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http://dx.doi.org/10.5012/bkcs.2006.27.10.1542

Preparation and Curing Studies of Maleimide Bisphenol-A Based Epoxy Resins  

Nanjunda Gowda, Shivananda Kammasandra (Department of Studies in Chemistry, Central College Campus, Bangalore University)
Mahendra, Kadidal Nagappa (Department of Studies in Chemistry, Central College Campus, Bangalore University)
Publication Information
Bulletin of the Korean Chemical Society / v.27, no.10, 2006 , pp. 1542-1548 More about this Journal
Abstract
Maleimide modified epoxy compounds were prepared by reacting N-(4-hydroxyphenyl) maleimide (HPM) with diglycidylether of bisphenol-A. Triphenylphosphine was used as catalyst and methylethylketone as solvent. The resulting compound possessed both the oxirane ring and maleimide group. The curing reaction of the maleimide epoxy compound with amine curing agents such as 1-(2-aminoethyl) piperazine (AEP) and 5-amino-1,3,3-trimethylcyclohexane methylamine isophorone diamine, IPDA) were studied. Incorporation of maleimide groups in the epoxy resin provides cyclic imide structure and high cross-linking density to the cured resins. The cured samples were found to have good thermal stability, chemical resistance (acid/alkali/solvent) and water absorption resistance.
Keywords
Epoxy resin; Maleimide;
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