• 한국재료학회지
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• 제15권1호
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• pp.1-5
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• 2005

Copper-based leadframe sheets were immersed in two kinds of hot alkaline solutions to form brown-oxide or black-oxide layer on the surface. The oxide-coated leadframe sheets were molded with epoxy molding compound (EMC). After post mold curing, the oxide-coated EMC-leadframe joints were machined to form sandwiched double-cantilever beam (SDCB) specimens. The SDCB specimens were used to measure the fracture toughness of the EMC/leadframe interfaces under quasi-Mode I loading conditions. Fracture surfaces were analyzed by various equipment to investigate failure path. The present paper deals with the failure path, and the cause of the failure path formation with an adhesion model will be treated in the succeeding paper.

• 한국재료학회지
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• 제15권1호
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• pp.6-13
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• 2005

Copper based leadframe sheets were immersed in two kinds of hot alkaline solutions to form brown-oxide or blackoxide layer on the surface. The oxide-coated leadframe sheets were molded with epoxy molding compound (EMC). After post mold curing, the oxide-coated EMC-leadframe joints were machined to form sandwiched double-cantilever beam (SDCB) specimens. The SDCB specimens were used to measure the fracture toughness of the EMC/leadframe interfaces under quasi-Mode I loading conditions. After fracture toughness testing, the fracture surface were analyzed by various equipment to investigate failure path. An adhesion model was suggested to explain the failure path formation. The adhesion model is based on the strengthening mechanism of fiber-reinforced composite. The present paper deals with the introduction of the adhesion model. The explanation of the failure path with the proposed adhesion model was introduced in the companion paper.

• 대한기계학회논문집
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• 제18권8호
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• pp.2158-2166
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• 1994

In order to understand the package crack emanating from the edge of leadframe after the delamination between leadframe and epoxy molding compound in an electronic packaging of surface mounting type, the M-integral and J-integral in fracture mechanics are obtained. The effects of geometry, material properties and molding process temperature on the package crack are investigated taking into account the temperature dependence of the material properties, which simulates a more realistic condition. If the temperature dependence of the material properties is considered the result of analysis conforms with observations that the crack is kinked at between 50 and 65 degree. However, in case of constant material properties at the room temperature it is found that the J-integral is underestimated and the kink crack angle is different form the observation. The effects of the material properties and molding process temperature on J-integral and crack angle are less significant that the chip size for the cases considered here. It is suggested that the geometric factors such as ship size, leadframe size are to be well designed in order to prevent(or control) the occurrence and propagation of the package crack.

• 대한기계학회논문집
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• 제18권8호
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• pp.2139-2157
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• 1994

In order to understand the delamination between leadframe and epoxy molding compound in an electronic packaging of surface mounting type, the stress intensity factor, T-stress and J-integral in fracture mechanics are obtained. The effects of geometry, material properties and molding process temperature on the delamination are investigated taking into account the temperature dependence of the material properties, which simulates as more realistic condition. As the crack length increases the J-integral increases, which suggest that the crack propagates if it starts growing from the small size. The effects of the material properties and molding process temperature on stress intensity factor, T-stress is and J-integral are less significant than the chip size for the practical cases considered here. The T-stress is negative in all eases, which is in agreement with observation that interfacial crack is not kinked until the crack approaches the edge of the leadframe.

• 한국정밀공학회지
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• 제22권11호
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• pp.165-172
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• 2005

In MEMS (Micro-Electro-Mechanical System), packaging induced stress or stress induced structure deformation becomes increasing concerns since it directly affects the performance of the device. In the decoupled vibratory MEMS gyroscope, the main factor that determines the yield rate is the frequency difference between the sensing and driving modes. The gyroscope, packaged using the anodic bonding at the wafer level and EMC (epoxy molding compound) molding, has a deformation of MEMS structure caused by thermal expansion mismatch. This effect results in large distribution in the frequency difference, and thereby a lower yield rate. To improve the yield rate we propose a packaged SiOG (Silicon On Glass) process technology. It uses a silicon wafer and two glass wafers to minimize the wafer warpage. Thus the warpage of the wafer is greatly reduced and the frequency difference is more uniformly distributed. In addition. in order to increase robustness of the structure against deformation caused by EMC molding, a 'crab-leg' type spring is replaced with a semi-folded spring. The results show that the frequency shift is greatly reduced after applying the semi-folded spring. Therefore we can achieve a more robust vibratory MEMS gyroscope with a higher yield rate.

• 접착 및 계면
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• 제14권3호
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• pp.135-145
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• 2013

환경친화형 반도체 봉지재로서 할로겐 화합물 등의 첨가형 난연제를 혼합하지 않고 자기소화성을 발현시키는 에폭시수지 조성물에 관해 연구하였다. 탄화수소계 방향족 공액이중결합의 구조를 갖는 에폭시수지와 페놀수지의 반응물에서 자기소화성을 갖는 낮은 연소열이 확인되었다. 본 연구에서는 탄화수소계 방향족 공액이중결합에 헤테로원자계 이중결합인 아조메틴기를 도입하여 더욱 낮은 연소열을 확인할 수 있었다. 낮은 연소열의 결과는 높은 반응열과 열전이온도 그리고 빠른 반응성과 관련이 있으며 아조메틴기의 헤테로원자 구조의 영향 때문으로 보인다.

• 유기물자원화
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• 제31권1호
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• pp.5-14
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• 2023

연구에서는 실리카/티타니아 코어/쉘(STCS) 물질을 기반으로 환원 및 에칭을 통해 근적외선 반사율을 향상시킬 수 있는 라이다 반사형 중공구조 검은색(B-HST) 물질을 제조하였다. 또한, 에칭 폐액을 수거 및 재활용하여 합성한 실리카(e-SiO₂) 물질을 반도체 에폭시 몰딩 컴파운드용(EMC) 필러 소재로서 응용하였다. 상세히는, 연속적인 졸-겔법, 환원법 및 초음파법을 통해 제조한 B-HST 물질은 높은 NIR 반사율(31.1%)과 실제 검은색 페인트와 유사한 명도(L^*=13.2)를 나타내었으며, 이를 통해 성공적으로 라이다에 인식될 수 있는 소재가 제조되었음을 확인하였다. 추가적으로, B-HST 물질의 합성 과정에서 코어 실리카를 에칭하여 추출한 실라놀 전구체를 포함하는 에칭 폐액을 수거한 뒤, 졸-겔법을 통해 균일한 필러용 실리카로 합성하였으며, 에폭시 고분자 및 카본블랙과의 혼합을 통해 반도체 패키지용 소재인 EMC로 제조하였다. 실험으로 제조된 EMC는 상용화된 EMC 제품과 유사한 물리적-화학적 특성을 나타냄을 확인할 수 있었다. 본 연구 결과를 통해 물질의 합성과 효과적인 재활용법의 설계를 통하여 4차 산업시대에 부합하는 고부가 가치 소재들인 자율주행차 차량용 검은색 물질과 반도체용 EMC 물질들을 성공적으로 제조하고 미래 산업에서의 응용 가능성에 대해 제시하였다.

• Macromolecular Research
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• 제12권1호
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• pp.78-84
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• 2004

Advanced epoxy molding compounds (EMCs) should be considered to alleviate the thermal stress problems caused by low thermal conductivity and high elastic modulus of an EMC and by the mismatch of the coefficient of thermal expansion (CTE) between an EMC and the Si-wafer. Though A1N has some advantages, such as high thermal conductivity and mechanical strength, an A1N-filled EMC could not be applied to commercial products because of its low fluidity and high modules. To solve this problem, we used 2-$\mu\textrm{m}$ fused silica, which has low porosity and spherical shape, as a small size filler in the binary mixture of fillers. When the composition of the silica in the binary filler system reached 0.3, the fluidity of EMC was improved more than twofold and the mechanical strength was improved 1.5 times, relative to the 23-$\mu\textrm{m}$ A1N-filled EMC. In addition, the values of the elastic modules and the dielectric constant were reduced to 90％, although the thermal conductivity of EMC was reduced from 4.3 to 2.5 W/m-K, when compared with the 23-$\mu\textrm{m}$ A1N-filled EMC. Thus, the A1N/silica (7/3)-filled EMC effectively meets the requirements of an advanced electronic packaging material for commercial products, such as high thermal conductivity (more than 2 W/m-K), high fluidity, low elastic modules, low dielectric constant, and low CTE.

• 한국지능정보시스템학회:학술대회논문집
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• 한국지능정보시스템학회 2001년도 The Pacific Aisan Confrence On Intelligent Systems 2001
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• pp.224-229
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• 2001

When a semiconductor package is assembled, various materials such as die attach adhesive, lead frame, EMC (Epoxy Molding Compound), and gold wire are used. For better preconditioning performance, the combination between the packaging materials by studying the compatibility of their properties as well as superior packaging material selection is important. But it is not an easy task to find proper packaging material sets, since a variety of factors like package design, substrate design, substrate size, substrate treatment, die size, die thickness, die passivation, and customer requirements should be considered. This research applies case-based reasoning(CBR) technique to solve this problem, utilizing prior cases that have been experienced. Our particular interests lie in building decision support model to aid the selection of proper die attach adhesive. The preliminary results show that this approach is promising.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2003년도 춘계학술발표강연 및 논문개요집
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• pp.72-72
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• 2003

전기 및 전자산업의 발달과 더불어 규석 관련 제품에 대하여 고기능성 초미립 분말이 요구되고 있으며, 한편으로는 취급과 활용성이 우수한 형상인 구형 분말을 요구하고 있다. 본 연구에서는 평균 입도 1.0$\mu\textrm{m}$이하의 규석 초미립 분말 제조기술 개발과 유기용매 및 계면활성제 등을 첨가하여 형상이 구형인 기능성 분말과 항균, 항곰팡이 효과가 우수한 교질 상태의 실리카를 제조하여 기능성 재료 및 코팅용 실란 등에 활용이 가능하도록 물리적 단순공정을 통하여 평균 입도 1.0$\mu\textrm{m}$이하의 초미립 규석분말을 제조함으로써 고무, 타이어, 토너, 도료, EMC(epoxy molding compound) 등의 충전제, 이형제, 연마재 등으로 활용이 가능하게 하였으며 제조된 규석 초미립 분말은 분산성이 양호하도록 spray dryer 방법으로 건조하여 각 제품에 알맞은 적용이 용이하도록 하였다.