Transactions on Electrical and Electronic Materials

The Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회)
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Effect of Silica Particle Size on the Mechanical Properties in an Epoxy/Silica Composite for HV Insulation

  • Park, Jae-Jun (Department of Electrical and Electronic Engineering, Joongbu University)
  • Received : 2012.08.22
  • Accepted : 2012.09.05
  • Published : 2012.10.25
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Abstract

In order to develop a high voltage insulation material, epoxy/micro-silica composites (EMC) and epoxy/micro-silica/nano-silica composites (EMNC) with three different particle sizes in ${\mu}m$ and one particle size in nm were prepared and their tensile and flexural tests were carried out and the data was estimated by Weibull statistical analysis. The tensile strength of the neat epoxy was 82.8 MPa and those of the EMCs were larger than that of the neat epoxy, and they were much more advanced by the addition of 10 nm sized nano-silica to the EMCs. Flexural strength showed the same tendency of the tensile strength. As the micro-particle size decreased, tensile and flexural strength increased.

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