• 제목/요약/키워드: Excimer

검색결과 426건 처리시간 0.023초

ArF 엑시머 레이저에 의한 가류 고무의 표면처리 (Surface treatment of vulcanized rubber by ArF excimer laser)

  • 이봉주
    • 한국광학회지
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    • 제13권4호
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    • pp.332-335
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    • 2002
  • 가류고무의 접착력을 향상시키기 위해서 엑시머 펄스 레이저 광으로 표면처리를 하였다. 레이저 광 조사 수의 증가에 따라, 접착력은 크게 향상되어, 100회의 조사 수에서 1500 N/m의 가장 큰 값을 얻었다. 또한 에너지 밀도 증가에 대해서도 접착력은 증가하여 에너지 밀도 176 mJ/$cm^{2}$에서 가장 큰 접착력 1500 N/m를 얻게 되었다. 에너지 밀도의 증가에 따라 접착력이 증가하는 것은 표면적의 증가와 관련이 있음을 알았다.

엑시머 레이저를 이용한 PMMA와 PET의 가공 (Excimer laser induced ablation of PMMA and PET)

  • 신동식;이제훈;서정;김도훈
    • 한국레이저가공학회지
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    • 제6권1호
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    • pp.33-40
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    • 2003
  • The ablative decomposition mechanism of PMMA(polymethyl methacrylate) and PET(polyethylene terephthalate) with KrF excimer laser(λ : 248nm, pulse duration: 5㎱) is investigated. The UV/Vis spectrometer analysis showed that PMMA is a weak absorber and PET is a strong absorber at the wavelength of 248nm. The results(surface debris, melt, etch depth, etching shape) from drilling and direct writing experiments imply that ablation mechanism of PMMA is dominated by photothermal process, while that of PET is dominated by photochemical process.

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Excimer laser를 이용한 세라믹 미세구멍 가공 (Ceramic Microhole Machining using Excimer Laser)

  • 백병만;이건상
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2001년도 춘계학술대회논문집C
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    • pp.519-524
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    • 2001
  • These days, $Al_[2}O_{3}$ ceramic use all over the industry because dynamic function and special properties to compare traditional material. But $Al_[2}O_{3}$ ceramic is high hardness and brittleness materials. For this reason, it is very difficult to process. Therefor, In this paper, it was investigated that laser process parameter, which can produce appropriate quality of $Al_[2}O_{3}$ ceramic microhole machining utilized Nd:YAG laser and Excimer laser.

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폴리머 미세가공을 위한 레이저 어블레이션 모델링 (Modeling of Polymer Ablation with Excimer Lasers)

  • 윤경구;방세윤
    • 한국정밀공학회지
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    • 제22권9호
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    • pp.60-68
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    • 2005
  • To investigate the effects of beam focusing in the etching of polymers with short pulse Excimer lasers, a polymer etching model of SSB's is combined with a beam focusing model. Through the numerical simulation, it was found that in the high laser fluence region, SSB model considering both photochemical and thermal contribution is considered to be suitable to predict the etched hole shape than a simple photochemical etching model. The average temperature distribution into the substance obtained by assuming 1-D heat transfer is found to be fairly similar to the fluence distribution on the ablated surface. The experimental etching data fur polymers are used to give material properties for ablation model. The fitted etch depth curve gives a nice agreement with the experimental data.

액시머 레이저로 증착된 초전도박막과 사파이어 기판간 계면 특성 분석 (Interface Characterization of Supeconducting Thin Film on Sapphire Grown by an Excimer Laser)

  • 이상렬;박형호;강광용
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 1995년도 추계학술대회 논문집
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    • pp.148-151
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    • 1995
  • Excimer laser has been used to fabricate superconducting YBa$_2$Cu$_3$O$\sub$7-x/(YBCO) thin films on various substrates. An XeCl excimer laser with an wavelength of 308 nm was used to deposit both buffer layer and superconducting thin film on sapphire substrate. The characterizations of the interface between thin film and substrate were performed. The interfacial properties of thin films on buffered sapphire and on bare sapphire were compared. With a 20 nm PrBa$_2$Cu$_3$O$\sub$7-x/(PBCO) buffer layer, no diffusion layer was observed between film and substrate while the diffusion layer with about 30 nm thickness was observed between film and sapphire without buffer layer.

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In-Situ Fluorine Passivation by Excimer Laser Annealing

  • Jung, Sang-Hoon;Kim, Cheon-Hong;Jeon, Jae-Hong;Yoo, Juhn-Suk;Han, Min-Koo
    • Journal of Information Display
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    • 제1권1호
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    • pp.25-28
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    • 2000
  • We propose a new in-situ fluorine passivation of poly-Si TFTs using excimer laser annealing to reduce the trap state density and improve reliability significantly. To investigate the effect of an in-situ fluorine passivation, we have fabricated fluorine-passivated p-channel poly-Si TFTs and examined their electrical characteristics and stability. A new in-situ fluorine passivation brought about an improvement in electrical characteristic. Such improvement is due to the formation of stronger Si-F bonds than Si-H bonds in poly-Si channel and $SiO_2$/Poly-Si interface.

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Blue light-emitting polyalkylfluorene copolymers for LEDs

  • Hwang, Do-Hoon;Park, Moo-Jin;Kim, Suk-Kyung;Lee, Ji-Hoon;Lee, Chang-Hee;Kim, Yong-Bae
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2003년도 International Meeting on Information Display
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    • pp.874-876
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    • 2003
  • Blue light-emitting polyfluorene derivatives, poly[9,9-bis(4'-n-octyloxyphenyl) fluorene] (PBOPF), poly[9,9-bis(2'-ethylhexyl)]fluorene (PBEHF) and copolymers of PBOPF and PBEHF were synthesized through Ni(0) mediated polymerization and their light-emitting properties were investigated. The PBEHF thin film showed significant excimer band in PL spectra after thermal annealing at 100 $^{\circ}C$ for 2h. But no significant excimer emission was observed in the PL spectra of the PBOPF and the copolymers even after thermal annealing suggesting that BOPF unit effectively suppressed the excimer emission.

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엑시머 레이저를 이용한 파이렉스 유리의 미세 구멍 가공 (The Experimental Study in the Micro Drilling of Excimer Laser on Pyrex Glass)

  • 이철재;김하나;정윤상;전찬봉;박영철;강정호
    • 한국기계가공학회지
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    • 제11권5호
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    • pp.99-103
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    • 2012
  • Presently, A glass is widely used in telecommunication system, optoelectronic devices and micro electro mechanical systems. Micro drilling of glass using the laser can save processing cost and improve the accuracy. This paper experiments micro drilling using KrF excimer laser on the pyrex glass of $500{\mu}m$ thickness. We have experiment to find out optimum laser machining conditions of micro drilling of glass and ablation depth and influence by processing parameter suc'h pulse repetition rate, energy density and number of pulses. Pulse repetition rate don't influence ablation depth at the micro drilling of pyrex glass. Energy density influence micro drilling of parallelism and maximum thickness that can be drilled. Ablation depth is most influenced by number of pulses.

엣시머 레이져를 이용한 폴리우레탄의 미세 가공에 관한 연구 (A Study on the Micro Machining in Polyurethane by Excimer Laser)

  • 김재구;이성국;윤경구
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 1997년도 춘계학술대회 논문집
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    • pp.366-370
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    • 1997
  • This paper descibes a micro groove machining process on the polyurethane biopolymer by KrF excimer laser. To investigate the etch charcteristics of polyurethane biopolymer quantitatively,laser system for ablation was installed with high precison moter and then polymer ablation experiment, in which paramteters were fluence,pulse repetition rate,numbers of pulses and assist gas, was carred out. In this experiment, we found out that the value of critical energy density for ablation is 30mJ/cmsup2/ and the etching rate is more dependent on the pulse number and fluence than any other pamameter. Finally, we machined micro grooves for fiexibility as width 300.mu.m depth 100.mu.m and port for micro-devices mounting as length 100.mu.m width 300.mu.m depth .mu.m on the outer wallof polyurethane biopolymer tube which is used as medical device.

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폴리머의 엑시머레이저 어블레이션에 관한 연구 (A study of excimer laser ablation of polymer)

  • 신동식;이제훈;서정;김도훈
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2003년도 춘계학술대회 논문집
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    • pp.1857-1860
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    • 2003
  • The ablative decomposition mechanism of PMMA(polymethyt methacrylate), PET(polyethylene terephthalate) and PC(polycarbonate) with KrF excimer laser(λ: 248nm, pulse duration: 5ns) is investigated. The UV/Vis spectrometer analysis showed that PMMA is a weak absorber and PET, PC are a strong absorber at the wavelength of 248nm. The results(surface debris, melt, etch depth, etching shape) from drilling and direct writing experiments imply that ablation mechanism of PMMA is dominated by photothermal process, while that of PET, PC are dominated by photochemical process.

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