1 |
P. Bajaj, N. K. Jha and A. Kumar, J. Appl. Polym. Sci., 56, 1339 (1995) [DOI: 10.1002/app.1995.070561015].
DOI
ScienceOn
|
2 |
Y. Xu, D. D. L. Chung and C. Mroz, Composites: Part A, 32, 1749 (2001) [DOI: http://dx.doi.org/10.1016/S1359-835X(01)00023-9].
DOI
ScienceOn
|
3 |
A. A. Wazzan, H. A. Al-Turaif and A. F. Abdelkader, Polymer-Plastics Technology and Engineering, 45, 1155 (2006) [DOI:10.1080/03602550600887285].
DOI
ScienceOn
|
4 |
R. Sarathi, R. K. Sahu and P. Rajeshkumar, Mater. Sci. Eng.: A, 445, 567 (2007) [DOI: 10.1016/j.msea.2006.09.077].
DOI
ScienceOn
|
5 |
N. Hayakawa, H. Maeda, S. Chigusa and H. Okubo, Cryogenics, 40, 167 (2000) [DOI: 10.1016/s0011-2275(00)00024-2].
DOI
ScienceOn
|
6 |
G. Iyer, R. S. Gorur, R. Richert, A. Krivda and L. E. Schmidt, IEEE Trans. Dielectr. Electr. Insul., 18, 659 (2011) [DOI: 10.1109/TDEI.2011.5931050].
DOI
ScienceOn
|
7 |
D. A. Bolon, IEEE Trans. Dielectr. Electr. Insul., 11, 10 (1995) [DOI: 10.1109/57.400759].
|
8 |
J. J. Park, K. G. Yoon and J. Y. Lee, Trans. Electr. Electron. Mater. 12, 98 (2011) [DOI: 10.4313/TEEM.2011.12.3.98].
DOI
ScienceOn
|
9 |
J. J. Park, S. S. Kwon and J. Y. Lee, Trans. Electr. Electron. Mater. 12, 135 (2011) [DOI: http://dx.doi.org/10.4313/TEEM.2011.12.4.135].
DOI
ScienceOn
|
10 |
T. Imai, F. Sawa, T. Ozaki, T. Shimizu, R. Kido, M. Kozako, and T. Tanaka, IEEE Trans. Dielectr. Electr. Insul., 13, 445 (2006) [DOI:10.1109/TDEI.2006.1624291].
DOI
ScienceOn
|
11 |
C. Zou, J.C. Fothergill and S. W. Rowe, IEEE Trans. Dielectr. Electr. Insul., 15, 106 (2008) [DOI: 10.1109/T-DEI.2008.4446741].
DOI
|
12 |
J. Castellon, H. N. Nguyen, S. Agnel, A. Toureille, M. Frechette, S. Savoie, A. Krivda and L. E. Schmidt, IEEE Trans. Dielectr. Electr. Insul., 18, 651 (2011) [DOI: 10.1109/TDEI.2011.5931049].
DOI
ScienceOn
|
13 |
T. Imai, F. Sawa, T. Ozaki, T. Shimizu, S. Kuge, M. Kozako, and Tanaka, IEEJ Trans. Fund. Mater., 126, 1136 (2006) [DOI: 10.1541/ieejfms.126.1136].
DOI
ScienceOn
|
14 |
Y. Chen, T. Imai, Y. Ohki, and T. Tanaka, IEEE Trans. Dielectr. Electric. Insul., 17, 1509 (2010) [DOI: 10.1109/TDEI.2010.5595552].
DOI
ScienceOn
|
15 |
J. J. Park and J. Y. Lee, IEEE Trans. Dielectr. Electr. Insul. 17, 1516 (2010) [DOI: 10.1109/TDEI.2010.5595553].
DOI
ScienceOn
|
16 |
J. J. Park, C. H. Lee, J. Y. Lee and H. D. Kim, IEEE Trans. Dielectr. Electr. Insul. 18, 667 (2011) [DOI: 10.1109/TDEI.2011.5931051].
DOI
ScienceOn
|
17 |
T. Imai, F. Sawa, T. Ozaki, T. Shimizu, R. Kido, M. Kozako and Tanaka, Proceedings of 2005 International Symposium on Electrical Insulating Materials, p.1136 (2006) [DOI: 10.1109/ISEIM.2005.193387].
|
18 |
C. Y. Hsieh and S. L. Chung, J. Appl. Polym. Sci., 102, 4734 (2006) [DOI: 10.1002/app.25000].
DOI
ScienceOn
|
19 |
P. O. Henk, T. W. Kortsen and T. Kvarts, High Perform. Polym., 11, 281 (1999) [DOI: 10.1088/0954-0083/11/3/304].
DOI
|
20 |
M. Ehsani, Z. Farhadinejad, S. Moemen-bellah, S. M. Bagheralavi, M. M. S. Shrazi and H. Borsi, 26th Internal Power System Conference, Tehran, Iran, 11-E-CAM-2359 (2011).
|