• Transactions on Electrical and Electronic Materials
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• v.13 no.3
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• pp.153-156
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• 2012

In order to develop electrical insulation materials, epoxy/micro-silica composite (EMC) and epoxy/micro-silica/nano-silicate composite (EMNC) were prepared, and their tensile and flexural strength, AC insulation breakdown strength and thermal conductivity and thermal expansion coefficient were compared. Nano-silicate was prepared in an epoxy matrix by our AC electric field process. All properties of the neat epoxy were improved by the addition of micro-silica, which was improved much further by the addition of nano-silicate to the EMC system.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.31 no.7
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• pp.496-501
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• 2018

In this study, we prepared 40, 45, 50, 55, 60, 65, and 70 wt% content composites filled in epoxy matrix for two micro silica and three micro alumina types for use as a GIS heavy electric machine. As a filler type of epoxy composite, micro silica composites showed excellent AC breakdown strength properties compared to micro alumina composites in the case of electrical properties of micro silica and alumina. The electrical breakdown properties of micro silica composites increased with increasing filler content, whereas those of micro alumina decreased with increasing filler content. In the case of mechanical properties, the micro silica composite showed improved tensile strength and flexural strength compared with the micro alumina composite. In addition, mechanical properties such as tensile strength and flexural strength of micro silica and alumina composites decreased with increasing filler content. This is probably because O-H groups are present on the surface of silica in the case of micro silica but are not present on the surface of alumina in the case of micro alumina.

• Transactions on Electrical and Electronic Materials
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• v.16 no.2
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• pp.74-77
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• 2015

The cure kinetics of a neat epoxy system and epoxy/silica composite were investigated by DSC analysis. A cycloaliphatic type epoxy resin was diglycidyl 1,2-cyclohexanedicarboxylate and curing agent was anhydride type. To estimate kinetic parameters, the Kissinger equation was used. The activation energy of the neat epoxy system was 88.9 kJ/mol and pre-exponential factor was 2.64×10¹² min⁻¹, while the activation energy and pre-exponential factor for epoxy/silica composite were 97.4 kJ/mol and 9.21×10¹² min⁻¹, respectively. These values showed that the silica particles have effects on the cure kinetics of the neat epoxy matrix.

• Transactions on Electrical and Electronic Materials
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• v.13 no.5
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• pp.248-251
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• 2012

In order to develop a high voltage insulation material, epoxy/micro-silica composites (EMC) and epoxy/micro-silica/nano-silica composites (EMNC) with three different particle sizes in ${\mu}m$ and one particle size in nm were prepared and their tensile and flexural tests were carried out and the data was estimated by Weibull statistical analysis. The tensile strength of the neat epoxy was 82.8 MPa and those of the EMCs were larger than that of the neat epoxy, and they were much more advanced by the addition of 10 nm sized nano-silica to the EMCs. Flexural strength showed the same tendency of the tensile strength. As the micro-particle size decreased, tensile and flexural strength increased.

• Transactions on Electrical and Electronic Materials
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• v.18 no.4
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• pp.203-206
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• 2017

The effect of the content of microsilica and nanosilica continuously modified with hydroxy silane and epoxy-modified silicone in cycloaliphatic epoxy/microsilica/nanosilica composites (EMNCs) on the mechanical and water repellent properties was evaluated. Surface-modified micro- and nanosilica was well-mixed with a cycloaliphatic epoxy resin in the presence of polyester-modified polydimethylsiloxane (PEM-PDMS) as a dispersing agent using an ultrasonicator. Tensile and flexural tests were carried out using a universal testing machine (UTM). The water repellent property was evaluated by contact angle measurements of water on the composite surface. Tensile strength of the composite could be enhanced by 32.2% up to 91.4 MPa, and the flexural strength was raised to 122.0 MPa, which is 38.8% higher than that of neat epoxy. The contact angle of water on the composite was as high as $104.1^{\circ}$.

• Transactions on Electrical and Electronic Materials
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• v.12 no.3
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• pp.98-101
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• 2011

A 10 nm nano-silica was introduced to a conventional 3 ${\mu}M$ micro-silica composite to develop an eco-friendly new electric insulation material for heavy electric equipment. Thermal and mechanical properties, such as glass transition temperature (Tg), dynamic mechanical analysis, tensile and flexural strength, were studied. The mechanical results were estimated by comparing scale and shape parameters in Weibull statistical analysis. The thermal and mechanical properties of conventional epoxy/micro-silica composite were improved by the addition of nano-silica. This was due to the increment of the compaction via the even dispersion of the nano-silica among the micro-silica particles.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2004.10a
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• pp.96-99
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• 2004

Silica fillers were coated by plasma polymer coatings of 1,3-diaminopropane, allylamine, pyrrole, 1,2-epoxy-5-hexene, allyl mercaptan and allyl alcohol using RF plasma (13.56 MHz). The coated fillers were then mixed with biphenyl epoxy, phenol novolac (curing agent) and/or triphenylphosphine (catalyst), and subjected to DSC analyses in order to elucidate the chemical reaction between functional moieties in the plasma polymer coatings and the epoxy resin. Only the samples with 1,3-diaminopropane and allylamine plasma polymer coated silica fillers showed heat of reaction peaks when they were mixed with biphenyl epoxy resin only, while these samples as well as the samples with 1,3-diaminopropane, allylamine and pyrrole plasma polymer coated silica fillers exhibited heat of reaction peaks when mixed with both biphenyl epoxy and phenol novolac (curing agent).

• Transactions on Electrical and Electronic Materials
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• v.14 no.2
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• pp.101-104
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• 2013

The effect of the mixing ratio of spherical silica on the electrical insulation breakdown strength in an epoxy/silica composite was studied. Spherical silicas with two average particle sizes of $5{\mu}m$ and $20{\mu}m$ were mixed in different mixing ratios, and their total filling content was fixed at 60 wt%. In order to observe the dispersion of the silicas and the interfacial morphology between silica and epoxy matrix, scanning electron microscopy (SEM) was used. The electrical insulation breakdown strength was estimated in sphere-sphere electrodes with different insulation thicknesses of 1, 2, and 3 mm. Electrical insulation breakdown strength decreased with increasing mixing ratio of $5/20{\mu}m$ and the thickness dependence of the breakdown strength was also observed.

• Transactions on Electrical and Electronic Materials
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• v.13 no.6
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• pp.322-325
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• 2012

Crystalline silica was synthesized by annealing amorphous silica at $1,300^{\circ}C$ or $1,400^{\circ}C$ for various times, and the crystallinity was estimated by X-ray diffraction (XRD) analysis. In order to prepare a low dielectric material, epoxy/crystalline silica composites were prepared, and the effect of silica content on the dielectric properties was studied under various functions of frequency and ambient temperature. The dielectric constant decreased with increasing crystalline silica content in the epoxy composites, and it also decreased with increasing frequency. At 120 Hz, the value of 5 wt% silica decreased by 0.25 compared to that of 40 wt% silica, and at 23 kHz, the value of 5 wt% silica decreased by 0.23 compared to that of 40 wt% silica. The value increased with increasing ambient temperature.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.25 no.10
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• pp.779-785
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• 2012

The epoxy/micro-and nano-mixed silica composites(EMNC) systems were prepared and the AC insulation breakdown strength was evaluated. Glass transition temperature (Tg) and crosslink density were also measured by dynamic mechanical analyzer(DMA) in order to correlate them with the electrical and mechanical properties, and the effect of silane coupling agent on the electrical properties was also studied. Electrical properties and crosslink density of epoxy/micro-silica composite were noticeably improved by addition of nano-silica and silane coupling agent, and the highest breakdown strength was obtained by addition of 0.5~5 phr of nano-silica and 2.5 phr of silane coupling agent, and the highest tensile and flexural strength were obtained by addition of 2.5 phr of nano-silica.