• Journal of the Microelectronics and Packaging Society
• /
• v.18 no.2
• /
• pp.63-67
• /
• 2011

We investigated effects of bonding conditions on the peel strength of rigid printed circuit board (RPCB)/ flexible printed circuit board (FPCB) joints bonded using a thermo-compression bond method, The electrodes on the FPCB were coated with Sn by a dipping process. We confirmed that the bonding temperature and bonding time strongly affected the bonding configuration and strength of the joints. Also, the peel strength is affected by dipping conditions; the optimum dipping condition was found to be temperature of $270^{\circ}C$ and time of 1s. The bonding strength linearly increased with increasing bonding temperature and time until $280^{\circ}C$ and 10s. The fracture energy calculated from the F-x (Forcedisplacement) curve during a peel test was the highest at bonding temperature of $280^{\circ}C$.

• Journal of the Korean Society of Manufacturing Technology Engineers
• /
• v.26 no.4
• /
• pp.371-377
• /
• 2017

In this study, the heat dissipation performances of metal printed circuit boards (MPCBs) and flexible printed circuit boards (FPCBs) used in light-emitting diode (LED) lights were compared and analyzed by performing a heat dissipation simulation using a thermal flow analysis program. The results were summarized graphically. The temperature distribution of the MPCB was found to be better than that of the FPCB, indicating the better heat dissipation performance of the MPCB. For the two FPCB structures studied, we confirmed the LED temperature and temperature distribution by thermal flow analysis and found that for better overall heat dissipation performance, PCBs should preferably have an asymmetric structure. We confirmed the possibility of using FPCBs, which are characterized by a flexible structure, for LED lighting.

• ETRI Journal
• /
• v.33 no.1
• /
• pp.121-124
• /
• 2011

Digital harmonics, which may reduce the radio frequency sensitivity of a system, can be coupled with an antenna in a mobile handset. This letter presents a decoupling method for increasing the isolation between digital harmonics on a flexible printed circuit board (FPCB) and an antenna in terms of the ground mode current and the concept of reaction. We model the signal and ground lines in an FPCB as a loop circuit exciting a ground mode current and demonstrate a simple but efficient decoupling method for reducing the excited ground mode current.

• Laser Solutions
• /
• v.11 no.4
• /
• pp.29-34
• /
• 2008

Ultraviolet laser micromachining has increasingly been applied to the electronics industry where precision machining of high-density, multi-layer, and multi material components is in a strong demand. Due to the ever-decreasing size of electronic products such as cellular phones, MP3 players, digital cameras, etc., flexible printed circuit board (FPCB), multi-layered with polymers and metals, tends to be thicker. In present, multi-layered FPCBs are being mechanically cut with a punching die. The mechanical cutting of FPCBs causes such defects as burr on layer edges, cracks in terminals, delamination and chipping of layers. In this study, the laser cutting mechanism of FPCB was examined to solve problems related to surface debris and short-circuiting that can be caused by the photo-thermal effect. The laser cutting of PI and FCCL, which are base materials of FPCB, was carried out using a pico-second laser(355nm, 532nm) and nano-second UV laser with adjusting variables such as the average/peak power, scanning speed, cycles, gas and materials. Points which special attention should be paid are that a fast scanning speed, low repetition rate and high peak power are required for precision machining.

• Journal of the Korea Institute of Information and Communication Engineering
• /
• v.12 no.5
• /
• pp.879-886
• /
• 2008

This paper addresses the analysis and the design optimization of differential interconnects for Low-Voltage Differential Signaling (LVDS) applications. Thanks to the differential transmission and the low voltage swing, LVDS offers high data rates and improved noise immunity with significantly reduced power consumption in data communications, high-resolution display, and flat panel display. We present an improved model and new equations to reduce impedance mismatch and signal degradation in cascaded interconnects using optimization of interconnect design parameters such as trace width, trace height and trace space in differential flexible printed circuit board (FPCB) transmission lines. We have carried out frequency-domain full-wave electromagnetic simulations, time-domain transient simulations, and S-parameter simulations to evaluate the high-frequency characteristics of the differential FPCB interconnects. The 10% change in trace width produced change of approximately 6% and 5.6% in differential impedance for trace thickness of $17.5{\mu}m$ and $35{\mu}m$, respectively. The change in the trace space showed a little change. We believe that the proposed approach is very helpful to optimize high-speed differential FPCB interconnects for LVDS applications.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2010.05a
• /
• pp.287-288
• /
• 2010

• Journal of Sensor Science and Technology
• /
• v.26 no.4
• /
• pp.245-250
• /
• 2017

A novel method to implement a birdcage-type receiving coil sensor for use in a magnetic resonance imaging(MRI) system has been demonstrated employing a flexible printed circuit board (FPCB) fabrication technique. Unlike the conventional methods, the two-dimensional shape of the coil sensor is first implemented as a FPCB and then it is attached to the surface of a cylindrical supporting structure to implement the three-dimensional birdcage-type coil sensor. The proposed method is very effective to implement object-specific MRI coil sensors especially for small animal measurements in research and preclinical applications since the existing well-developed FPCB-based techniques can easily meet the requirements on accuracies and costs during coil implement process. The performances of the coil sensor verified through $^1H$ 1.5T MRI measurements for small animals and it showed excellent characteristics by providing a high spatial precision and a high signal-to-noise ratio.

• Journal of the Microelectronics and Packaging Society
• /
• v.17 no.3
• /
• pp.11-15
• /
• 2010

In this paper, we focused on the optimization of bonding conditions for the successful thermo-compression bonding of electrodes between the RPCB and FPCB with Sn-Pb solder. The peel strength was proportionally affected by the bonding conditions, such as pressure, temperature, and time. In order to figure out an optimized bonding condition, fracture energies were calculated through F-x (force-displacement) curves in the peel test. The optimum condition for the thermo-compression bonding of electrodes between the RPCB and FPCB was found to be temperature of $225^{\circ}C$ and time of 7 s, and its peel strength was 22 N/cm.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
• /
• v.19 no.1
• /
• pp.61-70
• /
• 2008

This paper presents the flexible MEMS transmitter based on flexible printed circuit board or FPCB, which can be transformed to arbitrary shape. The FPCB is suitable to fabricate light weight and small size modules with the help of its thin thickness. Moreover a module based on FPCB can be attached on the arbitrary curved surface due to its flexible enough to be lolled up like paper. In this paper, the flexible MEMS transmitter integrated on FPCB for a short-distance sensor network which is based on orthogonal frequency division multiplexing(OFDM) communication system is proposed. The active device of the proposed flexible MEMS transmitter is fabricated on InGaP/GaAs HBT process which has been used for power amplifier design to take advantages of high linear and high efficient characteristics. Moreover, the passive devices such as the filter and signal lines are integrated and fabricated on the FPCB board. The performance of the fabricated flexible MEMS transmitter is analyzed with EVM characteristics of the output signal.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
• /
• 2007.10a
• /
• pp.761-764
• /
• 2007

This paper addresses the analysis and the design optimization of differential interconnects for Low-Voltage Differential Signaling (LVDS) applications. Thanks to the differential transmission and the low voltage swing, LVDS offers high data rates and improved noise immunity with significantly reduced power consumption in data communications, high-resolution display, and flat panel display. We present an improved model and new equations to reduce impedance mismatch and signal degradation in cascaded interconnects using optimization of interconnect design parameters such as trace width, trace height and πace space in differential flexible printed circuit board (FPCB) transmission lines. We have carried out frequency-domain full-wave electromagnetic simulations, time-domain transient simulations, and S-parameter simulations to evaluate the high-frequency characteristics of the differential FPCB interconnects.