• Applied Chemistry for Engineering
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• v.22 no.2
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• pp.230-234
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• 2011

In this work, the primary material for a single layered hardmask which can afford a spin-on process was prepared by the minture of organic and inorganic sources. The preparation of hybrid polymer was attempted by esterification from silanol terminated siloxane compounds and acetonide-2,2-bis(methoxy)propionic acid. The optical, thermal and morphological properties of the test hardmask film was examined in terms of cross-linking agent and additives. In addition, the etch rate of hardmask film and photo resist layer were compared. The hybrid polymer prepared from organic and inorganic materials was found to be useful for hardmask film to form the nano-patterns.

• Journal of the Korean Society of Safety
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• v.35 no.6
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• pp.85-92
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• 2020

Wet Scrubber reacts the incoming pollutant gas with cleaning water (water + absorbent) to absorb pollutants and release the clean air to the atmosphere. Wet scrubbers and packed tower scrubbers using this principle are widely used in businesses that emit acid gases. In particular, in the etching process using hydrochloric acid (HCl), alkaline washing water (NaOH) having a pH of about 8 to 11 is used to absorb a large amount of acid gas. However, These salts are attached to the injection nozzle (nozzle), filling material (packing), and the demister (Demister), causing air pollution, human damage, and inoperability due to clogging and acid gas discharge. Therefore, In this study, an improvement plan was proposed to manage the washing water with pH 3~4 acidic washing water. The test method takes samples from the Wet Scrubber flue measurement laboratory twice a month for 1 year. Hydrogen chloride (HCl) concentration (ppm) was measured, and nozzle clogging and scale conditions were measured, compared, and analyzed through a differential pressure gauge and a pressure gauge. As a result of the check, it was visually confirmed that the scale was reduced to 50% or less in the spray nozzle, filler, and demister. In addition, the emission limit of hydrogen chloride in accordance with the Enforcement Regulation of the Air Quality Conservation Act [Annex 8] met 3 ppm or less. Therefore, even if the washing water is operated in an acidic pH range of 3 to 4, it is expected to reduce air pollution and human damage due to clogging of internal parts, and it is expected to reduce maintenance costs such as regular cleaning or replacement of parts.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.29 no.3
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• pp.223-228
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• 2023

Sustainable energy supplies without the recharging and replacement of the charge storage device have become increasingly important. Among various energy harvesters, the triboelectric nanogenerator (TENG) has attracted considerable attention due to its high instantaneous output power, broad selection of available materials, eco-friendly and inexpensive fabrication process, and various working modes customized for target applications. In this study, the amount of voltage and current generated was measured by applying the PSD profile random vibration test of the electronic vibration tester and ISTA 3A according to the time of Anodized Aluminum Oxide (AAO) pore widening of the manufactured TENG device Teflon and AAO. The discharge and charging tests of the integrated module during the random simulated transport environment and the recognition distance of RFID were measured while agricultural products (onion) were loaded into the returnable folding plastic box. As a result, it was found that AAO alumina etching processing time to maximize TENG performance was optimal at 31 min in terms of voltage and current generation, and the integrated module applied with the TENG module showed a charging effect even during the continuous use of RFID, so the voltage was kept constant without discharge. In addition, the RFID recognition distance of the integrated module was measured as a maximum of 1.4 m. Therefore, it was found that the surface condition of AAO, a TENG element, has a great influence on the power generation of the integrated module, and due to the characteristics of TENG, the power generation increases as the surface dries, so it is judged that the power generation can be increased if the surface drying treatment (ozone treatment, etc.) of AAO is applied in the future.

• Tribology and Lubricants
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• v.40 no.3
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• pp.91-96
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• 2024

Recently, extensive studies have been carried out to enhance various performance aspects such as the durability, lifespan, and hardness by combining diverse materials or developing novel materials. The utilization of superhydrophobic surfaces, particularly in the automotive, textile, and medical device industries, has gained momentum to achieve improved performance and efficiency. Superhydrophobicity refers to a surface state where the contact angle when water droplets fall is above 150°, while the contact angle during sliding motion is smaller than 10°. Superhydrophobic surfaces offer the advantage of water droplets not easily sliding off, maintaining a cleaner state as the droplets leave the surface. Surface modification involves two fundamental steps to achieve superhydrophobicity: surface roughness increase and surface energy reduction. However, existing methods, such as time-consuming processes and toxic organic precursors, still face challenges. In this study, we propose a method for superhydrophobic surface modification using lasers, aiming to create roughness in micro/nanostructures, ensuring durability while improving the production time and ease of fabrication. The mechanical durability of superhydrophobic samples treated with lasers is comparatively evaluated against chemical etching samples. The experimental results demonstrate superior mechanical durability through the laser treatment. Therefore, this research provides an effective and practical approach to superhydrophobic surface modification, highlighting the utility of laser treatment.

• Restorative Dentistry and Endodontics
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• v.36 no.4
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• pp.280-289
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• 2011

Objectives: The purpose of this study was to evaluate ${\mu}TBS$ (microtensile bond strength) of current dentin bonding adhesives which have different hydrophobicity with low-shrinkage silorane resin. Materials and Methods: Thirty-six human third molars were used. Middle dentin was exposed. The teeth were randomly assigned to nine experimental groups: Silorane self-etch adhesives (SS), SS + phosphoric acid etching (SS + pa), Adper easy bond (AE), AE + Silorane system bonding (AE + SSb), Clearfil SE bond (CSE), CSE + SSb, All-Bond 2 (AB2), AB2 + SSb, All-Bond 3 (AB3). After adhesive's were applied, the clinical crowns were restored with Filtek LS (3M ESPE). The 0.8 mm ${\times}$ 0.8 mm sticks were submitted to a tensile load using a Micro Tensile Tester (Bisco Inc.). Water sorption was measured to estimate hydrophobicity adhesives. Results: ${\mu}TBS$ of silorane resin to 5 adhesives: SS, 23.2 MPa; CSE, 19.4 MPa; AB3, 30.3 MPa; AB2 and AE, no bond. Additional layering of SSb: CSE + SSb, 26.2 MPa; AB2 + SSb, 33.9 MPa; AE + SSb, no bond. High value of ${\mu}TBS$ was related to cohesive failure. SS showed the lowest water sorption. AE showed the highest solubility. Conclusions: The hydrophobicity of adhesive increased, and silorane resin bond-strength was also increased. Additional hydrophobic adhesive layer did not increase the bond-strength to silorane resin except AB2 + SSb. All-Bond 3 showed similar ${\mu}TBS$ & water sorption with SS. By these facts, we could reach a conclusion that All-Bond 3 is a competitive adhesive which can replace the Silorane adhesive system.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.431-432
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• 2012

In the era of 20 nm scaled semiconductor volume manufacturing, Microelectronics Manufacturing Engineering Education is presented in this paper. The purpose of microelectronic engineering education is to educate engineers to work in the semiconductor industry; it is therefore should be considered even before than technology development. Three Microelectronics Manufacturing Engineering related courses are introduced, and how undergraduate students acquired hands-on experience on Microelectronics fabrication and manufacturing. Conventionally employed wire bonding was recognized as not only an additional parasitic source in high-frequency mobile applications due to the increased inductance caused from the wiring loop, but also a huddle for minimizing IC packaging footprint. To alleviate the concerns, chip bumping technologies such as flip chip bumping and pillar bumping have been suggested as promising chip assembly methods to provide high-density interconnects and lower signal propagation delay [1,2]. Aluminum as metal interconnecting material over the decades in integrated circuits (ICs) manufacturing has been rapidly replaced with copper in majority IC products. A single copper metal layer with various test patterns of lines and vias and $400{\mu}m$ by $400{\mu}m$ interconnected pads are formed. Mask M1 allows metal interconnection patterns on 4" wafers with AZ1512 positive tone photoresist, and Cu/TiN/Ti layers are wet etched in two steps. We employed WPR, a thick patternable negative photoresist, manufactured by JSR Corp., which is specifically developed as dielectric material for multi- chip packaging (MCP) and package-on-package (PoP). Spin-coating at 1,000 rpm, i-line UV exposure, and 1 hour curing at $110^{\circ}C$ allows about $25{\mu}m$ thick passivation layer before performing wafer level soldering. Conventional Si3N4 passivation between Cu and WPR layer using plasma CVD can be an optional. To practice the board level flip chip assembly, individual students draw their own fan-outs of 40 rectangle pads using Eagle CAD, a free PCB artwork EDA. Individuals then transfer the test circuitry on a blank CCFL board followed by Cu etching and solder mask processes. Negative dry film resist (DFR), Accimage$^{(R)}$, manufactured by Kolon Industries, Inc., was used for solder resist for ball grid array (BGA). We demonstrated how Microelectronics Manufacturing Engineering education has been performed by presenting brief intermediate by-product from undergraduate and graduate students. Microelectronics Manufacturing Engineering, once again, is to educating engineers to actively work in the area of semiconductor manufacturing. Through one semester senior level hands-on laboratory course, participating students will have clearer understanding on microelectronics manufacturing and realized the importance of manufacturing yield in practice.

• Korean Journal of Materials Research
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• v.16 no.4
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• pp.225-230
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• 2006

Nanoimprint lithography (NIL) is a novel method of fabricating nanometer scale patterns. It is a simple process with low cost, high throughput and resolution. NIL creates patterns by mechanical deformation of an imprint resist and physical contact process. The imprint resist is typically a monomer or polymer formulation that is cured by heat or UV light during the imprinting process. Stiction between the resist and the stamp is resulted from this physical contact process. Stiction issue is more important in the stamps including narrow pattern size and wide area. Therefore, the antistiction layer coating is very effective to prevent this problem and ensure successful NIL. In this paper, an antistiction layer was deposited and characterized by PECVD (plasma enhanced chemical vapor deposition) method for metal stamps. Deposition rates of an antistiction layer on Si and Ni substrates were in proportion to deposited time and 3.4 nm/min and 2.5 nm/min, respectively. A 50 nm thick antistiction layer showed 90% relative transmittance at 365 nm wavelength. Contact angle result showed good hydrophobicity over 105 degree. $CF_2$ and $CF_3$ peaks were founded in ATR-FTIR analysis. The thicknesses and the contact angle of a 50 nm thick antistiction film were slightly changed during chemical resistance test using acetone and sulfuric acid. To evaluate the deposited antistiction layer, a 50 nm thick film was coated on a stainless steel stamp made by wet etching process. A PMMA substrate was successfully imprinting without pattern degradations by the stainless steel stamp with an antistiction layer. The test result shows that antistiction layer coating is very effective for NIL.

• Restorative Dentistry and Endodontics
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• v.28 no.1
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• pp.1-10
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• 2003

This study investigated the influence of IRM on marginal microleakage of 5th generation adhesives. Class V cavities with gingival margins in dentin were prepared on both buccal and lingual surfaces of 60 extract-ed human molar teeth. Prepared teeth were randomly divided into six groups. Group 1 and 4 received no temporary restoration with IRM. Group 2 and 5 were covered with IRM mixed at P/L ratio(10g/1g). Group 3 and 6 were covered with IRM mixed at P/L ratio(10g/2g). The temporary restorations were removed mechanically with an ultrasonic scaler after one-week storage in distilled water. The cavities were restored using one of two adhesives and composites ; Single Bond/Filtek Z 250(Croup 1, 2 and 3), UniFil Bond/UniFil F(Group 4, 5 and 6). Following one day storage in distilled water, the restored teeth were thermocycled for 500 cycles(between $5^{\circ}C{\;}and{\;}55^{\circ}C$) and immersed in 2 % methylene blue for dye penetration testing. The results were analysed using Kruskal-Wallis Test, Mann-Whitney and Wilcoxon signed ranked test at a significance level of 0.05. The results of this study were as follows 1. Ranking of mean microleakage scores at the enamel margins was Group 10.05) 4. At the dentin margins, the microleakage of the group not pretreated with IRM was lower than that of the group pretreated with IRM. And the microleakage of UniFil Bond was lower than that of Single Bond. 5. Compared with microleakages between the enamel and dentin margins of each groups, Group 1, 2, 3, 4, 5 and 6 at dentin margin were higher microleakage than those at enamel margin. There were significant difference between enamel and dentin microleakage of Group 2 and 3(p<0.05).

• Journal of Dental Rehabilitation and Applied Science
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• v.34 no.1
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• pp.1-9
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• 2018

Purpose: The purpose of this study is to investigate the effect of the titanium implant soaked in saline after RBM and acid etched surface treatment on the initial osseointegration by comparing the removal torque and the surface analysis compared to the titanium implant with only RBM and acid etched surface treatment. Materials and Methods: The control group was RBM and acid etched surface treated implants (RBM + HCl), and the test group was implants soaked in saline for 2 weeks after RBM and acid etched surface treatment (RBM + HCl + Sal). The control and test group implants were placed in the left and right tibiae of 10 rabbits, respectively, and at the same time, the insertion torque (ITQ) was measured. After 10 days, the removal torque (RTQ) was measured by exposing the implant site. FE-SEM, EDS, Surface roughness and Raman spectroscopy were performed for the surface analysis of the new implant specimens used in the experiments. Results: There was significant difference in insertion torque and removal torque between control group and experimental group (P = 0.014 < 0.05). Surface roughness of experimental group is higher than control group. Conclusion: Saline soaking after RBM and acid etched surface treatment of titanium implants were positively affect the initial osseointegration as compared to titanium implants with only RBM and acid etched surface treatment.

• The Journal of Korean Academy of Prosthodontics
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• v.46 no.2
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• pp.148-156
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• 2008

Statement of problems: Self-etch adhesives exhibit some clinical benefits such as ease of manipulation and reduced technique-sensitivity. Nevertheless, some concern remains regarding the bonding effectiveness of self-etch adhesives to enamel, in particular when so-called 'mild' self-etch adhesives are employed. This study compared the microtensile bond strengths to ground enamel of the two-step self-etch adhesive Clearfil SE Bond (Kuraray) to the three-step etch-and- rinse adhesive Scotchbond Multi-Purpose (3M ESPE) and the one-step self-etch adhesive iBond (Heraeus Kulzer). Purpose: The purpose of this study was to determine the effect of a preceding phosphoric acid conditioning step on the bonding effectiveness of a two-step self-etch adhesive to ground enamel. Material and methods: The two-step self-etch adhesive Clearfil SE Bond non-etch group, Clearfil SE Bond etch group with prior 35% phosphoric acid etching, and the one-step self-etch adhesive iBond group were used as experimental groups. The three-step etch-and-rinse adhesive Scotchbond Multi-Purpose was used as a control group. The facial surfaces of bovine incisors were divided in four equal parts cruciformly, and randomly distributed into each group. The facial surface of each incisor was ground with 800-grit silicon carbide paper. Each adhesive group was applied according to the manufacturer's instructions to ground enamel, after which the surface was built up using Light-Core (Bisco). After storage in distilled water at $37^{\circ}C$ for 1 week, the restored teeth were sectioned into enamel beams approximately 0.8*0.8mm in cross section using a low speed precision diamond saw (TOPMET Metsaw-LS). After storage in distilled water at $37^{\circ}C$ for 1 month, 3 months, microtensile bond strength evaluations were performed using microspecimens. The microtensile bond strength (MPa) was derived by dividing the imposed force (N) at time of fracture by the bond area ($mm^2$). The mode of failure at the interface was determined with a microscope (Microscope-B nocular, Nikon). The data of microtensile bond strength were statistically analyzed using a one-way ANOVA, followed by Least Significant Difference Post Hoc Test at a significance level of 5%. Results: The mean microtensile bond strength after 1 month of storage showed no statistically significant difference between all adhesive groups (P>0.05). After 3 months of storage, adhesion to ground enamel of iBond was not significantly different from Clearfil SE Bond etch (P>>0.05), while Clearfil SE Bond non-etch and Scotchbond Multi-Purpose demonstrated significantly lower bond strengths (P<0.05), with no significant differences between the two adhesives. Conclusion: In this study the microtensile bond strength to ground enamel of two-step self-etch adhesive Clearfil SE Bond was not significantly different from three-step etch-and-rinse adhesive Scotchbond Multi-Purpose, and prior etching with 35% phosphoric acid significantly increased the bonding effectiveness of Clearfil SE Bond to enamel at 3 months.