• Restorative Dentistry and Endodontics
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• v.32 no.1
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• pp.28-36
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• 2007

The purpose of this study was to compare the effect of exponential curing method with conventional curing and soft start curing method on polymerization shrinkage of composite resins. Three brands of composite resins (Synergy Duo Shade, Z250, Filtek Supreme) and three brands of light curing units (Spectrum 800, Elipar Highlight, Elipar Trilight) were used. 40 seconds curing time was given. The shrinkage was measured using linometer for 90 seconds. The effect of time on polymerization shrinkage was analysed by one-way ANOVA and the effect of curing modes and materials on polymerization shrinkage at the time of 90s were analysed by two-way ANOVA. The shrinkage ratios at the time of 20s to 90s were taken and analysed the same way. The results were as follows : 1. All the groups except Supreme shrank almost within 20s Supreme cured by soft start and exponential curing had no further shrinkage after 30s (p < 0.05). 2. Statistical analysis revealed that polymerization shrinkage varied among materials (p = 0.000) and curing modes (p = 0.003). There was no significant interaction between material and curing mode. 3. The groups cured by exponential curing showed the statistically lower polymerization shrinkage at 90s than the groups cured by conventional curing and soft start curing (p < 0.05). 4. The initial shrinkage ratios of soft start and exponential curing were statistically lower than conventional curing (p < 0.05). From this study, the use of low initial light intensities may reduce the polymerization rate and, as a result, reduce the stress of polymerization shrinkage.

• Restorative Dentistry and Endodontics
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• v.35 no.2
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• pp.125-133
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• 2010

Objectives: Rapid polymerization of overlying composite resin causes high polymerization shrinkage stress at the adhesive layer. In order to alleviate the shrinkage stress, increasing the light intensity over the first 5 seconds was suggested as an exponential curing mode by an LED light curing unit (Elipar FreeLight2, 3M ESPE). In this study, the effectiveness of the exponential curing mode on reducing stress was evaluated with measuring microtensile bond strength of three adhesives after the overlying composite resin was polymerized with either continuous or exponential curing mode. Methods: Scotchbond Multipurpose Plus (MP, 3M ESPE), Single Bond 2 (SB, 3M ESPE), and Adper Prompt (AP, 3M ESPE) were applied onto the flat occlusal dentin of extracted human molar. The overlying hybrid composite (Denfil, Vericom, Korea) was cured under one of two exposing modes of the curing unit. At 48h from bonding, microtensile bond strength was measured at a crosshead speed of 1.0 mm/min. The fractured surfaces were observed under FE-SEM. Results: There was no statistically significant difference in the microtensile bond strengths of each adhesive between curing methods (Two-way ANOVA, p > 0.05). The microtensile bond strengths of MP and SB were significantly higher than that of AP (p < 0.05). Mixed failures were observed in most of the fractured surfaces, and differences in the failure mode were not observed among groups. Conclusion: The exponential curing method had no beneficial effect on the microtensile dentin bond strengths of three adhesives compared to continuous curing method.

• Proceedings of the KACD Conference
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• 2003.11a
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• pp.613-613
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• 2003

The purpose of this study was to compare the effect of exponential curing method with conventional curing and two step soft start curing method on polymerization shrinkage of composite resins. Three brands of composite resins (Synergy Duo Shade, Z-250, Supreme) and three brands of light curing units (Spectrum 800, Elipar Highlight, Elipar Trillight) were used. In this study, the diameter of specimen was 5.5mm and height 1.6mm and the specimen was cured for 40 seconds. The shrinkage was measured by custom made linometer. The amount of linear polymerization shrinkage recorded in the computer every 0.5 second for 90 seconds. Each group was measured 10 times.(omitted)

• Proceedings of the Korean Institute of Building Construction Conference
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• 2021.05a
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• pp.203-204
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• 2021

Bacteria used in self-healing concrete, which arrest the crack, helps increasing the durability is well known. However, the survival and activity of the bacteria are precisely unknown. In this research, to know the bacteria's survival curve on the surface of the cement composite, bacteria's survival curve has been measured by CFU at different curing days. The survival curve of 3 days and 7 days curing does not show the significant differences in their survival tendency. However, the slope of death phase of 7 days curing was steeper than the 3 days of curing. This research was focused on the death phase but for further research, set of interval time will be reduced and observe the lag phase and exponential phase.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.05a
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• pp.548-551
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• 1999

The cure characteristics of metal particle filled DGEBA/MDA/SN/ zeolite epoxy resin composite system for EMI shielding were investigated by dynamic DSC run method and FT-lR spectroscopy. As the heating rate increased, the peak temperature on dynamic DSC curve increased because of the rapid cure reaction. From the straight line of the Kissinger plot, the curing reaction activation energy and pre-exponential factor could be obtained. As the post-curing time at 15$0^{\circ}C$ increased, the glass increased the glass transition temperature or the thermal stability increased. When the post curing time is too long, the system filled with metallic Al particle can be thermally oxidized by the catalytic reaction of metal filler and the thermal stability of the composite for the EMI shielding application may be decreased.

• Korean Journal of Materials Research
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• v.4 no.5
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• pp.574-580
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• 1994

This study is about cure kinetics of DGEBA/MDA/MN(malononitrile) system by Barrett method and Integral method using DSC dynamic run. Curing behavior was shown through DSC and the heat change involved in a reaction could be measured directly with DSC. The kinetic parameters such as activation energy, pre-exponential factor and reaction order were given by Barrett method and Integral method obtained in an assumption that the area of DSC enthalpic analysis curve was propotional to the enthalpic change.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.11a
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• pp.475-478
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• 1999

The thermal properties of epoxy resin/siloxane for the electrical insulation were investigated by using dynamic DSC run method. As the heating rate increased, the peak temperature on dynamic DSC curve increased. From the linear relation on the Kissinger plot the curing reaction activation energy and pre-exponential factor could be obtained. The curing activation energy from the straight line of the Kissinger plot was 46.72 kJ/mol.

• Journal of the korean academy of Pediatric Dentistry
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• v.32 no.2
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• pp.332-343
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• 2005

The purpose of this study was to evaluate the influence of soft-start light curing on contraction stress and hardness of composite resin. Composite resin mold was cured using the one-step continuous curing method with three difference light sources; conventional halogen light curing for 40 seconds at $400\;mw/cm^2$, plasma arc light curing for 6 seconds at $1300\;mW/cm^2$ and LED light curing for 10 seconds at $7The purpose of this study was to evaluate the influence of soft-start light curing on contraction stress and hardness of composite resin. Composite resin mold was cured using the one-step continuous curing method with three difference light sources; conventional halogen light curing for 40 seconds at . For the soft-start curing method ; 2 seconds light exposure at $650\;mW/cm^2$ followed by 3 seconds at $1300\;mW/cm^2$ and exponential increase with 5 seconds followed by 10 seconds at $700\;mW/cm^2$ were used. Contraction stress was measured using strain gauge method and Vickers hardness was measured 24 hours after polymerization at the top and bottom of specimens. Resin-acrylic interfaces were observed using a scanning electron microscope(SEM). The results of present study can be summarized as follows: 1. Contraction stresses at 10 min after polymerization were significantly reduced with the soft-start curing both in plasma and LED light sources(P<0.05). 2. Plasma light curing with soft-start resulted in not only the lowest contraction stress, but also the lowest hardness(P<0.05) 3. LED light curing with soft-start showed lower contraction stress than the one-step continuous halogen and LED light curing(P<0.05). 4. Microhardness of specimens cured by LED light with soft-start was equivalent to that of cured by the one-step continuous halogen and LED light(P>0.05). 5. Curing by LED light with soft-start and conventional halogen light resulted in better marginal sealing than plasma light and one-step LED light curing.

• Journal of the Korean GEO-environmental Society
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• v.16 no.11
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• pp.5-11
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• 2015

The development of Controlled Low Strength Material (CLSM), which is a highly flowable material, has been performed for the application of backfill. The objective of this study is to compare the compressive strength and compressive wave velocity of CLSM according to the curing time. To investigate the characteristics of the CLSM consisting of sand, silt, water, flyash, and CSA cement, uniaxial compression test and flow test were carried out. For the measurement of compressional waves, a cell and a couple of transducers were used. The test results show that the compressive strength increases with the curing time, while the increment of compressive strength decreases with the curing time. In addition, the compressive wave velocity increases with the curing time, and the correlation between the compressive wave velocity and compressive strength is similar to exponential function. This study suggests that the correlation between the compressive wave velocity and compressive strength may be effectively used for the estimation of compressive strength of the CLSM at early curing time.

• Transactions on Electrical and Electronic Materials
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• v.16 no.2
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• pp.74-77
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• 2015

The cure kinetics of a neat epoxy system and epoxy/silica composite were investigated by DSC analysis. A cycloaliphatic type epoxy resin was diglycidyl 1,2-cyclohexanedicarboxylate and curing agent was anhydride type. To estimate kinetic parameters, the Kissinger equation was used. The activation energy of the neat epoxy system was 88.9 kJ/mol and pre-exponential factor was 2.64×10¹² min⁻¹, while the activation energy and pre-exponential factor for epoxy/silica composite were 97.4 kJ/mol and 9.21×10¹² min⁻¹, respectively. These values showed that the silica particles have effects on the cure kinetics of the neat epoxy matrix.