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Mechanical and Water Repellent Properties of Cycloaliphatic Epoxy/Microsilica/Nanosilica Composite

  • Park, Jae-Jun (Department of Electrical and Electronic Engineering, Joongbu University)
  • Received : 2016.12.23
  • Accepted : 2017.04.06
  • Published : 2017.08.25

Abstract

The effect of the content of microsilica and nanosilica continuously modified with hydroxy silane and epoxy-modified silicone in cycloaliphatic epoxy/microsilica/nanosilica composites (EMNCs) on the mechanical and water repellent properties was evaluated. Surface-modified micro- and nanosilica was well-mixed with a cycloaliphatic epoxy resin in the presence of polyester-modified polydimethylsiloxane (PEM-PDMS) as a dispersing agent using an ultrasonicator. Tensile and flexural tests were carried out using a universal testing machine (UTM). The water repellent property was evaluated by contact angle measurements of water on the composite surface. Tensile strength of the composite could be enhanced by 32.2% up to 91.4 MPa, and the flexural strength was raised to 122.0 MPa, which is 38.8% higher than that of neat epoxy. The contact angle of water on the composite was as high as $104.1^{\circ}$.

Keywords

References

  1. D. A. Bolon, IEEE Electr. Insul. Mag., 11, 10 (1995). [DOI: http://dx.doi.org/10.1109/57.400759]
  2. R. S. Gorur, E. A. Cherney, and J. T. Burnham, Outdoor Insulators (Ravi S Gorur Inc, Maricopa, 1999) p. 256.
  3. G. Iyer, R. S. Gorur, A. Krivda, and P. Mahonen, Proceedings of the 16th International Symposium on High Voltage Engineering (South African Institute of Electrical Engineers, Cape Town, 2009) Paper E-2.
  4. Y. S. Cho, H. K. Lee, M. J. Shim, and S. W. Kim, Mater. Chem. Phys., 66, 70 (2000). [DOI: http://dx.doi.org/10.1016/S0254-0584(00)00272-8]
  5. R. Sarathi, R. K. Sahu, and P. Rajeshkumar, Mater. Sci. Eng., A, 445, 567 (2007). [DOI: http://dx.doi.org/10.1016/j.msea.2006.09.077]
  6. R. Kultzow and S. Foxhill, 2007 Annual Meeting of the Thermoset Resin Formulators Association (Georgia, 2007) p. 11.
  7. D. Rosu, C. N. Cascaval, F. Mustata, and C. Ciobanu, Thermochim. Acta, 383, 119 (2002). [DOI: http://dx.doi.org/10.1016/S0040-6031(01)00672-4]
  8. J. Shen, W. Huang, L. Wu, Y. Hu, and M. Ye, Composites Part A: Applied Science and Manufacturing, 38, 1331 (2007). [DOI: http://dx.doi.org/10.1016/j.compositesa.2006.10.012]
  9. X. Kornmann, H. Lindberg, and L. A. Berglund, Polymer, 42, 4493 (2001). [DOI: http://dx.doi.org/10.1016/S0032-3861(00)00801-6]
  10. J. J. Park, Y. B. Park, and J. Y. Lee, Trans. Electr. Electron. Mater., 12, 93 (2011). [DOI : http://dx.doi.org/10.4313/TEEM.2011.12.3.93]
  11. J. J. Park, K. G. Yoon, and J. Y. Lee, Trans. Electr. Electron. Mater., 12, 98 (2011). [DOI : http://dx.doi.org/10.4313/TEEM.2011.12.3.98]
  12. J. J. Park, C. Y. Yoon, J. Y. Lee, J. H. Cheong, and G. B. Kang, Trans. Electr. Electron. Mater., 17, 155 (2016). [DOI: http://dx.doi.org/10.4313/TEEM.2016.17.3.155]