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http://dx.doi.org/10.4313/TEEM.2015.16.2.74

Cure Kinetics of Cycloaliphatic Epoxy/Silica System for Electrical Insulation Materials in Outdoor Applications  

Lee, Jae-Young (Hydrogen Fuel Cell Parts and Applied Technology Regional Innovation Center, Woosuk University)
Park, Jae-Jun (Department of Electrical and Electronic Engineering, Joongbu University)
Kim, Jae-Seol (Department of Electrical and Electronic Engineering, Joongbu University)
Shin, Seong-Sik (Department of Electrical and Electronic Engineering, Joongbu University)
Yoon, Chan-Young (Department of Electrical and Electronic Engineering, Joongbu University)
Cheong, Jong-Hoon (Head & Pyeongtaek Factory, Dongwoo Electric Co.)
Kim, Young-Woo (Head & Pyeongtaek Factory, Dongwoo Electric Co.)
Kang, Geun-Bae (Head & Pyeongtaek Factory, Dongwoo Electric Co.)
Publication Information
Transactions on Electrical and Electronic Materials / v.16, no.2, 2015 , pp. 74-77 More about this Journal
Abstract
The cure kinetics of a neat epoxy system and epoxy/silica composite were investigated by DSC analysis. A cycloaliphatic type epoxy resin was diglycidyl 1,2-cyclohexanedicarboxylate and curing agent was anhydride type. To estimate kinetic parameters, the Kissinger equation was used. The activation energy of the neat epoxy system was 88.9 kJ/mol and pre-exponential factor was 2.64×1012 min−1, while the activation energy and pre-exponential factor for epoxy/silica composite were 97.4 kJ/mol and 9.21×1012 min−1, respectively. These values showed that the silica particles have effects on the cure kinetics of the neat epoxy matrix.
Keywords
Cure kinetics; Kissinger equation; Cycloaliphatic epoxy; Epoxy/silica composite; Epoxysilane-treated silica; Electrical insulators;
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Times Cited By KSCI : 1  (Citation Analysis)
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