of three operation policies under considerations. We showed that a competitive policy for assigning alternative stocker in case of detour was superior to the current dedicated policy using a specified stocker and other considered policies.

• Journal of the Korean Institute of Gas
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• v.22 no.1
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• pp.78-85
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• 2018

In this study, we analyzed risks of the fabrication process equipment and cleanroom for semiconductor/flat panel display (FPD) manufacturing facilities and studied the fundamental safety measures for the risk factors. We examined the explosion proof design models considering the specificity of equipment and environment, and planned to utilize the findings to provide technical standards and grounds for designing and manufacturing related equipment. We believe that this study will contribute to the establishment of technical standards for semiconductor/FPD industry and businesses in many different ways by providing optimized modeling of high-risk explosion site detection, developing safety standards and hazard countermeasures and voluntary activation of safety certification system for operation of fabrication process equipment.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2006.05a
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• pp.875-878
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• 2006

In the case of a vibration sensitive equipment, it require a vibration free environment to provide its proper function, therefore, it is very important to predict precisely vibration environment of microelectronics production facility due to adjacent blast work. However, it is not easy to evaluate a quantitative vibration response of structure due blast because it can be determined by the characteristics of vibration sources, propagation through rock and soil and dynamic properties of building. In this paper, vibration influence evaluation of micro-electronic Production building induced from adjacent blast activity was performed by real measurement data obtained on ground and structure at same time. And blast vibration allowable limit on ground was supposed by measurement data analysis in order to avoid operation error of precision equipments

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07a
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• pp.539-542
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• 2005

We report how to establish the dynamic index for production control in a pilot fabrication over versatile and diverse production environments. We used dynamic index provided by a simulation model to monitor production performance. When production control is abnormal, the information system prompts administrators to classify these abnormal situations. In addition, the trend over the operation index is continuously reviewed in short-term and long-term. This simulation model is handy at setting goal for a versatile and diverse pilot production fab.