• 한국결정성장학회지
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• 제9권3호
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• pp.273-279
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• 1999

Si(001)을 기판으로 한 GaN 박막을 성장하기 위하여 hot wall epitaxy(HWE) 장치를 자체 제작하였다. HWE 장치를 이용하여 Si(001) 기판 위에 GaN 박막에 대한 상온에서의 광 발광(PL) 측정에서 GaN 초기층 성장온도가 $700^{\circ}C$ 보다 낮은 온도 조건에서 성장된 GaN 박막이 Zinc blende 구조와 Wurzite 구조가 혼합되어 성장되어지는 것으로 추측되며, $700^{\circ}C$ 이상의 온도에서는 성장된 GaN 박막이 주로 wurtzite 구조로 성장된다는 것을 알 수 있다. 그리고 x-선 회절 측정으로부터 성장한 GaN 박막이 Zinc blende와 Wurtzite의 두가지 구조가 혼합된 형태로 성장되었다는 것을 알 수 있었다. GaN 박막을 성장하기 위한 조건에서 초기층 성장조건은 증발부의 온도 $860^{\circ}C$와 기판부의 온도가 $720^{\circ}C$ 근처에서 4분동안 성장하였을 때 Wurtzite의 특성을 보이며, GaN 박막의 성장조건은 기판부의 온도 $1020^{\circ}C$, 증발부의 온도 $910^{\circ}C$에서 그리고 Ammonia gas의 유량을 120 sccm으로 하였을 때 보다 안정한 Wurtzite 구조특성을 보이게 되었다.

• 한국전기전자재료학회논문지
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• 제31권6호
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• pp.386-391
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• 2018

An epitaxial GaN layer was grown on a cone-shape-patterned sapphire substrate (PSS) (Sample A) and an AlN-buffered PSS (Sample B) with two growth steps under the same process conditions by employing the hydride vapor phase epitaxy (HVPE) method. We have investigated the characteristics of the GaN layer grown on two kinds of substrates at each growth step. The cross-sectional SEM image of the GaN layer grown on the two types of substrates showed growth states of GaN layers formed during the 1st and 2nd growth steps with different growth durations. Dislocation density was obtained by calculation using the FWHM value of the rocking curve for (002) and (102). Sample A showed 2.62+08E and 6.66+08E and sample B exhibited 5.74+07E and 1.65+08E for two different planes. The red shift was observed is photoluminescence (PL) analysis and Raman spectroscopy results. GaN layers grown on AlN-buffered PSS exhibited better optical and crystallographic properties than GaN layers grown on PSS.

• 한국자기학회지
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• 제8권6호
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• pp.369-373
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• 1998

본 연구에서는 마그네트론 스퍼터링 법으로 제작한 Ni-Fe/NiO 이층 박에서, NiO 증착 중 Ar 압력에 따른 교환이 방성의 변화를 고찰하엿으며 이를 미세조작과 관련시켜 해석하고자 하였다. 낮은 Ar 압력에서 증착한 Ni-Fe/NiO 이층막은 우수한 교환이방성 특성을 나타내었으나 Ar 압력이 증가함에 따라 교환이방성은 급격하게 감소하였다. 낮은 Ar 압력에서 증착한 시편은 NiO와 Ni-Fe 계면에서 epitaxy 경향을 나타내었으며 그 계면은 평범하고 그 경계는 두렷하게 구분하였다. 그러나 높은 Ar 압력에서 증착한 시편은 NiO와 Ni-Fe의 경계가 뚜렷하게 구분되지 않고 그 계면 또한 평활하지 않았다. 한편 NiO의 조성은 Ar압력의 증가에 따라 산소의 조성이 점점 증가하였다.

• 한국전기전자재료학회논문지
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• 제35권6호
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• pp.603-609
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• 2022

Passivation quality is mainly governed by epitaxial growth of crystalline silicon wafer surface. Void-rich intrinsic a-Si:H interfacial layer could offer higher resistivity of the c-Si surface and hence a better device efficiency as well. To reduce the resistivity of the contact area, a modification of void-rich intrinsic layer of a-Si:H towards more ordered state with a higher density is adopted by adapting its thickness and reducing its series resistance significantly, but it slightly decreases passivation quality. Higher resistance is not dominated by asymmetric effects like different band offsets for electrons or holes. In this study, multilayer of intrinsic a-Si:H layers were used. The first one with a void-rich was a-Si:H(I₁) and the next one a-SiO_x:H(I₂) were used, where a-SiO_x:H(I₂) had relatively larger band gap of ~2.07 eV than that of a-Si:H (I₁). Using a-SiO_x:H as I₂ layer was expected to increase transparency, which could lead to an easy carrier transport. Also, higher implied voltage than the conventional structure was expected. This means that the a-SiO_x:H could be a promising material for a high-quality passivation of c-Si. In addition, the i-a-SiO_x:H microstructure can help the carrier transportation through tunneling and thermal emission.

• 한국전기전자재료학회논문지
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• 제34권4호
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• pp.251-255
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• 2021

a-Si is commonly considered as a primary candidate for the formation of passivation layer in heterojunction (HIT) solar cells. However, there are some problems when using this material such as significant losses due to recombination and parasitic absorption. To reduce these problems, a wide bandgap material is needed. A wide bandgap has a positive influence on effective transmittance, reduction of the parasitic absorption, and prevention of unnecessary epitaxial growth. In this paper, the adoption of a-SiO_x:H as the intrinsic layer was discussed. To increase lifetime and conductivity, oxygen concentration control is crucial because it is correlated with the thickness, bonding defect, interface density (D_it), and band offset. A thick oxygen-rich layer causes the lifetime and the implied open-circuit voltage to drop. Furthermore the thicker the layer gets, the more free hydrogen atoms are etched in thin films, which worsens the passivation quality and the efficiency of solar cells. Previous studies revealed that the lifetime and the implied voltage decreased when the a-SiOx thickness went beyond around 9 nm. In addition to this, oxygen acted as a defect in the intrinsic layer. The D_it increased up to an oxygen rate on the order of 8%. Beyond 8%, the D_it was constant. By controlling the oxygen concentration properly and achieving a thin layer, high-efficiency HIT solar cells can be fabricated.

• 전자공학회논문지A
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• 제33A권2호
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• pp.96-113
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• 1996

고농도로 붕소가 도핑된 실리콘층 내에 존재하는 부정합 전위는 웨이퍼 가장자리에서 발생됨을 알았으며, 이 층을 도핑되지 않은 영역으로 둘러쌓음으로써 부정합 전위가 억제된 고농도로 붕소가 도핑된 실리콘층을 형성할 수 있었다. 이를 이용하여 부정합 전위가 없는 고농도로 붕소가 도핑된 실리콘 멤브레인을 제작하였으며, 이 멤브레인의 표면 거칠기 및 파괴 강도 그리고 잔류 인장 응력을 각각 20$\AA$ 1.39${\times}10^{10}dyn/cm^{2}$ 그리고 2.7${\times}10^{9}dyn/cm^{2}$로 측정되었다. 반면에 부정합 전위를 포함하는 기존 멤브레인은 각각 500$\AA$ 8.27${\times}10^{9}dyn/cm^{2}$ 그리고 9.3${\times}10^{8}dyn/cm^{2}$로 측정되었으며, 두 멤브레인의 이러한 차이는 부정합 전위에서 기인함을 알았다. 측정된 두 멤브레인의 Young's 모듈러스는 1.45${\times}10^{12}dyn/cm^{2}$로 동일하게 나타났다. 또, 도핑 농도 1.3${\times}10^{12}dyn/cm^{3}$에 대한 고농도로 붕소가 도핑된 실리콘의 유효 격자 상수 및 기존 멤브레인의 평면적 격자 상수 그리고 기존 멤브레인 내의 부정합 전위의 밀도는 각각 5.424$\AA$ 5.426$\AA$ 그리고 2.3${\times}10^{4}$/cm 로 추출되었으며, 붕소가 도핑된 실리콘의 부정합 계수는 1.04${\times}10^{23}$/atom으로 추출되었다. 한편 별도의 추가적인 공정없이 일반적인 에피 성장법을 사용하여 고농도로 붕소가 도핑된 실리콘층 위에 부정합 전위가 없는 에피 실리콘을 성장시켰으며, 이 에피 실리콘의 결정성은 매우 양호한 것으로 밝혀졌다. 또 부정합 전위가 없는 에피 실리콘에 n+/p 게이트 다이오드를 제작하고 그 전압-전류 특성을 측정한 결과 5V의 역 바이어스에서 0.6nA/$cm^{2}$의 작은 누설 전류값을 나타내었다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2010년도 춘계학술회의 초록집
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• pp.16-16
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• 2010

GaN-based light-emitting diodes (LEDs) are attracting great interest as candidates for next-generation solid-state lighting, because of their long lifetime, small size, high efficacy, and low energy consumption. However, for general illumination applications, the external quantum efficiency of LEDs, determined by the internal quantum efficiency (IQE) and the light extraction efficiency, must be further increased. The IQE is determined by crystal quality and epitaxial layer structure and high value of IQE more than 70% for blue LEDs have been already reported. However, there is much room for improvement of light extraction efficiency because most of the generated photons from active layer remain inside LEDs by total internal reflection at the interface of semiconductor with air due to the high refractive index difference between LEDs epilayer (for GaN, n=2.5) and air (n=1). The light confining in LEDs will be reabsorbed by the metal electrode or active layer, reducing the efficacy of LEDs. Here, we present the first demonstration of enhanced light extraction by forming a MgO nano-pyramids structure on the surface of vertical-LEDs. The MgO nano-pyramids structure was successfully fabricated at room temperature using conventional electron-beam evaporation without any additional process. The nano-sized pyramids of MgO are formed on the surface during growth due to anisotropic characteristics between (111) and (200) plane of MgO. The ZnO layer with quarter-wavelength in thickness is inserted between GaN and MgO layers to increase the critical angle for total internal reflection, because the refractive index of ZnO (n=1.94) could be matched between GaN (n=2.5) and MgO (n=1.73). The MgO nano-pyramids structure and ZnO refractive-index modulation layer enhanced the light extraction efficiency ofV-LEDs with by 49%, comparing with the V-LEDs with a flat n-GaN surface. The angular-dependent emission intensity shows the enhanced light extraction through the side walls of V-LEDs as well as through the top surface of the n-GaN, because of the increase in critical angle for total internal reflection as well as light scattering at the MgO nano-pyramids surface.

• 한국자기학회지
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• 제17권4호
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• pp.162-165
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• 2007

본 연구에서는 CoFeB/MgO/CoFeB 구조를 가지는 자기터널접합에서 capping층 재료의 종류와 열처리 시간에 따른 비정질 top CoFeB 자성층의 결정화 상태 및 자기터널접합의 자기적 특성 변화에 대한 연구결과를 비교 분석 하였다. Hcp(Hexagonal close-packed)의 결정구조를 가지는 Ru(002)를 capping층 재료로 사용한 자기터널접합 박막의 경우에는 열처리 이후 Ru과 인접한 부분의 top CoFeB이 bcc-CoFe(110)로 성장하는 반면, TiAl과 ZrAl을 capping층 재료로 사용한 자기터널접합의 경우는 열처리 이후 top CoFeB이 MgO와 epitaxial하게 bcc-CoFe(002)로 결정성장 하였다. 이로 인해 Ru을 사용한 자기터널접합의 터널자기 저항비(46.7%)보다 약 1.5배 높은 터널자기저항비(TiAl: 71.8%, ZrAl: 72.7%)를 나타내었다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2009년도 제38회 동계학술대회 초록집
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• pp.173-173
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• 2010

Recently, a patterned sapphire substrate (PSS) has been intensively used as one of the effective ways to reduce the dislocation density for the III-nitride epitaxial layers aiming for the application of high-performance, especially high-brightness, light-emitting diodes (LEDs). In this paper, we analyze the growth kinetics of the atoms and crystalline quality for the undopped-GaN depending on the facets of the pattern fabricated on a sapphire substrate. The effects of the PSS on the device characteristics of InGaN/GaN LEDs were also investigated. Several GaN samples were grown on the PSS under the different growth conditions. And the undoped-GaN layer was grown on a planar sapphire substrate as a reference. For the (002) plane of the undoped-GaN layer, as an example, the line-width broadening of the x-ray diffraction (XRD) spectrum on a planar sapphire substrate is 216.0 arcsec which is significantly narrower than that of 277.2 arcsec for the PSS. However, the line-width broadening for the (102) plane on the planar sapphire substrate (363.6 arcsec) is larger than that for the PSS (309.6 arcsec). Even though the growth parameters such as growth temperature, growth time, and pressure were systematically changed, this kind of trend in the line-width broadening of XRD spectrum was similar. The emission wavelength of the undoped-GaN layer on the PSS was red-shifted by 5.7 nm from that of the conventional LEDs (364.1 nm) under the same growth conditions. In addition, the intensity for the GaN layer on the PSS was three times larger than that of the planar case. The spatial variation in the emission wavelength of the undoped-GaN layer on the PSS was statistically ${\pm}0.5\;nm$ obtained from the photoluminescence mapping results throughout the whole wafer. These results will be discussed in terms of the mixed dislocation depending on the facets and the period of the patterns.

• ETRI Journal
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• 제27권5호
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• pp.569-578
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• 2005

The purpose of this paper is to describe the implementation of monolithically matching circuits, interface circuits, and RF core circuits to the same substrate. We designed and fabricated on-chip 1 to 6 GHz up-conversion and 1 to 8 GHz down-conversion mixers using a 0.8 mm SiGe hetero-junction bipolar transistor (HBT) process technology. To fabricate a SiGe HBT, we used a reduced pressure chemical vapor deposition (RPCVD) system to grow a base epitaxial layer, and we adopted local oxidation of silicon (LOCOS) isolation to separate the device terminals. An up-conversion mixer was implemented on-chip using an intermediate frequency (IF) matching circuit, local oscillator (LO)/radio frequency (RF) wideband matching circuits, LO/IF input balun circuits, and an RF output balun circuit. The measured results of the fabricated up-conversion mixer show a positive power conversion gain from 1 to 6 GHz and a bandwidth of about 4.5 GHz. Also, the down-conversion mixer was implemented on-chip using LO/RF wideband matching circuits, LO/RF input balun circuits, and an IF output balun circuit. The measured results of the fabricated down-conversion mixer show a positive power conversion gain from 1 to 8 GHz and a bandwidth of about 4.5 GHz.