• Polymer(Korea)
• /
• v.28 no.5
• /
• pp.391-396
• /
• 2004

In order to overcome drawbacks in the conventional preparation of epoxy/silica nanocomposites, such as formation of micro voids and dimensional instability caused by evolution of volatile by-products during curing reaction, a novel preparation method using Si-N precursor has been proposed. When prepared through in-situ reaction of epoxy curing reaction with sol-gel reaction of Si-N precursor, methyltripiperidinylsilane (MTPS) which does not produce by-products during reaction, epoxy/silica nanocomposites of extremely even dispersion of inorganic phase could be successfully prepared, resulting in high enhancement of mechanical and thermal properties as well as outstanding transparency.

• Conservation Science in Museum
• /
• v.26
• /
• pp.1-12
• /
• 2021

The bisphenol A epoxy resin currently used for the conservation of stone cultural heritage items is known to suffer from yellowing discoloration. In order to mitigate this yellowing and explore the availability of more diverse materials for the conservation of stone cultural heritage items, a hydrogenated Bisphenol A-based epoxy resin was prepared and compared with the epoxy resin currently used in the conservation treatment of stone cultural heritage items. The newly prepared epoxy resin showed improved physical properties relative to the existing materials, especially in terms of tensile strength, adhesion, and machinability, while the yellowing discoloration was reduced by a factor of roughly five to eight. The results suggest that epoxy resin could be used as a stable material for the conservation treatment of stone cultural heritage items, most of which are located outdoors.

• Bulletin of the Korean Chemical Society
• /
• v.22 no.4
• /
• pp.424-426
• /
• 2001

• Bulletin of the Korean Chemical Society
• /
• v.22 no.12
• /
• pp.1393-1396
• /
• 2001

• Elastomers and Composites
• /
• v.57 no.2
• /
• pp.48-54
• /
• 2022

A polymeric adhesion promoter was synthesized to improve the adhesive strength of the Ni lead frame/epoxy composite. Poly(itaconic acid-co-acrylamide) (IAcAAM) was prepared by copolymerizing itaconic acid and acrylamide. We compared the adhesive strength between the Ni lead frame and epoxy composite according to the molecular weight of IAcAAM. The molecular weight of IAcAAM was controlled using an initiator, which made it possible to use IAcAAM in the epoxy molding compound (EMC) manufacturing process by modulating the melting temperature. The adhesive strength of Ni lead frame/epoxy composite increased with the addition of IAcAAM to the epoxy composite. In addition, as the molecular weight of IAcAAM increased, the adhesive strength of the Ni lead frame/epoxy composite slightly increased. We confirmed that IAcAAM with an appropriate molecular weight can be used in the EMC manufacturing process and increase the adhesive strength of the Ni lead frame/epoxy composite.

• Proceedings of the Korean Institute of Building Construction Conference
• /
• 2013.05a
• /
• pp.305-307
• /
• 2013

In this paper, we test and evaluate in terms of workability the epoxy resin mortar and the EVA powder resin mortar used on the concrete structures. The initial viscosity of the epoxy resin mortar is lower than the EVA powder mortar, but after 20 minutes work can not be rapidly increased to 40 minutes. In the other hand, the EVA powder resin mortar is able to measure of viscosity for the past 40 minutes. In the flow test for evaluate workability, the flow of the epoxy resin mortar is rapidly decreased from 230 to 100 in the 90 minutes, but the flow of the EVA powder resin mortar is reduced to 198 to 175 that there is no significant change. In the coverage test of the pinhole on the concrete surface, the EVA powder mortar appears coverage in the all pinhole size but the epoxy resin mortar is not concealed from 2mm pinhole size.

• Restorative Dentistry and Endodontics
• /
• v.42 no.1
• /
• pp.27-33
• /
• 2017

Objectives: To determine the optimal timing for post space preparation of root canals sealed with epoxy resin-based AH Plus sealer in terms of its polymerization and influence on apical leakage. Materials and Methods: The epoxy polymerization of AH Plus (Dentsply DeTrey) as a function of time after mixing (8, 24, and 72 hours, and 1 week) was evaluated using Fourier transform infrared (FTIR) spectroscopy and microhardness measurements. The change in the glass transition temperature ($T_g$) of the material with time was also investigated using differential scanning calorimetry (DSC). Fifty extracted human single-rooted premolars were filled with gutta-percha and AH Plus, and randomly separated into five groups (n = 10) based on post space preparation timing (immediately after root canal obturation and 8, 24, and 72 hours, and 1 week after root canal obturation). The extent of apical leakage (mm) of the five groups was compared using a dye leakage test. Each dataset was statistically analyzed by one-way analysis of variance and Tukey's post hoc test (${\alpha}=0.05$). Results: Continuous epoxy polymerization of the material with time was observed. Although the $T_g$ values of the material gradually increased with time, the specimens presented no clear $T_g$ value at 1 week after mixing. When the post space was prepared 1 week after root canal obturation, the leakage was significantly higher than in the other groups (p < 0.05), among which there was no significant difference in leakage. Conclusions: Poor apical seal was detected when post space preparation was delayed until 1 week after root canal obturation.

• Bulletin of the Korean Chemical Society
• /
• v.27 no.10
• /
• pp.1542-1548
• /
• 2006

Maleimide modified epoxy compounds were prepared by reacting N-(4-hydroxyphenyl) maleimide (HPM) with diglycidylether of bisphenol-A. Triphenylphosphine was used as catalyst and methylethylketone as solvent. The resulting compound possessed both the oxirane ring and maleimide group. The curing reaction of the maleimide epoxy compound with amine curing agents such as 1-(2-aminoethyl) piperazine (AEP) and 5-amino-1,3,3-trimethylcyclohexane methylamine isophorone diamine, IPDA) were studied. Incorporation of maleimide groups in the epoxy resin provides cyclic imide structure and high cross-linking density to the cured resins. The cured samples were found to have good thermal stability, chemical resistance (acid/alkali/solvent) and water absorption resistance.

• Journal of the Korean institute of surface engineering
• /
• v.53 no.1
• /
• pp.29-35
• /
• 2020

In this study, five different specimen preparation methods were introduced and their advantages and disadvantages were presented. One of them, an epoxy mounting method has advantages of constant exposure area, ease of surface preparation without touching the specimen surface during polishing or cleaning, use of small amount of material and ease of specimen reuse by polishing or etching. However, in order to eliminate unexpected errors resulting from preferable reaction at the specimen/epoxy interface and contact resistance between the specimen and copper conducting line for electrical connection, it is recommended to cover the wall side of the specimen with porous anodic oxide films and to remain the contact resistance lower than 1 ohm. The increased contact resistance between the specimen and Cu conducting line appeared to result in increases of anodizing voltage and solution temperature during anodizing by which thickness and hardness of anodizing film on Al2024 alloy were drastically decreased and color of the films became more brightened.

• Textile Coloration and Finishing
• /
• v.24 no.2
• /
• pp.145-151
• /
• 2012

Polymer alloys of poly(ethylene terephthalate)(PET) and nylon6(PA6) which were not miscible each other by themselves were successfully prepared through melt compounding using a twin-screw extruder by utilizing epoxy as reactive compatibilizer. At the epoxy(DGEBA) amount of 0.5~2wt%, the domain size(average diameter) of the discontinuous phase could be reduced up to 0.2${\mu}m$ from 1-5${\mu}m$ that of the simple blend without epoxy. The reaction was presumed to happen mostly at interphase from the result of maximum increase of melt viscosity at the middle range of PET/PA6 blend ratio. It is expected that alloy fibers of PET/epoxy/PA6 with enough mechanical strength for use can be prepared.