• 한국자기학회지
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• 제3권3호
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• pp.215-220
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• 1993

RF/DC 스퍼터된 $Co_{69.0}Ni_{18.5}Cr_{12.5}/Cr$ 이중박막의 미세구조와 자기적 성질과의 관계를 조사하였다. Cr 하지층과 CoNiCr 자성층의 두께는 각각 50-200 nm와 10-50 nm였으며, 기판 의 온도는 $100-200^{\circ}C$로 하였다. 기판의 온도, Cr 하지층 두께가 증가함에 따라 결정립은 미세해졌으며 보자력은 증가하였다. 기판의 온도가 $100^{\circ}C$에서 $200^{\circ}C$로 증가함에 따라 Cr(200), CoNiCr(1120) 결정방위가 강하게 나타났다. CoNiCr/Cr 이중박막의 보자력은 CoNiCr(1120) 결정방위 증가와 결정립의 미세 화에 따라 증가한다. 높은 보자력을 나타내는 박막에서 Cr 하지층위에 자성층의 epitaxial growth를 확인하였다.

• International Journal of Internet, Broadcasting and Communication
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• 제12권2호
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• pp.30-36
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• 2020

We demonstrated a successful fabrication of 4" Gallium Nitride (GaN)/Diamond High Electron Mobility Transistors (HEMTs) incorporated with Inner Slot Via Hole process. We made in manufacturing technology of 4" GaN/Diamond HEMT wafers in a compound semiconductor foundry since reported [1]. Wafer thickness uniformity and wafer flatness of starting GaN/Diamond wafers have improved greatly, which contributed to improved processing yield. By optimizing Laser drilling techniques, we successfully demonstrated a through-substrate-via process, which is last hurdle in GaN/Diamond manufacturing technology. To fully exploit Diamond's superior thermal property for GaN HEMT devices, we include Aluminum Nitride (AlN) barrier in epitaxial layer structure, in addition to conventional Aluminum Gallium Nitride (AlGaN) barrier layer. The current collapse revealed very stable up to Vds = 90 V. The trapping behaviors were measured Emission Microscope (EMMI). The traps are located in interface between Silicon Nitride (SiN) passivation layer and GaN cap layer.

• 한국진공학회:학술대회논문집
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• 한국진공학회 1998년도 제14회 학술발표회 논문개요집
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• pp.41-41
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• 1998

Rare earth metal films have been used as a buffer layer for growing ferroelectric t thin film or a seed layer for magnetic multilayer. But when it was deposited on s semiconductor substrates for the application of magneto-optic (MO) storage media, it i is difficult to exactly measure magnetic cons떠nts due to shunting current, and so it n needs to grow metal films on insulator substrate to reduce such effect. Recently, it w was reported that ultra-thin Pt layer were epitaxially grown on A12O:J by ion beam s sputtering in 비떠 high vacuum and it can be used as a seed layer for the growth of C Co-contained magnetic multilayer. In this stu$\phi$, Pt thin film were epi떠xially grown on AI2D3 ($\alpha$)OJ) by RF magnetron s sputtering. The crystalline structure was analyzed by transmission electron microscope ( (TEM) and Rutherford Back Scattering (RBS)/Ion Channeling. In TEM study, Pt was b believed to be twinned on AI잉3($\alpha$)01) su$\pi$ace about Pt(ll1) plane.Moreover, RBS c channeling spectra showed that minimum scattering yield of Pt(111)/AI2O:J(1$\alpha$)OJ) was 4 4% and Pt(11J)/AI2D3($\alpha$)OJ) had 3-fold symmetry.

• 전기전자학회논문지
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• 제22권4호
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• pp.1226-1229
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• 2018

본 연구에서는 이온주입 된 4H-탄화규소(SiC) 에피 층 위에 환원된 그래핀 산화물 (r-GO)을 보호 층으로 적용하여 고온 열처리 공정 중 발생하는 표면 거칠기 악화를 개선하였다. 실험에 사용 된 4H-SiC 에피 층은 $4^{\circ}$ off-axis n-형 4H-SiC 기판 위에 $10{\mu}m$ 두께로 성장되었다. $n^+$-형 4H-SiC 층을 제공하기 위해 $1.73{\times}10^{15}cm^{-2}$ 농도의 질소를 고온 고에너지 이온주입 공정으로 주입하였고, 보호 층으로 사용한 r-GO는 스프레이 코팅 방식으로 4H-SiC 층 위에 형성하였다. r-GO를 보호 층으로 적용 한 결과, 적용하지 않은 시료에 비해 고온 열처리 후 표면 거칠기 (RMS)가 10배 개선되었으며, 전기적 측정으로 추출한 누설 전류를 통해 표면 거칠기 개선으로 표면 상태가 완화되었음을 확인하였다.

• 한국결정성장학회지
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• 제7권2호
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• pp.271-275
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• 1997

HWE방법으로 GaAs 기관위에 Cl이 첨가된 ZnSe 박막을 성장하였다. 성장된 박막의 표면 상태는 경면이 있었으며 좋은 결정성과 낮은 비저항 n 형 전도성을 나타내었다. 성장된 박막의 운반자 농도는 $10^{16}Cm{-3}$ 정도였으며 비저항값은 10$\\Omega$\cdotcm였다. 실온에서 청색 발광을 하는 photoluminescence를 나타내었다. 나타내었다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 추계학술대회 논문집 Vol.21
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• pp.52-54
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• 2008

The authors investigated the InGaN/GaN multi-quantum well blue light emitting diodes with the implements of the photonic crystals fabricated at the top surface of p-GaN layer or the bottom interface of n-GaN layer. The top photonic crystals result in the lattice-dependent photoluminescence spectra for the blue light emitting diodes, which have a wavelength of 450nm. However, the bottom photonic crystal shows a big shift of the photoluminescence peak from 444 nm to 504 nm and played as a role of quality enhancement for the crystal growth of GaN thin film. The micro-Raman spectroscopy shows the improved epitaxial quality of GaN thin film.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 추계학술대회 논문집 Vol.14 No.1
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• pp.77-80
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• 2001

Crystallographic and magnetic characteristics of CoCr-based magnetic thin film for perpendicular magnetic recording media were influenced on preparing conditions. In these, there is that substrate temperature was parameter that increases perpendicular coercivity of CoCrTa magnetic layer using recording layer. While preparation of CoCr-based doublelayer, by optimizing substrate temperature, we expect to increase perpendicular anisotropy of CoCr magnetic layer and prepare ferromagnetic recording layer with a good quality by epitaxial growth. CoCrTa/Si doublelayer showed a good dispersion angle of c-axis orientation $\Delta\theta_{50}$ caused by inserting amorphous Si underlayer which prepared at underlayer substrate temperature 250C. Perpendicular coercivity was constant, in-plane coercivity was controlled a low value about 200Oe. This result implied that Si underlayer could restrain growth of initial layer of CoCrTa thin film, which showed bad magnetic properties effectively without participating magnetization patterns of magnetic layer. In case of CoCrTa/Si that prepared with ultra thin underlayer, crystalline orientation of CoCrTa was improved rather underlayer thickness 1nm, it was expected that amorphous Si layer played a important role in not only underlayer but also seed layer.

• 한국결정성장학회지
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• 제24권3호
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• pp.89-93
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• 2014

V/III족 ratio의 변화에 따른 r-plane의 sapphire 위에 HVPE로 성장한 a-plane GaN 에피텍셜층의 특성변화를 연구하였다. V/III족 ratio가 증가함에 따라서, a-plane (11-20) GaN에 대한 Rocking Curve의 FWHM의 값이 감소하며, 성장된 GaN의 표면 거칠기도 감소하고, 성장성도는 증가하다가 V/III족 ratio 7까지는 증가하다가 다시 감소하는 경향을 보여준다. 즉 V/III족 ratio 10에서 a-plane (11-20) GaN에 대한 Rocking Curve의 FWHM의 가장 작은 829 arcsec값을 보이고, 표면거칠기도 가장 작은 1.58 nm 값을 보인다. 또한 광학현미경상에서 관찰되는 내부 Crack 또는 void가 가장 적게 발생하였다. 그리고 M모양의 Azimuth angle 의존도를 전 샘플에서 보이며, V/III족 ratio 10에서 FWHM 최대값과 최소값의 편차값이 439 arcscec로 가장 작은 차이를 보였다.

• 한국재료학회지
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• 제19권7호
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• pp.356-361
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• 2009

The optical characterization of self-assembled InAs/AlAs Quantum Dots(QD) grown by MBE(Molecular Beam Epitaxy) was investigated by using Photoluminescence(PL) spectroscopy. The influence of thin AlAs barrier on QDs were carried out by utilizing a pumping beam that has lower energy than that of the AlAs barrier. This provides the evidence for the tunneling of carriers from the GaAs layer, which results in a strong QD intensity compared to the GaAs at the 16 K PL spectrum. The presence of two QDs signals were found to be associated with the ground-states transitions from QDs with a bimodal size distribution made by the excitation power-dependent PL. From the temperature-dependent PL, the rapid red shift of the peak emission that was related to the QD2 from the increasing temperature was attributed to the coherence between the QDs of bimodal size distribution. A red shift of the PL peak of QDs emission and the reduction of the FWHM(Full Width at Half Maximum) were observed when the annealing temperatures ranged from 500 $^{\circ}C$ to 750 $^{\circ}C$, which indicates that the interdiffusion between the dots and the capping layer was caused by an improvement in the uniformity size of the QDs.

• 한국재료학회지
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• 제24권12호
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• pp.645-651
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• 2014

GaN is most commonly used to make LED elements. But, due to differences of the thermal expansion coefficient and lattice mismatch with sapphire, dislocations have occurred at about $109{\sim}1010/cm^2$. Generally, a low temperature GaN buffer layer is used between the GaN layer and the sapphire substrate in order to reduce the dislocation density and improve the characteristics of the thin film, and thus to increase the efficiency of the LED. Further, patterned sapphire substrate (PSS) are applied to improve the light extraction efficiency. In this experiment, using an AlN buffer layer on PSS in place of the GaN buffer layer that is used mainly to improve the properties of the GaN film, light extraction efficiency and overall properties of the thin film are improved at the same time. The AlN buffer layer was deposited by using a sputter and the AlN buffer layer thickness was determined to be 25 nm through XRD analysis after growing the GaN film at $1070^{\circ}C$ on the AlN buffer CPSS (C-plane Patterned Sapphire Substrate, AlN buffer 25 nm, 100 nm, 200 nm, 300 nm). The GaN film layer formed by applying a 2 step epitaxial lateral overgrowth (ELOG) process, and by changing temperatures ($1020{\sim}1070^{\circ}C$) and pressures (85~300 Torr). To confirm the surface morphology, we used SEM, AFM, and optical microscopy. To analyze the properties (dislocation density and crystallinity) of a thin film, we used HR-XRD and Cathodoluminescence.