• Title/Summary/Keyword: FR4PCB

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Analysis of Heat Emission Properties of Printed Circuit Boards For COB Package (COB 패키지 설계를 위한 PCB 배선기판의 열특성 분석)

  • Kim, Min-Sung;Kim, Jin-Hong;Yeo, In-Seon;Kim, Young-Woo;Park, Sung-Mo;Song, Sang-Bin
    • Proceedings of the KIEE Conference
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    • 2009.07a
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    • pp.1609_1610
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    • 2009
  • LED는 광학특성을 유지하기 위해서 최적의 방열설계가 요구된다. 이 논문에서는 입력FR-4의 Top Layer의 면적을 506.25[$mm^2$]이상으로 확대함으로써, 인가 전력 0.5W 조건하에서 FR-4 PCB로 MCPCB와 유사한 방열 특성을 발휘할 수 있음을 열화상카메라를 통한 측정 및 전산모사를 이용하여 확인하였다.

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Analysis of crosstalk of complicated striplines in a FR-4 multilayer PCB (다층기판에서 복잡한 스트립라인 구조의 누화 해석)

  • 이명호;전용일;정병윤;박권철;오창환
    • Journal of the Korean Institute of Telematics and Electronics A
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    • v.33A no.10
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    • pp.61-70
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    • 1996
  • In this paper, we find the values of near-end crosstalk coefficient in striplines of a FR-4 multilayer PCB by an analytic method and a HSPICE simulation method, and define calcualtion errors in an analytic method and define the application range, and simualte near-end crosstalk coefficients of the FCT (fast CMOS TTL) in complicated striplines by HSPICE and analyze near-en crosstalk coefficients in relation to dielectric thickness and trace spaces of striplines. As a result, we analyze coupling structure of the near-end crosstalk in the coplicated sstriplines that are impedance matched and define a coupling formula of near-end crosstalk coefficients in general complicated striplines. Especially, it is approximated in the layout grade rule.

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Design and Implementation of Wide Band of PCB Type Antenna (PCB TYPE 안테나의 초광대역 설계 및 구현)

  • Seo Jung Hoon;Jung Dae Hyun;Kim Byoung Gouk;Jung Han Young
    • Proceedings of the IEEK Conference
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    • 2004.06a
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    • pp.151-154
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    • 2004
  • In this paper. we present the 2.4 GHz and 5 GHz dual band antenna for a multiple PCB (Printed Circuit Board) antenna. Using antenna has a monopole structure with lines on FR-4(${\varepsilon}_r\;{\approx}\;4.6$) PCB. The obtained antenna can perform in 2.4 GHz and 5 GHz bands and be adopted for other wireless applications.

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Omnidirectional Collinear Antenna Using for Multi-Layer PCB Structure (다층 PCB 구조를 이용한 전방향성 코리니어 안테나)

  • Jung, Huyk;Suh, Kyoung-Whoan
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.22 no.11
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    • pp.1133-1136
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    • 2011
  • In this paper, we proposed a collinear antenna with a stripline structure for IEEE 802.11b/g applications in ISM (Industrial, Scientific, Medical) band of 2.4~2.5 GHz, which supplements disadvantages of COCO(Coaxial Collinear) antenna and OMA(Omnidirectional planar Microstrip Antenna). By using the proposed 4-layer substrate, we obtained improved performances and advantages in production compared with the existing antenna. In order to get antenna arrays, the same phase structure is designed by alternatively connecting outer conductor to inner conductor with ${\lambda}$/2 antenna element, and the substrate of FR4 epoxy (${\epsilon}_r$=4.4, tan${\delta}$=0.02) was used for the actual implementation. The maximum gain of about 4.93 dBi was measured, which leaded to a little improved gain of 0.33 dBi in comparison to the existing OMA structure.

Slot Antenna Embedded in a PCB for Zigbee Communication (지그비 통신용 PCB 내장형 슬롯 안테나)

  • Woo, Hee-Sung;Shin, Dong-Gi;Lee, Young-Soon
    • Journal of Advanced Navigation Technology
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    • v.25 no.3
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    • pp.223-228
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    • 2021
  • In this paper, we proposed a slot-type antenna with microstrip feed embedded in a PCB for Zigbee communication (2.4 ~ 2.484 GHz). The proposed antenna is designed on a FR-4 substrate with dielectric constant 4.3, thickness of 1.6 mm, and size of 50×65 mm2. Through simulations, trends of design parameters are analyzed and optimized, and the proposed antenna composed with three slots satisfy the frequency band. The measured impedance bandwidths (|S11| ≤ -10 dB) of fabricated antenna are 900 MHz (2 ~ 2.9 GHz) in Zigbee frequency band. In addition, the radiation pattern showed omnidirectional characteristics for E and H-planes, and the gain of antenna in Zigbee frequency band was 1.782 dBi.

Design of 5GHz FIR filter LNA based on a Distribute Amplifier (분산증폭기 기반 5GHz FIR 필터 LNA 설계)

  • Yeo, Hyeopgoo;Jung, Seung-Min
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • 2012.10a
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    • pp.842-844
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    • 2012
  • This paper introduces a 5GHz FIR filter low noise amplifier (LNA) based on a distributed amplifier and analyzes the its characteristics. The proposed FIR filter-LNA has the MA(moving average) filter characteristic which improves the frequency selectivity of the amplifier. Proto-type circuits with FR4 and ${\varepsilon}_r=10.2$ PCB have been realized and simulated using ADS (Advanced Design System). The simulation results verified that the designed LNA had a gain of about 10dB and the frequency characteristic of the MA FIR filter. It is expected that the proposed FIR filter LNA can be applicable to the various applications using an amplifier and a filter in RF systems.

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An optimal structure of impedance control in high density layout in a high multilayer PCB (박판화된 고다층기판에서 고밀도 배선의 임피던스 제어 최적 구조)

  • 이명호;전용일;전병윤;박권철;강석열
    • Journal of the Korean Institute of Telematics and Electronics S
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    • v.34S no.11
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    • pp.34-42
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    • 1997
  • In this paper, we show an optimal structure of impedance control in high density layouts ina high multilayers PCB. The impedance control in a high multilayers FR-4 PCB is very portant isue because a dielectric layer's thickness is very thin. Especially, odd mode impedance control is more difficult than characteristic impedance control in high multilayers PCB. So, we show an optimal structure of odd mode impedance control in that dielectric thickness is about 0.1mm with limited state and discuss multilayers PCB's for swich circuti pack and backplane in developing algorith scale ATM witching system in next time.

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Design of 24-GHz 1Tx 2Rx FMCW Transceiver (24 GHz 1Tx 2Rx FMCW 송수신기 설계)

  • Kim, Tae-Hyun;Kwon, Oh-Yun;Kim, Jun-Seong;Park, Jae-Hyun;Kim, Byung-Sung
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.29 no.10
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    • pp.758-765
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    • 2018
  • This paper presents a 24-GHz frequency-modulated continuous wave(FMCW) radar transceiver with two Rx and one Tx channels in 65-nm complementary metal-oxide-semiconductor(CMOS) process and implemented it on a radar system using the developed transceiver chip. The transceiver chip includes a $14{\times}$ frequency multiplier, low-noise amplifier, down-conversion mixer, and power amplifier(PA). The transmitter achieves >10 dBm output power from 23.8 to 24.36 GHz and the phase noise is -97.3 GHz/Hz at a 1-MHz offset. The receiver achieves 25.2 dB conversion gain and output $P_{1dB}$ of -31.7 dBm. The transceiver consumes 295 mW of power and occupies an area of $1.63{\times}1.6mm^2$. The radar system is fabricated on a low-loss Duroid printed circuit board(PCB) stacked on the low-cost FR4 PCBs. The chip and antenna are placed on the Duroid PCB with interconnects and bias, gain blocks and FMCW signal-generating circuitry are mounted on the FR4 PCB. The transmit antenna is a $4{\times}4$ patch array with 14.76 dBi gain and receiving antennas are two $4{\times}2$ patch antennas with a gain of 11.77 dBi. The operation of the radar is evaluated and confirmed by detecting the range and azimuthal angle of the corner reflectors.

The Transmission Characteristics Analysis of Plastic-Packaged MMIC Microstrip (플라스틱 실장된 MMIC 마이크로스트립의 전송 특성 해석)

  • 김병남;이해영
    • Journal of the Korean Institute of Telematics and Electronics D
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    • v.35D no.10
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    • pp.1-6
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    • 1998
  • The dielectric effects of plastic packages on GaAs($\varepsilon$$_{r}$=13) MMIC microstrip characteristics are analyzed using the spectral domain method (SDM). As being packaged by typical FR-4 composites ($\varepsilon$$_{r}$=14.2) for PCB substrates and plastic packages, the characteristic impedance is reduced by about 6 %, but the effective dielectric constant is increased by 13 % from those of bare microstrip, respectively. The parasitic effects of the packaging materials can greatly degrade the performance of the packaged MMIC. We also calculated the optimum microstrip width, which maintains the 50 $\Omega$ matching condition after plastic packaging. These calculated results can be used to optimize the plastic packages, and extend the application ranges for low cost MMIC production.n.

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A Design of the Multiband Small Chip Antenna Using the Branch Structure and Gap Feeding for Mobile Phone (가지 구조와 간극 급전을 사용한 휴대 단말기용 소형 유전체 다중 대역 칩 안테나)

  • Kim, Min-Chan;Kim, Hyung-Hoon;Park, Jong-Il;Kim, Hyeong-Dong
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.18 no.3 s.118
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    • pp.298-304
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    • 2007
  • In this paper, the antenna which has a multiband operation (GSM850, EGSM, DCS1800, USPCS, W-CDMA) is proposed. This antenna was designed by the commercial software HFSS 3-D EM simulator, and it is organized by using a meander branch structure which has a via and lines on FR-4$(\varepsilon_r=4.4)$ substrate. Especially, it has a gap feeding structure which makes good operation at overall bandwidth. The designed antenna is manufactured by PCB processing, and measured by using a network analyzer and a test chamber. The manufactured antenna with the dimension of 8 mm width, 20 mm height and 3.2 mm thickness is able to applied as an internal antenna for multiband mobile phones.