• 공업화학
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• 제22권2호
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• pp.230-234
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• 2011

반도체산업은 고집적화된 회로를 요구하면서 미세 패턴을 형성하기 위해 계속해서 발전해가고 있다. 이에 반도체 산업에서 미세 패턴을 형성하기 위하여 하드마스크를 도입하여 사용되고 있다. 일반적으로 하드마스크는 화학증기증착법(CVD) 공정을 이용하여 다층구조로 제작된다. 이에 본 연구에서는 스핀공정이 가능하고 단층의 하드마스크용 조성물을 제조하기 위하여 유-무기 하이브리드 중합체를 이용하여 그 특성에 대하여 연구하였다. Silanol로 처리된 siloxane 화합물과 acetonide 그룹을 가지는 propionic acid를 에스터화 반응을 통하여 얻은 유-무기 하이브리드 중합체에 가교제 및 첨가제들의 첨가로 광학적, 열적, 그리고 표면 특성이 조절된 하드마스크 막을 제조하였다. 또한 하드마스크 막과 감광층의 식각비를 비교하여 유-무기 소재의 하이브리드 중합체에 대해 미세패턴을 형성시킬 수 있는 하드마스크 막으로써의 유용성을 확인하였다.

• 한국안전학회지
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• 제35권6호
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• pp.85-92
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• 2020

Wet Scrubber reacts the incoming pollutant gas with cleaning water (water + absorbent) to absorb pollutants and release the clean air to the atmosphere. Wet scrubbers and packed tower scrubbers using this principle are widely used in businesses that emit acid gases. In particular, in the etching process using hydrochloric acid (HCl), alkaline washing water (NaOH) having a pH of about 8 to 11 is used to absorb a large amount of acid gas. However, These salts are attached to the injection nozzle (nozzle), filling material (packing), and the demister (Demister), causing air pollution, human damage, and inoperability due to clogging and acid gas discharge. Therefore, In this study, an improvement plan was proposed to manage the washing water with pH 3~4 acidic washing water. The test method takes samples from the Wet Scrubber flue measurement laboratory twice a month for 1 year. Hydrogen chloride (HCl) concentration (ppm) was measured, and nozzle clogging and scale conditions were measured, compared, and analyzed through a differential pressure gauge and a pressure gauge. As a result of the check, it was visually confirmed that the scale was reduced to 50% or less in the spray nozzle, filler, and demister. In addition, the emission limit of hydrogen chloride in accordance with the Enforcement Regulation of the Air Quality Conservation Act [Annex 8] met 3 ppm or less. Therefore, even if the washing water is operated in an acidic pH range of 3 to 4, it is expected to reduce air pollution and human damage due to clogging of internal parts, and it is expected to reduce maintenance costs such as regular cleaning or replacement of parts.

• 한국포장학회지
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• 제29권3호
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• pp.223-228
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• 2023

Sustainable energy supplies without the recharging and replacement of the charge storage device have become increasingly important. Among various energy harvesters, the triboelectric nanogenerator (TENG) has attracted considerable attention due to its high instantaneous output power, broad selection of available materials, eco-friendly and inexpensive fabrication process, and various working modes customized for target applications. In this study, the amount of voltage and current generated was measured by applying the PSD profile random vibration test of the electronic vibration tester and ISTA 3A according to the time of Anodized Aluminum Oxide (AAO) pore widening of the manufactured TENG device Teflon and AAO. The discharge and charging tests of the integrated module during the random simulated transport environment and the recognition distance of RFID were measured while agricultural products (onion) were loaded into the returnable folding plastic box. As a result, it was found that AAO alumina etching processing time to maximize TENG performance was optimal at 31 min in terms of voltage and current generation, and the integrated module applied with the TENG module showed a charging effect even during the continuous use of RFID, so the voltage was kept constant without discharge. In addition, the RFID recognition distance of the integrated module was measured as a maximum of 1.4 m. Therefore, it was found that the surface condition of AAO, a TENG element, has a great influence on the power generation of the integrated module, and due to the characteristics of TENG, the power generation increases as the surface dries, so it is judged that the power generation can be increased if the surface drying treatment (ozone treatment, etc.) of AAO is applied in the future.

• Tribology and Lubricants
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• 제40권3호
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• pp.91-96
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• 2024

Recently, extensive studies have been carried out to enhance various performance aspects such as the durability, lifespan, and hardness by combining diverse materials or developing novel materials. The utilization of superhydrophobic surfaces, particularly in the automotive, textile, and medical device industries, has gained momentum to achieve improved performance and efficiency. Superhydrophobicity refers to a surface state where the contact angle when water droplets fall is above 150°, while the contact angle during sliding motion is smaller than 10°. Superhydrophobic surfaces offer the advantage of water droplets not easily sliding off, maintaining a cleaner state as the droplets leave the surface. Surface modification involves two fundamental steps to achieve superhydrophobicity: surface roughness increase and surface energy reduction. However, existing methods, such as time-consuming processes and toxic organic precursors, still face challenges. In this study, we propose a method for superhydrophobic surface modification using lasers, aiming to create roughness in micro/nanostructures, ensuring durability while improving the production time and ease of fabrication. The mechanical durability of superhydrophobic samples treated with lasers is comparatively evaluated against chemical etching samples. The experimental results demonstrate superior mechanical durability through the laser treatment. Therefore, this research provides an effective and practical approach to superhydrophobic surface modification, highlighting the utility of laser treatment.

• Restorative Dentistry and Endodontics
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• 제36권4호
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• pp.280-289
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• 2011

연구목적: 본 연구의 목적은 다양한 소수성을 지닌 최신 상아질 접착시스템과 저수축 silorane 레진의 미세인장결합강도를 평가하는 것이다. 연구 재료 및 방법: 36개의 갓 발치된 제3대구치를 이용했다. Low-speed diamond saw를 사용하여 교합면에 평행하게 치관을 잘라 middle dentin을 노출시켰다. 치아를 무작위로 9 group으로 나눴다. Silorane self-etch adhesives (SS), SS + phosphoric acid etching (SS + pa), Adper Easy bond (AE), AE + Silorane system bonding (AE + SSb), Clearfil SE bond (CSE), CSE + SSb, All-Bond 2 (AB2), AB2 + SSb, All-Bond 3 (AB3). 접착제를 적용한 후에 Filtek LS (3M ESPE)를 2 mm씩 3회 적층충전하였다. 각 층은 40s씩 광중합하였다. 0.8 mm ${\times}$ 0.8 mm stick을 Micro Tensile Tester로 1 mm/min cross-head speed의 인장력을 가하였다. 파절양상를 관찰하기 위해 광학현미경을 이용하였다. 5가지 접착제의 소수성정도를 결정하기위해 water sorption test하였다. 결과: silorane 레진과 5가지 접착제의 ${\mu}TBS$: SS, 23.2 ${\pm}$ 6.9 MPa; CSE, 19.4 ${\pm}$ 4.4 MPa; AB3, 30.3 ${\pm}$ 4.0 MPa; AB2와 AE, no bond. Additional layering of SSb: CSE + SSb, 26.2 ${\pm}$ 10.3 MPa; AB2 + SSb, 33.9 ${\pm}$ 7.3 MPa; AE + SSb, no bond. 높은 ${\mu}TBS$는 cohesive failure와 관련있었다. SS는 낮은 가장 낮은 water sorption을 보였고 다음으로 AB3, AE, CSE, AB2 순서였다. AE는 가장 높은 용해도를 나타냈고 다음으로 CSE, AB2였다. 결론: 접착제의 소수성이 증가할수록, silorane 레진의 접착강도도 증가하였다. 비전용접착제 위에 silorane adhesive bonding을 layering하는 것은 AB2 + SSb 그룹에서만 결합강도를 유의하게 증가시켰다. AB3는 SS와 유사한 ${\mu}TBS$ & water sorption을 나타냈다. 따라서 AB3는 siloran resin을 접착시키는데 SS를 대체할만한 경쟁력있는 접착제이다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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• pp.431-432
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• 2012

In the era of 20 nm scaled semiconductor volume manufacturing, Microelectronics Manufacturing Engineering Education is presented in this paper. The purpose of microelectronic engineering education is to educate engineers to work in the semiconductor industry; it is therefore should be considered even before than technology development. Three Microelectronics Manufacturing Engineering related courses are introduced, and how undergraduate students acquired hands-on experience on Microelectronics fabrication and manufacturing. Conventionally employed wire bonding was recognized as not only an additional parasitic source in high-frequency mobile applications due to the increased inductance caused from the wiring loop, but also a huddle for minimizing IC packaging footprint. To alleviate the concerns, chip bumping technologies such as flip chip bumping and pillar bumping have been suggested as promising chip assembly methods to provide high-density interconnects and lower signal propagation delay [1,2]. Aluminum as metal interconnecting material over the decades in integrated circuits (ICs) manufacturing has been rapidly replaced with copper in majority IC products. A single copper metal layer with various test patterns of lines and vias and $400{\mu}m$ by $400{\mu}m$ interconnected pads are formed. Mask M1 allows metal interconnection patterns on 4" wafers with AZ1512 positive tone photoresist, and Cu/TiN/Ti layers are wet etched in two steps. We employed WPR, a thick patternable negative photoresist, manufactured by JSR Corp., which is specifically developed as dielectric material for multi- chip packaging (MCP) and package-on-package (PoP). Spin-coating at 1,000 rpm, i-line UV exposure, and 1 hour curing at $110^{\circ}C$ allows about $25{\mu}m$ thick passivation layer before performing wafer level soldering. Conventional Si3N4 passivation between Cu and WPR layer using plasma CVD can be an optional. To practice the board level flip chip assembly, individual students draw their own fan-outs of 40 rectangle pads using Eagle CAD, a free PCB artwork EDA. Individuals then transfer the test circuitry on a blank CCFL board followed by Cu etching and solder mask processes. Negative dry film resist (DFR), Accimage$^{(R)}$, manufactured by Kolon Industries, Inc., was used for solder resist for ball grid array (BGA). We demonstrated how Microelectronics Manufacturing Engineering education has been performed by presenting brief intermediate by-product from undergraduate and graduate students. Microelectronics Manufacturing Engineering, once again, is to educating engineers to actively work in the area of semiconductor manufacturing. Through one semester senior level hands-on laboratory course, participating students will have clearer understanding on microelectronics manufacturing and realized the importance of manufacturing yield in practice.

• 한국재료학회지
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• 제16권4호
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• pp.225-230
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• 2006

Nanoimprint lithography (NIL) is a novel method of fabricating nanometer scale patterns. It is a simple process with low cost, high throughput and resolution. NIL creates patterns by mechanical deformation of an imprint resist and physical contact process. The imprint resist is typically a monomer or polymer formulation that is cured by heat or UV light during the imprinting process. Stiction between the resist and the stamp is resulted from this physical contact process. Stiction issue is more important in the stamps including narrow pattern size and wide area. Therefore, the antistiction layer coating is very effective to prevent this problem and ensure successful NIL. In this paper, an antistiction layer was deposited and characterized by PECVD (plasma enhanced chemical vapor deposition) method for metal stamps. Deposition rates of an antistiction layer on Si and Ni substrates were in proportion to deposited time and 3.4 nm/min and 2.5 nm/min, respectively. A 50 nm thick antistiction layer showed 90% relative transmittance at 365 nm wavelength. Contact angle result showed good hydrophobicity over 105 degree. $CF_2$ and $CF_3$ peaks were founded in ATR-FTIR analysis. The thicknesses and the contact angle of a 50 nm thick antistiction film were slightly changed during chemical resistance test using acetone and sulfuric acid. To evaluate the deposited antistiction layer, a 50 nm thick film was coated on a stainless steel stamp made by wet etching process. A PMMA substrate was successfully imprinting without pattern degradations by the stainless steel stamp with an antistiction layer. The test result shows that antistiction layer coating is very effective for NIL.

• Restorative Dentistry and Endodontics
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• 제28권1호
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• pp.1-10
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• 2003

This study investigated the influence of IRM on marginal microleakage of 5th generation adhesives. Class V cavities with gingival margins in dentin were prepared on both buccal and lingual surfaces of 60 extract-ed human molar teeth. Prepared teeth were randomly divided into six groups. Group 1 and 4 received no temporary restoration with IRM. Group 2 and 5 were covered with IRM mixed at P/L ratio(10g/1g). Group 3 and 6 were covered with IRM mixed at P/L ratio(10g/2g). The temporary restorations were removed mechanically with an ultrasonic scaler after one-week storage in distilled water. The cavities were restored using one of two adhesives and composites ; Single Bond/Filtek Z 250(Croup 1, 2 and 3), UniFil Bond/UniFil F(Group 4, 5 and 6). Following one day storage in distilled water, the restored teeth were thermocycled for 500 cycles(between $5^{\circ}C{\;}and{\;}55^{\circ}C$) and immersed in 2 % methylene blue for dye penetration testing. The results were analysed using Kruskal-Wallis Test, Mann-Whitney and Wilcoxon signed ranked test at a significance level of 0.05. The results of this study were as follows 1. Ranking of mean microleakage scores at the enamel margins was Group 10.05) 4. At the dentin margins, the microleakage of the group not pretreated with IRM was lower than that of the group pretreated with IRM. And the microleakage of UniFil Bond was lower than that of Single Bond. 5. Compared with microleakages between the enamel and dentin margins of each groups, Group 1, 2, 3, 4, 5 and 6 at dentin margin were higher microleakage than those at enamel margin. There were significant difference between enamel and dentin microleakage of Group 2 and 3(p<0.05).

• 구강회복응용과학지
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• 제34권1호
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• pp.1-9
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• 2018

목적: Resorbable blasting media (RBM) 표면처리 후 산처리한 티타늄 임플란트와 동일한 표면처리 후 생리식염수에 적신 티타늄 임플란트에서 생리식염수에 적신 경우 초기 골유착에 미치는 영향을 제거회전력 및 표면분석을 통해서 알아보고자 하였다. 연구 재료 및 방법: 대조군은 RBM 표면처리 후 산처리된 임플란트(RBM + HCl)이고, 실험군은 대조군과 동일한 표면처리 후 생리식염수에 2주간 적신 임플란트(RBM + HCl + Sal)이다. 토끼 10마리의 좌우측 경골에 각각 대조군 및 실험군 임플란트를 식립하고, 동시에 식립회전력(ITQ)을 측정하였다. 10일 후 임플란트 식립부위를 노출시켜 제거회전력(RTQ)을 측정하였다. 실험에 사용된 임플란트 시편의 표면분석을 위해 field emission-scanning electron microscopy (FESEM), energy dispersive X-ray Spectroscopy (EDS), 표면거칠기 측정 및 Raman 분광분석을 시행하였다. 결과: RBM 표면처리 및 산처리하여 생리식염수에 적신 티타늄 임플란트에서 대조군에 비해 높은 제거회전력을 나타냈으며, 통계적으로 유의미한 값을 보였다(P = 0.014 < 0.05). 표면거칠기는 실험군에서 더 높은 거칠기를 나타냈다. 결론: 티타늄 임플란트에 RBM 표면처리 및 산처리 후 생리식염수에 적신 것이 생리식염수를 적시지 않은 것 보다 초기 골유착을 향상시키는 것으로 생각된다.

• 대한치과보철학회지
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• 제46권2호
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• pp.148-156
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• 2008

자가부식 접착제는 사용하기 쉽고, 술식 민감성이 적은 장점이 있으나 특히 산도가 약한 자가부식 접착제의 법랑질에 대한 결합력은 논란이 되고 있다. 본 연구에서는 2단계 자가부식 접착제인 Clearfil SE Bond (Kuraray, Okayama, Japan)의 연마 법랑질에 대한 미세인장 결합강도를 측정하여 3단계 산부식수세 접착제인 Scotchbond Multi-Purpose (3M ESPE, St. Paul, MN, USA) 및 1단계 자가부식 접착제인 iBond (Heraeus Kulzer Gmbh, Hanau, Germany)의 결합강도와 비교하고자 하였고, 2단계 자가부식 접착제에 산부식 전처리를 시행하는 것이 법랑질에 대한 결합강도를 높일 수 있는지 알아 보고자 하였다. 실험군은 2단계 자가부식 접착제인 Clearfil SE Bond만 사용한 비산부식 군과 35% 인산 (Scotchbond Etchant, 3M ESPE)으로 산부식 후 Clearfil SE Bond를 사용한 산부식 군, 그리고 1단계 자가부식 접착제인 iBond를 사용한 군으로 나누었다. 대조군은 3단계 산부식수세 접착제인 Scotchbond Multi-Purpose를 사용한 군으로 정하였다. Bovine 전치의 순면을 십자가형으로 4등분하여 각 군으로 무작위로 배분하였다. 각 치아의 순면을 800-grit 실리콘 카바이드 지로 연마한 후 삭제된 법랑질면에 제조사의 설명서에 따라 각 군의 접착제를 적용하고 Light-Core (Bisco)로 적층 충전하였다. 시편은 $37i{\acute{E}}$, 증류수에 일주일 동안 보관한 후 low speed precicion diamond saw (TOPMENT Metsaw-LS, R&B, Daejeon, Korea)를 이용하여 약 $0.8{\times}0.8mm$ 단면이 되도록 시편을 절단하여 미세시편을 제작하였다. 일주일마다 증류수를 교환하면서 한 달, 세 달 동안 $37i{\acute{E}}$, 증류수에 미세시 편을 보관한 후 각각의 미세인장결합강도를 측정하였다. 미세인장결합강도 (MPa)는 파절 시에 가해진 힘 (N)을 접착면적 ($mm^2$)으로 나누어 계산하였다. 접착계면에서의 파절 양상은 실물현미경 (Microscope-B nocular, Nikon)을 이용하여 분류하였다. 미세인장결합강도에 대한 통계분석은 one-way ANOVA를 이용하여 유의수준 5%에서 검정하였고, 사후감정은 Least Significant Difference 방법을 이용하였다. 중합 후 1개월 뒤 측정된 각각의 접착제의 평균 미세인장결합강도는 유의수준 5%에서 모든 접착제 간에 유의한 차이가 없었다. 3개월 뒤 측정된 각각의 접착제의 평균 미세인장결합강도는 유의수준 5%에서 iBond 와 Clearfil SE Bond 비산부식 군과 Scotchbond Multi- Purpose 간에는 각각 유의한 차이가 없었다. 본 연구에서는 2단계 자가부식 접착제인 Clearfil SE Bond의 연마 법랑질에 대한 미세인장결합강도가 3단계 산부식수세 접착제인 Scotchbond Multi-Purpose 와 비교하여 유의한 차이가 없었으며 (P>0.05), 3개월 후의 결과에서 Clearfil SE Bond 비산부식 군의 미세인장결합강도가 Clearfil SE Bond 산부식 군보다 유의하게 낮았다 (P<0.05). 즉 35% 인산으로 산부식 전처리를 시행한결과 Clearfil SE Bond 의 법랑질에 대한 결합강도가 증가하였다.