• Title/Summary/Keyword: FIB process

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Characteristic Study for Defect of Top Si and Buried Oxide Layer on the Bonded SOI Wafer (Bonded SOI wafer의 top Si과 buried oxide layer의 결함에 대한 연구)

  • Kim Suk-Goo;Paik Un-gyu;Park Jea-Gun
    • Korean Journal of Materials Research
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    • v.14 no.6
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    • pp.413-419
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    • 2004
  • Recently, Silicon On Insulator (SOI) devices emerged to achieve better device characteristics such as higher operation speed, lower power consumption and latch-up immunity. Nevertheless, there are many detrimental defects in SOI wafers such as hydrofluoric-acid (HF)-defects, pinhole, islands, threading dislocations (TD), pyramid stacking faults (PSF), and surface roughness originating from quality of buried oxide film layer. Although the number of defects in SOI wafers has been greatly reduced over the past decade, the turn over of high-speed microprocessors using SOI wafers has been delayed because of unknown defects in SOI wafers. A new characterization method is proposed to investigate the crystalline quality, the buried oxide integrity and some electrical parameters of bonded SOI wafers. In this study, major surface defects in bonded SOI are reviewed using HF dipping, Secco etching, Cu-decoration followed by focused ion beam (FIB) and transmission electron microscope (TEM).

Surface Milling for the Study of Pore Structure in Shale Reservoirs (셰일 저류층 내 공극 구조 연구를 위한 표면 밀링)

  • Park, Sun Young;Choi, Jiyoung;Lee, Hyun Suk
    • Korean Journal of Mineralogy and Petrology
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    • v.33 no.4
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    • pp.419-426
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    • 2020
  • Understanding the pore structure including pore shape and connectivity in unconventional reservoirs is essential to increase the recovery rate of unconventional energy resources such as shale gas and oil. In this study, we found analysis condition to probe the nanoscale pore structure in shale reservoirs using Focused Ion Beam (FIB) and Ion Milling System (IMS). A-068 core samples from Liard Basin are used to probe the pore structure in shale reservoirs. The pore structure is analyzed with different pretreatment methods and analysis condition because each sample has different characteristics. The results show that surface milling by FIB is effective to obtain pore images of several micrometers local area while milling a large-area by IMS is efficient to observe various pore structure in a short time. Especially, it was confirmed that the pore structure of rocks with high content of carbonate minerals and high strength can be observed with milling by IMS. In this study, the analysis condition and process for observing the pore structure in the shale reservoirs is established. Further studies are needed to perform for probing the effect of pore size and shape on the enhancement of shale gas recovery.

Sputtering Yield and Secondary Electron Emission Coefficient(${\gamma}$) of the MgO, $MgAl_2O_4$ and $MgAl_2O_4/MgO$ Thin Film Grown on the Cu Substrate by Using the Focused Ion Beam (Cu 기판위에 성장한 MgO, $MgAl_2O_4$$MgAl_2O_4/MgO$ 박막의 집속이온빔을 이용한 스퍼터링수율 측정과 이차전자방출계수 측정)

  • Jung K.W.;Lee H.J.;Jung W.H.;Oh H.J.;Park C.W.;Choi E.H.;Seo Y.H.;Kang S.O.
    • Journal of the Korean Vacuum Society
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    • v.15 no.4
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    • pp.395-403
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    • 2006
  • It is known that $MgAl_2O_4$ has higher resistance to moisture than MgO, in humid ambient MgO is chemically unstable. It reacts very easily with moisture in the air. In this study, the characteristic of $MgAl_2O_4$ and $MgAl_2O_4/MgO$ layers as dielectric protection layers for AC- PDP (Plasma Display Panel) have been investigated and analysed in comparison for conventional MgO layers. MgO and $MgAl_2O_4$ films both with a thickness of $1000\AA$ and $MgAl_2O_4/MgO$ film with a thickness of $200/800\AA$ were grown on the Cu substrates using the electron beam evaporation. $1000\AA$ thick aluminium layers were deposited on the protective layers in order to avoid the charging effect of $Ga^+$ ion beam while the focused ion beam(FIB) is being used. We obtained sputtering yieds for the MgO, $MgAl_2O_4$ and $MgAl_2O_4/MgO$ films using the FIB system. $MgAl_2O_4/MgO$ protective layers have been found th show $24{\sim}30%$ lower sputtering yield values from 0.244 up to 0.357 than MgO layers with the values from 0.364 up to 0.449 for irradiated $Ga^+$ ion beam with energies ranged from 10 kV to 14 kV. And $MgAl_2O_4$ layers have been found to show lowest sputtering yield values from 0.88 up to 0.109. Secondary electron emission coefficient(g) using the ${\gamma}$- FIB. $MgAl_2O_4/MgO$ and MgO have been found to have similar g values from 0.09 up to 0.12 for indicated $Ne^+$ ion with energies ranged from 50 V to 200 V. Observed images for the surfaces of MgO and $MgAl_2O_4/MgO$ protective layers, after discharge degradation process for 72 hours by SEM and AFM. It is found that $MgAl_2O_4/MgO$ protective layer has superior hardness and degradation resistance properties to MgO protective layer.

Corrosion Resistance of SD460 Reinforcing Rod by Ceramic Coating (SD460 철근의 세라믹 코팅에 의한 내식성 향상연구)

  • Park, Ki Y.;Lee, Jong K.;Hong, Seok W.
    • Corrosion Science and Technology
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    • v.8 no.4
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    • pp.157-161
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    • 2009
  • The corrosion resistance of reinforcing bar was studied to endure the marine environment during shipment. The red rust on the surface did not damage the adherence in the concrete structures, especially in highly alkaline environment, but made the consumer doubt of the quality. The passivation process by alkalization of the quenching water in the tempcore process failed to endure the long shipping period. The ceramic coating by sol-gel process improved the corrosion resistance without damaging the mechanical properties and adherence between concrete and reinfiorcing bar. Optimal concentration of the coating solution and coating temperature were tested. No additional energy was necessary for the coating process by spraying during cooling process, resulting simplified process and low cost. Salt spray test, cyclic corrosion test and atmospheric test were employed to confirm the resistance. The corrosion rates were presented by rating number and polarization resistance. The coating layer was examined by FIB, XRD and SEM etc.

Shear Strength and Aging Characteristics in Solder Bumps for High Reliability Optical Module (고신뢰성 광모듈을 위한 솔더 범프의 전단강도와 시효 특성)

  • 유정희
    • Journal of Welding and Joining
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    • v.21 no.2
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    • pp.97-101
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    • 2003
  • The change of microstructures in the base metal during transient liquid phase bonding process of directionally Ni base superalloy, GID-111 was investigated. Bonds were fabricated using a series of holding times(0~7.2ks) at three different temperatures. The flip chip bonding utilizing self-aligning characteristic of solder becomes mandatory to meet tolerances for the optical device. In this paper, a parametric study of aging condition and pad size of samples was evaluated. A TiW/Cu/electroplated Cu UBM structure was selected and the samples were aging treated to analyze the effect of intermetallic compounds with the time variations. An FIB technique was applied to the preparation of samples for TEM observations. An FIB technique is very useful to prepare TEM thin foil specimens from the solder joint interface. After aging treatment, the tendency to decrease in shear strength was measured and the structure of the solder and the UBM was observed by using SEM, TEM and EDS. As a result, the shear strength was decreased of about 21% in the 100${\mu}{\textrm}{m}$ sample at 17$0^{\circ}C$ aging compared with the maximum shear strength of the sample with the same pad size. In the case of the 12$0^{\circ}C$ aging treatment, 18% of decrease in shear strength was measured at the 100${\mu}{\textrm}{m}$ pad size sample. An intermetallic compound of Cu6Sn5 and Cu3Sn were also observed through the TEM measurement by using.

Analyses of Micromachinning Processes for Microaccelecrometer Sensors Based on Electrostatic Forces (정전기력을 이용한 마이크로가속도계 센서의 마이크로머시닝 공정해석)

  • 김옥삼
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 2000.04a
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    • pp.579-584
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    • 2000
  • Single crystal silicon (SCS) is used in a variety of microsensor applications in which stresses and other mechanical effects may dominate device performance. The authers model temperature dependent mechnical properties during focused io beam(FIB) cutting and Pt deposition processes. In microaccelero-meter manufacturing process, this paper intend to find thermal displacement change of the temperature by tunnel gap, additional beam part and pt deposition. The thermal analysis intend to use ANSYS V5.5.3.

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Alignment Algorithm for Nano-scale Three-dimensional Printing System (나노스케일 3 차원 프린팅 시스템을 위한 정렬 알고리즘)

  • Jang, Ki-Hwan;Lee, Hyun-Taek;Kim, Chung-Soo;Chu, Won-Shik;Ahn, Sung-Hoon
    • Journal of the Korean Society for Precision Engineering
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    • v.31 no.12
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    • pp.1101-1106
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    • 2014
  • Hybrid manufacturing technology has been advanced to overcome limitations due to traditional fabrication methods. To fabricate a micro/nano-scale structure, various manufacturing technologies such as lithography and etching were attempted. Since these manufacturing processes are limited by their materials, temperature and features, it is necessary to develop a new three-dimensional (3D) printing method. A novel nano-scale 3D printing system was developed consisting of the Nano-Particle Deposition System (NPDS) and the Focused Ion Beam (FIB) to overcome these limitations. By repeating deposition and machining processes, it was possible to fabricate micro/nano-scale 3D structures with various metals and ceramics. Since each process works in different chambers, a transfer process is required. In this research, nanoscale 3D printing system was briefly explained and an alignment algorithm for nano-scale 3D printing system was developed. Implementing the algorithm leads to an accepted error margin of 0.5% by compensating error in rotational, horizontal, and vertical axes.

Study of point defects caused by a thin contamination layer in a-Si TFT-LCD

  • Oh, Jae-Young;Lee, Jae-Kyun;Yang, Moung-Su;Kang, In-Byeong
    • 한국정보디스플레이학회:학술대회논문집
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    • 2007.08a
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    • pp.845-848
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    • 2007
  • Analysis of point defects invisible by a microscope has been studied on the a-Si thin film transistor panel. The point defects which were named Invisible Point Defect (IPD) is characterized by no particles or distortion of patterns on a pixel structure and randomly distributed on panels. To investigate the IPD, measurements were carried out: gray level driving, transistor transfer characteristic, focused ion beam (FIB), and secondary ion mass spectrometry (SIMS). The results showed that a contamination layer had a bad influence on an active surface. The contamination layer consisted of oxygen and iron from a water supply line during cleaning process. After the process tuning, IPD has been stabilized.

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Fabrication of nano-structured PMMA substrates for the improvement of the optical transmittance (반구형 나노 패턴의 크기에 따른 PMMA기판의 광특성 평가)

  • Park, Y.M.;Shin, H.G.;Kim, B.H.;Seo, Y.H.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2009.10a
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    • pp.217-220
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    • 2009
  • This paper presents fabrication method of nano-structured PMMA substrates as well as evaluations of their optical transmittance. For anti-reflective surface, surface coating method had been conventionally used. However, it requires high cost, complicated process and post-processing times. In this study, we suggested the fabrication method of anti-reflective surface by the hot embossing process. Using the nano patterned master fabricated by anodic aluminum oxidation process. Anodic aluminum oxide(AAO) is widely used as templates or a molds for various applications such as carbon nano tube (CNT), nano rod and nano dots. Anodic aluminum oxidation process provides highly ordered regular nano-structures on the large area, while conventional pattering methods such as E-beam and FIB can fabricate arbitrary nano-structures on small area. We fabricated a porous alumina hole array with various inter-pore distance and pore diameter. In order to replicate nano-structures using alumina nano hole array patterns, we have carried out hot-embossing process with PMMA substrates. Finally the nano-structured PMMA substrates were fabricated and their optical transmittances were measured in order to evaluate the charateristivs of anti-reflection. Anti-reflective structure can be applied to various displays and automobile components.

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