• 한국정보디스플레이학회:학술대회논문집
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• 2004.08a
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• pp.223-226
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• 2004

MgO thin films were deposited bye-beam evaporation on $SiO_2$/Si wafers for the application of a protective layer in alternating current plasma display panels (AC-PDPs). Three different MgO sources, single crystal, melted polycrystal and sintered polycrystal, were used to find out the change of the properties of MgO protective layer depending on the source type. The properties of MgO thin films such as density, orientation and surface morphology were influenced by the source type. MgO thin films deposited with the melted polycrystal source had the highest density with the highest (100) preferred orientation, whereas the films deposited with the sintered polycrystal source had the lowest density with less preferred orientation. Such a result seems to be originated from the different mobility of adatoms on the surface of the deposited MgO thin films. Different microstructures of MgO thin films deposited even in the same deposition condition were observed depending on the MgO source type, resulting in different discharge characteristics.

• 한국정보디스플레이학회:학술대회논문집
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• 2003.07a
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• pp.397-400
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• 2003

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.26 no.4
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• pp.294-297
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• 2013

ZnO crystals with octahedral shape were synthesized by thermal evaporation technique. $ZnF_2$ powder was used as the source material. The thermal evaporation and oxidation of $ZnF_2$ powder was carried out for 1 hr at $1,000^{\circ}C$ in air under atmospheric pressure. SEM images showed that the ZnO crystals produced by oxidizing $ZnF_2$ vapor possessed a characteristic octahedral shape. XRD spectrum revealed that the ZnO octahedron had hexagonal wurtzite structure. In the room temperature photoluminescence spectrum, a strong green emission peak at around 510 nm was observed.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.4
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• pp.77-82
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• 2010

Effects of evaporation processes and a reduction annealing on thermoelectric properties of the Sb-Te thin films prepared by thermal evaporation have been investigated. The thin film evaporated by using the powders formed by crushing a $Sb_2Te_3$ ingot as an evaporation source exhibited a power factor of $2.71{\times}10^{-4}W/m-K^2$. The thin film processed by evaporation of the mixed powders of Sb and Te as an evaporation source showed a power factor of $0.12{\times}10^{-4}W/m-K^2$. The thin film fabricated by coevaporation of Sb and Te dual evaporation sources possessed a power factor of $0.73{\times}10^{-4}W/m-K^2$. With a reduction annealing at $300^{\circ}C$ for 2 hrs, the power factors of the films evaporated by using the $Sb_2Te_3$ ingot-crushed powders and coevaporated with Sb and Te dual evaporation sources were remarkably improved to $24.1{\times}10^{-4}W/m-K^2$ and $40.2{\times}10^{-4}W/m-K^2$, respectively.

• Korean Journal of Materials Research
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• v.28 no.4
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• pp.235-240
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• 2018

We propose a speedy two-step deposit process to form an Au electrode on hole transport layer(HTL) without any damage using a general thermal evaporator in a perovskite solar cell(PSC). An Au electrode with a thickness of 70 nm was prepared with one-step and two-step processes using a general thermal evaporator with a 30 cm source-substrate distance and $6.0{\times}10^{-6}$ torr vacuum. The one-step process deposits the Au film with the desirable thickness through a source power of 60 and 100 W at a time. The two-step process deposits a 7 nm-thick buffer layer with source power of 60, 70, and 80 W, and then deposits the remaining film thickness at higher source power of 80, 90, and 100 W. The photovoltaic properties and microstructure of these PSC devices with a glass/FTO/$TiO_2$/perovskite/HTL/Au electrode were measured by a solar simulator and field emission scanning electron microscope. The one-step process showed a low depo-temperature of $88.5^{\circ}C$ with a long deposition time of 90 minutes at 60 W. It showed a high depo-temperature of $135.4^{\circ}C$ with a short deposition time of 8 minutes at 100 W. All the samples showed an ECE lower than 2.8 % due to damage on the HTL. The two-step process offered an ECE higher than 6.25 % without HTL damage through a deposition temperature lower than $88^{\circ}C$ and a short deposition time within 20 minutes in general. Therefore, the proposed two-step process is favorable to produce an Au electrode layer for the PSC device with a general thermal evaporator.

• Atmosphere
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• v.26 no.4
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• pp.553-563
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• 2016

Land evaporation contribution to precipitation over East Asia is studied to understand terrestrial moisture source of continental precipitation. Moisture recycling of precipitation relying on terrestrial evaporation is estimated based on the analysis method of Van der Ent et al. (2010). We utilize HadGEM2-AO simulations for the period of 1970~1999 and 2070~2099 from RCP8.5. Globally, 46% of terrestrial precipitation is depending from continental evaporation. 58% of terrestrial evaporation returns as continental precipitation. Over East Asia, precipitation has been affected by local evaporation and transported moisture. The advection of upwind continental evaporation results from the prevailing westerlies from the midwestern of Eurasian continent. For the present-day period, about 66% of the precipitation over the land of East Asia originates from land evaporation. Regionally, the ratios change and the ratios of precipitation terrestrial origin over the Northern inland and Southern coast of East Asia are 82% and 48%, respectively. Seasonally, the continental moisture recycling ratio is larger during summer (JJA) than winter (DJF). According to RCP8.5, moisture recycling ratio is expected to change. At the end of the 21st century, the impact of continental moisture sources for precipitation over East Asia is projected to be reduced by about 5% compared to at the end of 20th century. To understand the future changes, moisture residence time change is investigated using depletion and replenishment time.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08b
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• pp.1603-1606
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• 2007

The TPS (Temperature Programmed Sublimation) technology has been developed to monitor the plane evaporation of the organic films and introduced in SID2007, P53.[4] The Alq3 organic film is deposited on various metal surface such as Cu, Ti, Invar, STS to sublimate. The TPS signal confirms that the Alq3 film consists of nano scale film phase and bulk phase on all the metal plates. The sublimation temperature of the Alq3 film was much lower ($130^{\circ}C$) than the vapor temperature ($265^{\circ}$) of the Alq3 powder.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.1682-1686
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• 2006

The Gaussian thickness profiles in metal plate evaporation using LPS sources have been studied for the first time. Based on our experimental data, it simulates the organic thin-film uniformity of 3% and very high material usage of 81% for large size AMOLED manufacturing.

• Journal of the Korean Vacuum Society
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• v.9 no.3
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• pp.207-215
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• 2000

Al films on cold-rolled steel sheet have been prepared by vacuum evaporation and arc-induced ion plating, respectively, and the evaporation rate and vapor distribution (thickness distribution over the substrate) have been investigated according to deposition conditions. The arc-induced ion plating (AIIP) method have been employed, which makes use of arc-like discharge current induced by ionization electrode located near the evaporation source. The AIIP takes advantage of high ionization rate compared with conventional ion plating, and can be carried out at low pressure of less than $10^{-4}$ torr. Very high evaporation rate of more than 2.0 mu\textrm{m}$/min could be achieved for Al evaporation using alumina liner by electron beam evaporation. The geometry factor n for the $cos^{n/\phi}$ vapor distribution, which affects the thickness distribution of films at the substrate turned out to be around 1 for vacuum evaporation, while it features around 2 or higher for ion plating. For the ion plated films, it has been found that the ionization condition and substrate bias are the main parameters to affect the thickness distribution of the films.

• Journal of the Korean Vacuum Society
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• v.3 no.4
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• pp.414-419
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• 1994

Surface of Pt/$Al_2O_3$ model catalyst was produced on an aluminum foil with surface area of 1 $cm^2$ The aluminum surface was oxidized under $10 ^5Torr$Torr oxygen and platinum was deposited on top of the oxide layer using a plasma evaporation source. Conversion of I-butene was performed on the model catalyst surface. Isomerization was the major reaction in I-butene conversion on the aluminum oxide layer. Addition of Pt on the aluminum oxide layer induces hydrogenation of I-butene. Selectivity for the hydrogenation increases as the amount of Pt on alumina increases.