• Korean Journal of Metals and Materials
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• v.50 no.1
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• pp.71-77
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• 2012

We studied the effect of heat treatment on the microstructures and mechanical strength of the solder joints in the Light Emitting Diode (LED) packages. The commercial LED packages were mounted on the a flame resistance-4 (FR4) Printed Circuit Board (PCB) in the reflow process, and then the joints were aged at $125^{\circ}C$ for 100, 200, 300, 500 and 1000 hours, respectively. After the heat treatment, we measured the shear strength of the solder joints between the PCB and the LED packages to evaluate their mechanical property. We used Pb-free Sn-3.0Ag-0.5Cu solder to bond between the LED packages and the PCBs using two different surface finishes, Electroless Nickel-Immersion Gold (ENIG) and Electroless Nickel-Electroless Palladium-Immersion Gold (ENEPIG). The microstructure of the solder joints was observed by a scanning electron microscope (SEM). (Cu,Ni)6Sn5 intermetallic compounds (IMCs) formed between the solder and the PCB, and the thickness of the IMCs was increased with increasing aging time. The shear strength for the ENIG finished LED package increased until aging for 300 h and then decreased with increasing aging time. On the other hand, in the case of an ENEPIG finished LED package, the shear strength decreased after aging for 500 h.

• Proceedings of the KIEE Conference
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• 2001.11a
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• pp.35-37
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• 2001

다층 인쇄 회로 기판에 Combline 구조를 가진 스트립 라인 또는 마이크로 스트립 라인 대역통과 필터를 구현하였다. 저 비용 구현과 이동성과 휴대성을 강조하기 위해 기존의 세라믹 대신 FR4 와 에폭시를 기반으로 하는 다층 회로 기판의 도체 층에 집적화하였다. Combline 각 끝단에 커패시터를 부하 함으로써 전기적 길이를 화장하였고 전체적인 크기를 감소시킴으로서 적당한 필터 특성을 얻을 수 있었다. 구현된 필터는 마이크로파 대역에서 사용 가능하며 특히 Bluetooth나 Wireless LAN 과 같은 ISM 대역을 사용하는 무선통신소자로서 사용 가능하다.

• JSTS:Journal of Semiconductor Technology and Science
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• v.12 no.4
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• pp.405-410
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• 2012

This paper presents an inductorless 8-Gb/s adaptive passive equalizer with low-power consumption and small chip area. The equalizer has a tunable RC filter which provides high-frequency gain boosting and a limiting amplifier that restores the signal level from the filter output. It also includes a feedback loop which automatically adjusts the filter gain for the optimal frequency response. The equalizer fabricated in $0.18-{\mu}m$ CMOS technology can successfully equalize 8-Gb/s data transmitted through up to 50-cm FR4 PCB channels. It consumes 6.75 mW from 1.8-V supply voltage and occupies $0.021mm^2$ of chip area.

• Journal of Electrical Engineering and Technology
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• v.4 no.2
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• pp.282-286
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• 2009

This paper presents the design of a patch antenna for GPS portable devices. The antenna is designed to operate at Ll band on an FR4 PCB with a thickness of 1.6mm, a dielectric constant of 3.8 and two metallization layers. The antenna has a dimension of 49mm${\times}$36mm and operates at 1.5754GHz with a return loss of -36dB and a measured bandwidth of 250MHz.

• Journal of Advanced Navigation Technology
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• v.20 no.4
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• pp.344-351
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• 2016

In the present study, a dual-band multiple-input-multiple-output (MIMO) antenna covering WLAN frequency bands of 2.4 GHz (2.4 ~ 2.484 GHz) and 5 GHz (5.15 ~ 5.825 GHz) is newly presented to avoid use of decoupling structure for increasing isolation. The antenna consists of two L-shaped slots with n-shaped slots etched on the floating ground plane surrounded by open ended L-shaped slots which are placed in the left and right corner of PCB respectively. The proposed antenna is designed and fabricated on one side of FR4 substrate with dielectric constant of 4.3, thickness of 1.6 mm, and size of $50{\times}50mm2$. It has been observed that the measured impedance bandwidths ($S_{11}{\leq}-10dB$) are 0.3 GHz (2.28 ~ 2.58 GHz) in 2.4 GHz frequency band and 0.89 GHz (5.11 ~ 6 GHz) in 5 GHz frequency band respectively. In addition, It has been observed that the whole efficiency are more than 80 % in the whole operating frequency band and envelope correlation coefficient of the antenna is less than 0.05 as a very small value in spite of nothing of the decoupling structure.

• Journal of Advanced Marine Engineering and Technology
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• v.37 no.7
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• pp.752-759
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• 2013

This paper presents a method for analyzing and designing an extremely miniaturized planar ring hybrid, using the combination of parallel and diagonally shorted coupled lines. In contrast to conventional miniaturized coupled line filters, it is proven that the required electrical length of transmission line can be largely reduced to even a few degrees, not only effectively suppressing the spurious passband but also approximately maintaining the same characteristic around the stable center frequency. A ring hybrid filter at center frequency of 1 GHz was fabricated on the FR4 epoxy glass cloth copper-clad plat (CCL) PCB substrate. The insertion loss of a ring hybrid filter with the die area of $30mm{\times}30mm$ is -4.68 dB. Simulated results are well agreed with the measurements.

• Journal of Advanced Marine Engineering and Technology
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• v.38 no.8
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• pp.995-999
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• 2014

In this paper, a new size-reduction approach for branch-line coupler is introduced which uses parallel end-shorted coupled lines with lumped capacitors. The characteristic of the new design was analyzed using even-odd mode method, and simulated on HFSS before fabricated on the FR4 epoxy glass cloth copper-clad plat (CCL) PCB substrate at center frequency of 1 GHz. The electrical length of transmission line was reduced to 15 degrees, therefore the size of branch-line coupler was largely reduced approximately maintaining the same characteristic around the stable center frequency. The insertion loss of the branch-line coupler filter was -4.39 dB. The size of the overall hybrid is $20mm{\times}20mm$. Measurements results were well agreed with the simulated ones.

• Proceedings of the KIEE Conference
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• 2008.07a
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• pp.1406-1407
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• 2008

In this paper, a micro balanced filter in magnetically coupled LC resonators is proposed, designed, simulated by using FR-4 PCB substrate for low cost, small volume IEEE 802. 11a wireless LAN application. Two pair of coupled LC resonators using magnetic coupling of embedded inductors are applied to obtain bandpass transmission response and improve their phase and magnitude imbalance characteristics. In addition, high dielectric composite film is applied to fabricate the high Q MIM capacitors with small size and high capacitance density. It has an insertion loss of 1.4 dB, a return loss of 10 dB, a phase imbalance of 0.25 degree, and magnitude imbalance of 0.17 dB at frequency bandwidth of 200 MHz ranged from 5.15 GHz to 5.35 GHz, respectively. The proposed balanced filter has a small volume of $1.1mm{\times}1.3mm{\times}0.6mm$ (height).

• Journal of electromagnetic engineering and science
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• v.11 no.3
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• pp.207-212
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• 2011

This paper presents a CPW-fed antenna with three slots. The proposed antenna can operate at 1.9~2.1 GHz and 2.9~3.3 GHz which are generated by the two rectangular slots, and 4.5~11.6 GHz which is generated by the main patch. The semicircle-slot is used as a band-notched filter to stop at a desired band (5.150~5.825 GHz) limited by IEEE 802.11a or HIPERLAN/2 applications. The currents concentrate around corresponding slots at the desired band. The proposed antenna is very small in size, with overall dimensions of $27{\times}32{\times}1\;mm^3$ etched onto an FR4-printed circuit board (PCB).

• Proceedings of the Materials Research Society of Korea Conference
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• 2003.03a
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• pp.68-68
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• 2003

최근의 전자부품은 고밀도 고집적화 됨에 따라 여러 가지 문제점들이 발생되고 있다. 그 중 부품이 실장되는 부분에 사용되는 솔더나 전기적 회로를 구성하는 패턴간에 금속 이온 마이그레이션(Metallic Ion Migration)이 발생하여 전기적 단락(Short)를 유발함으로써 전자제품의 치명적 고장을 유발한다. 본 연구는 이온 마이그레이션 현상을 물방울시험(Water Drop Test)을 통하여 재현함으로써 발생 메카니즘을 확인하여 발생원인을 직접적으로 관찰하고, 각 종 패턴의 거리 및 전압에 따른 발생속도의 차이를 조사하기 위하여 수행되었다. 이러한 실험을 위하여 콤 패턴(Comb Pattern)의 FR-4 재질 인쇄회로기판(PCB : Printed Circuit Board)을 사용하였으며, 사용된 전극재질로는 Cu, SnPb, Au를 사용하였고, 패턴간 거리는 0.5, 1.0, 2.0mm의 3가지 종류로 구분하였다. 또한 패턴간에 인간 된 전압은 6.5V, 15V를 인가한 후 마이그레이션이 발생되는 시간을 측정하였다. 이러한 실험으로부터 다음과 같은 결론을 얻었다. (1) 6.5V의 인가전압에서는 Cu 패턴이 대체적으로 가장 빠르게 마이그레이션이 발생하였으며, 다음으로 Au가 발생하였고, Cu와 SnPb의 발생시간은 대체적으로 근사한 값을 나타내었다. 이것은 비슷한 평형전위를 갖는 재료는 마이그레이션 발생시간이 유사하게 나타나며, 높은 (+)전위를 갖을수록 발생시간이 지연됨을 알 수 있다. (2) 15V를 인가하였을 때 패턴간격이 0.5mm인 경우 Cu, Au, SnPb의 순으로 나타났으며, 1.0mm는 SnPb, Cu, Au, 2.0mm인 경우는 SnPb, Au, Cu의 순으로 마이그레이션이 발생하였다. 인가전압이 높은 경우 초기 발생에는 큰 차이가 없지만 수지상이 발생 후 성장하는데 많은 영향을 미치는 것으로 보인다. 이것은 초기 수지상의 형성에 큰 영향을 미치는 것은 재료의 평형전위에 의한 값이 좌우하지만, 수지상이 일정길이 이상 형성된 이후에는 성장속도가 평형전위에 따른 값과는 다소 다르게 나타남을 알 수 있다.